ManufacturerSeriesPart StatusProcessTypeFlux TypeCompositionWire GaugeDiameterCore SizeFormMelting PointShelf Life
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Series
Part Status
Process
Type
Flux Type
Composition
Wire Gauge
Diameter
Core Size
Form
Melting Point
Shelf Life
IL 3CZF AR
IL 3CZF AR
1+18.7353
5+18.3647
10+17.6147
25+14.9918
50+13.4924
Increments of 1
Leadtime
2 3 weeks		Multicore63 37 CRYSL 502 3% .015DIA 28SWGC502ActiveLeadedWire SolderNo CleanSn63Pb37 63 37 26 AWG, 27 SWG0.015 0.39mm 0.033Spool, 227g 1 2 lb 361°F 183°C No Shelf Life
VWZNQ PI CG6
VWZNQ PI CG6
20+23.9681
Increments of 20
Leadtime
2 3 weeks		MulticoreSAV1 366 5C 0.81MM 0.5KG AM*Active
0B-N6-B6
0B-N6-B6
1+40.5686
5+38.8804
10+32.1176
25+28.7373
50+27.0469
Increments of 1
Leadtime
2-3 weeks		Kester SolderSOLDER RA 16AWG 63 37 1LB44ActiveLeadedWire SolderRosin Activated RA Sn63Pb37 63 37 14 AWG, 16 SWG0.062 1.57mm 0.033Spool, 454g 1 lb 361°F 183°C 36 Months Date of Manufacture
SR2K-Q1E-9C
SR2K-Q1E-9C
1+18.6176
5+18.2431
10+17.499
25+14.8925
50+13.4033
Increments of 1
Leadtime
2-3 weeks		Multicore63 37 400 2% .015DIA 28SWGC400ActiveLeadedWire SolderNo-CleanSn63Pb37 63 37 26 AWG, 27 SWG0.015 0.39mm 0.022Spool, 227g 1 2 lb 361°F 183°C No Shelf Life
F6WX-PB-IF
F6WX-PB-IF
1+30.8627
5+30.2294
10+27.7098
25+22.6714
50+21.412
Increments of 1
Leadtime
2-3 weeks		Multicore63 37 400 1% .064DIA 16SWGC400ActiveLeadedWire SolderNo-CleanSn63Pb37 63 37 14 AWG, 16 SWG0.064 1.63mm 0.011Spool, 454g 1 lb 361°F 183°C No Shelf Life
9HR50-TN-4G
9HR50-TN-4G
1+44.8333
5+42.9667
10+35.4951
25+31.7584
50+29.8904
Increments of 1
Leadtime
2-3 weeks		Kester SolderSOLDER RA 19AWG 63 37 1LB44ActiveLeadedWire SolderRosin Activated RA Sn63Pb37 63 37 18 AWG, 19 SWG0.04 1.02mm 0.033Spool, 454g 1 lb 361°F 183°C 36 Months Date of Manufacture
W5Q9 7SGH CN3
W5Q9 7SGH CN3
1+33.3039
Increments of 1
Leadtime
2 3 weeks		Multicore99C BAR SOLDER 2LB ObsoleteLead FreeBar Solder Sn99.3Cu0.7 99.3 0.7 Bar, 907g 2 lb 440°F 227°C No Shelf Life
XC5N-LWKP-FDL
XC5N-LWKP-FDL
1+33.5294
5+32.8471
10+30.1098
25+24.6353
50+23.2667
Increments of 1
Leadtime
2-3 weeks		MG ChemicalsSOLDER LF SAC305 NO CLEAN*Active----------
L390M-HN1-X7
L390M-HN1-X7
1+47.9314
5+45.9353
10+37.9461
Increments of 1
Leadtime
2-3 weeks		Kester SolderSOLDER 63 37 18AWG 1LB275ActiveLeadedWire SolderNo-CleanSn63Pb37 63 37 16 AWG, 18 SWG0.05 1.27mm 0.011Spool, 454g 1 lb 361°F 183°C 36 Months Date of Manufacture
C19D-042-CM
C19D-042-CM
25+30.1333
Increments of 25
Leadtime
2-3 weeks		Kester SolderSOLDER SOLID WIRE 16AWG 60 40-ActiveLeadedWire Solder-Sn60Pb40 60 40 14 AWG, 16 SWG0.062 1.57mm -Spool, 454g 1 lb --
SQK-59A-KV
SQK-59A-KV
1+6.37255
Increments of 1
Leadtime
2-3 weeks		Aven ToolsSOLDER 1MM 100G-ActiveLeadedWire SolderRosin Activated RA Sn60Pb40 60 40 18 AWG, 19 SWG0.039 0.99mm -Spool, 100g 3.5 oz 360°F 180°C 5 Years Date of Manufacture
6QNNE-BX-6DX
6QNNE-BX-6DX
20+55.8191
Increments of 20
Leadtime
2 3 weeks		Multicore96SC C511 5C 0.81MM 0.5KG AMC511™Active No Shelf Life
B5NGF-VDVZ-PAV
B5NGF-VDVZ-PAV
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER SPHERES SAC305 .030 DIAM*Active000000000-
VZ 9A7 8S
VZ 9A7 8S
1+101.912
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SOLDER PASTE SAC305 250G T5 ActiveLead FreeSolder PasteWater SolubleSn96.5Ag3.0Cu0.5 96.5 3 0.5 Jar, 250g 9 oz 423 ~ 428°F 217 ~ 220°C 6 Months Date of Manufacture Refrigerated
5XEV R2 JAW
5XEV R2 JAW
10+66.8284
Increments of 10
Leadtime
2 3 weeks		Multicore63S4 MP218 ACP89V PASTEMP218ActiveLeadedSolder PasteNo Clean 6 Months Date of Manufacture Refrigerated
PPE-ZAWJ-TUO
PPE-ZAWJ-TUO
25+55.0431
Increments of 25
Leadtime
2-3 weeks		Kester SolderSOLDER 66 .020 25AWG 1LB331ActiveLead FreeWire SolderWater SolubleSn99.3Cu0.7 99.3 0.7 24 AWG, 25 SWG0.02 0.51mm 0.033Spool, 454g 1 lb 440°F 227°C 36 Months Date of Manufacture
N8M7-EW7-2R
N8M7-EW7-2R
25+81.9267
Increments of 25
Leadtime
2-3 weeks		Kester SolderSOLDER 58 .015 28AWG 1LB275ActiveLead FreeWire SolderNo-CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 28 AWG, 30 SWG0.015 0.39mm 0.022Spool, 454g 1 lb 423 ~ 428°F 217 ~ 220°C 36 Months Date of Manufacture
VFZT-WDA4-CSB
VFZT-WDA4-CSB
1+38.1863
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SLD PASTE LF WATER SOL T5 10CC ActiveLead FreeSolder PasteWater SolubleSn96.5Ag3.0Cu0.5 96.5 3 0.5 Syringe, 10cc, 35g 1.2 oz 423 ~ 428°F 217 ~ 220°C 6 Months Date of Manufacture Refrigerated
9IDU-JIZ-OS
9IDU-JIZ-OS
1+81.6176
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER PASTE 63 37 T3 500G-ActiveLeadedSolder PasteWater SolubleSn63Pb37 63 37 ----361°F 183°C 12 Months Date of Manufacture Refrigerated
BZ2 WUHU YP
BZ2 WUHU YP
20+28.6029
Increments of 20
Leadtime
2 3 weeks		Multicore60 40 C511 5C 1.22MM 0.5KG.048 *Active
LAQM 9U7U GK
LAQM 9U7U GK
Leadtime
2 3 weeks		Kester SolderSOLDER SOLID WIRE 21AWG 60 40 ObsoleteLeadedWire Solder Sn60Pb40 60 40 20 AWG, 21 SWG0.031 0.79mm Spool, 454g 1 lb
C8-W19U-SY
C8-W19U-SY
1+14.6961
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER PASTE NO-CLEAN 63 37 5CC-ActiveLeadedSolder PasteNo-CleanSn63Pb37 63 37 ---Syringe, 5cc, 15g 0.5 oz 361°F 183°C 12 Months Date of Manufacture Refrigerated
X8IEW GQV HK
X8IEW GQV HK
1+4.55882
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SOLDER WIRE NO CLEAN 63 37 1OZ. ActiveLeadedWire SolderNo Clean, Water SolubleSn63Pb37 63 37 20 AWG, 21 SWG0.031 0.79mm 0.022Spool, 28g 1 oz 361°F 183°C
HSH67-DW-JSU
HSH67-DW-JSU
1+67.4804
5+60.3039
10+48.8167
25+45.9451
50+43.0735
Increments of 1
Leadtime
2 3 weeks		Multicore97SC 400 2% .064DIA 16SWGC400ActiveLead FreeWire SolderNo CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 14 AWG, 16 SWG0.064 1.63mm 0.022Spool, 227g 1 2 lb 423 ~ 428°F 217 ~ 220°C No Shelf Life
5F-U8Q-855
5F-U8Q-855
Leadtime
2-3 weeks		MG ChemicalsSOLDER 63 37 NOCLEAN .05DIA .5LB4860ObsoleteLeadedWire SolderNo-CleanSn63Pb37 63 37 18 AWG, 19 SWG0.05 1.27mm 0.022Spool, 227g 1 2 lb 361°F 183°C No Shelf Life