Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TNP-JG-QWY![]() | TNP-JG-QWY |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE SN63 PB37 250G | Active | Leaded | Solder Paste | No Clean | Sn63Pb37 63 37 | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||||||
TQ-2RX-U3L![]() | TQ-2RX-U3L |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE NO-CLEAN 10CC SYR | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
PISZU-BN-F5![]() | PISZU-BN-F5 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 66 .020 25AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
9W7-3S0-0M![]() | 9W7-3S0-0M |
| Leadtime 2-3 weeks | Multicore | 99C C511 3C 0.81MM 0.5KG AM | C511™ | Active | - | - | - | - | - | - | - | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
AQKQZ-8M-UCV![]() | AQKQZ-8M-UCV |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 66 .020 25AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
0O-6W-M4Z![]() | 0O-6W-M4Z |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE NO CLEAN 10CC SYR | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
3U-OU3F-BJ![]() | 3U-OU3F-BJ | Leadtime 2-3 weeks | Kester Solder | SOLDER RA FLUX 28AWG 63 37 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
QC-1M-MR![]() | QC-1M-MR |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 60 40 .040 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
1DP-6CP-YZ![]() | 1DP-6CP-YZ |
| Leadtime 2-3 weeks | Kester Solder | SOLDER NO-CLEAN .062 16AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
R7-NFV-5MO![]() | R7-NFV-5MO |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SAC305 250G T3 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
XCS-HW-R1![]() | XCS-HW-R1 | Leadtime 2-3 weeks | Easy Braid Co. | SOLDER NO-CLEAN ANTISTAT .020 | - | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | - | 361°F 183°C | No Shelf Life | |||||||||||||||
MY5-YASW-I5E![]() | MY5-YASW-I5E |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 63 37 11AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.125 3.18mm | - | - | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
GZ-OFC-01![]() | GZ-OFC-01 |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN99 21GAUGE 1LBS | 4901 | Active | Lead Free | Wire Solder | No-Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Spool, 454g 1 lb | 440°F 227°C | No Shelf Life | ||||||||||||||
PK9L-0SF-9ZE![]() | PK9L-0SF-9ZE |
| Leadtime 2-3 weeks | Kester Solder | SOLDER WATER SOL 28AWG 63 37 1LB | 331 | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
UKT6-AD3H-VE![]() | UKT6-AD3H-VE |
| Leadtime 2 3 weeks | Multicore | SOLDER PASTE HF 212 600GRAM JA | HF212 | Active | No Shelf Life | |||||||||||||||||||||||
9YC-37HA-YAX![]() | 9YC-37HA-YAX |
| Leadtime 2-3 weeks | Multicore | 99C C511 3C 0.81MM 0.5KG AM | C511™ | Active | - | - | - | - | - | - | - | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
Q7-PCCR-QMK![]() | Q7-PCCR-QMK |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
IRY-HMZY-E27![]() | IRY-HMZY-E27 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 66 .020 25AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
3A-G53-Q0V![]() | 3A-G53-Q0V |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE SAC305 T4 500G | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||||
AA-Q7AB-VF![]() | AA-Q7AB-VF |
| Leadtime 2 3 weeks | Multicore | 63 37 CRYSL 502 3% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
3VJ-LC5X-ISA![]() | 3VJ-LC5X-ISA |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES 63 37 .025 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 63 37 | - | - | - | - | - | - | ||||||||||||||
30P3-UF0-V9![]() | 30P3-UF0-V9 |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN96 21GAUGE .5LBS | 4900 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
PW6D-31TJ-F10![]() | PW6D-31TJ-F10 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SN63 PB37 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
GUSP4-LGCN-02M![]() | GUSP4-LGCN-02M |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 63 37 18AWG 1LB | 275 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
GTGQT-DM1E-SL![]() | GTGQT-DM1E-SL |
| Leadtime 2 3 weeks | Multicore | 96SC C502 5C 0.38MM 0.25KG.015 | C502 | Active | Wire Solder | No Clean | No Shelf Life |