Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IMB-Q06O-AA![]() | IMB-Q06O-AA |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SN63 PB37 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
7T2B-YKWT-L5 | 7T2B-YKWT-L5 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SN63 PB37 500G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
WRX-IC-QB![]() | WRX-IC-QB |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES 63 37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 63 37 | - | - | - | - | - | - | ||||||||||||||
PUP-OD10-TXW![]() | PUP-OD10-TXW |
| Leadtime 2 3 weeks | Multicore | 99C C511 3C 1.63MM 1KG AM | C511™ | Active | No Shelf Life | |||||||||||||||||||||||
1A-QS5D-7AL![]() | 1A-QS5D-7AL |
| Leadtime 2-3 weeks | Kester Solder | SOLDERPASTE NO CLEAN 63 37 100GM | R276 | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 100g 3.5 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
7HG2-U9F-3T4![]() | 7HG2-U9F-3T4 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES SAC305 .030 DIAM | SMD2 | Active | Lead Free | Solder Sphere | - | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | - | - | - | ||||||||||||||
V8D-MGSZ-YT![]() | V8D-MGSZ-YT | Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES SAC305 DIAMETER 2 | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
BY07-L0-AIB![]() | BY07-L0-AIB |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 58 .015 28AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 28 AWG, 30 SWG | 0.015 0.39mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
MH66Y-1VE-PNJ![]() | MH66Y-1VE-PNJ |
| Leadtime 2-3 weeks | Multicore | 97SC 400 2% .022DIA 24SWG | C400 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
0TJ-77MW-WQF![]() | 0TJ-77MW-WQF |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .025 23AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
CRPJW-HC-B3H![]() | CRPJW-HC-B3H |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE WATER SOL LF 10CC | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
I129-VWF6-Y1![]() | I129-VWF6-Y1 |
| Leadtime 2-3 weeks | Chip Quik Inc. | TWO PART MIX SOLDER PASTE | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 15g 0.5 oz | 281°F 138°C | 24 Months Date of Manufacture Unmixed | ||||||||||||||
IE0-3JK-YZN![]() | IE0-3JK-YZN | Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES SAC305 DIAMETER 2 | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
3NT-F5Q-67 | 3NT-F5Q-67 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE NO-CLEAN 63 37 T3 5 | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
18-HA-8H | 18-HA-8H |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE NO-CLEAN 63 37 T3 5 | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
UCE-5CRH-QP | UCE-5CRH-QP |
| Leadtime 2-3 weeks | Kester Solder | SOLDER WATER SOLUABLE 21AWG 1LB | 331 | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
WZZS-P7V3-3L![]() | WZZS-P7V3-3L |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLD WIRE NO-CLEAN 96.5 3 .5 2OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 57g 2 oz | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
LK-EOXK-JS | LK-EOXK-JS |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 63 37 .025 1 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
B2V-ZFYL-7B8![]() | B2V-ZFYL-7B8 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
NDK47-PQYP-0N![]() | NDK47-PQYP-0N |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE WATER SOL T5 10CC | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||||||
9KS20-WTCD-K4![]() | 9KS20-WTCD-K4 |
| Leadtime 2-3 weeks | Multicore | SN62 C502 5C 1.02MM 0.5KG .040 | C502 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
VF-FV1T-IR![]() | VF-FV1T-IR |
| Leadtime 2-3 weeks | Multicore | 95A 362 5C 1.2MM 0.5KG RLR | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
0NP6-R0KV-EZF![]() | 0NP6-R0KV-EZF |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 60 40 .040 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
7P-SA-55I![]() | 7P-SA-55I | Leadtime 2-3 weeks | Kester Solder | SOLDER RA FLUX 23AWG 63 37 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
3W5Y-7ZX-BK![]() | 3W5Y-7ZX-BK | Leadtime 2-3 weeks | Easy Braid Co. | SOLDER NO-CLEAN ANTISTAT .031 | - | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | - | 361°F 183°C | No Shelf Life |