Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
KI-ZCFQ-4GU | KI-ZCFQ-4GU |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN100E NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
HVJT-H7-YED![]() | HVJT-H7-YED |
| Leadtime 2-3 weeks | Multicore | 63S4 MP218 ACP89V PASTE | MP218 | Active | Leaded | Solder Paste | No-Clean | - | - | - | - | - | - | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
C1F-3ECI-WF![]() | C1F-3ECI-WF | Leadtime 2-3 weeks | Easy Braid Co. | SOLDER NO-CLEAN ANTISTAT .020 | - | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | - | 361°F 183°C | No Shelf Life | |||||||||||||||
LSNF8-J2-ZGD![]() | LSNF8-J2-ZGD |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 63 37 11AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.125 3.18mm | - | - | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
SBX-ARL-54![]() | SBX-ARL-54 |
| Leadtime 2-3 weeks | Multicore | 63 37 381 5C 0.81MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
LL-NCSU-I7N | LL-NCSU-I7N |
| Leadtime 2-3 weeks | Kester Solder | SOLDER BAR 1.66LB SN96.5AG3CU0.5 | ULTRAPURE® | Active | Lead Free | Bar Solder | - | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Bar, 750g 1 2 3 lbs | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
5HC-EVKE-WW0![]() | 5HC-EVKE-WW0 |
| Leadtime 2-3 weeks | Kester Solder | SOLDERPASTE WATER SOLUABL 1000GM | R560 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Cartridge, 1000g 35 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
G5DE-XJ-26![]() | G5DE-XJ-26 |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER 60 40 NOCLEAN .04DIA .5LB | 4870 | Active | Leaded | Wire Solder | No-Clean | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
BM1-TF-3K6![]() | BM1-TF-3K6 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER SOLID WIRE 16AWG 60 40 | - | Active | Leaded | Wire Solder | - | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.062 1.57mm | - | Spool, 454g 1 lb | - | - | ||||||||||||||
QN2A-MSN3-17O | QN2A-MSN3-17O |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
AX-6P-NOI![]() | AX-6P-NOI |
| Leadtime 2-3 weeks | Kester Solder | SOLDERPASTE NO CLEAN 63 37 500GM | Easy Profile® | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
78R2C-M6Z-KT | 78R2C-M6Z-KT |
| Leadtime 2 3 weeks | Chip Quik Inc. | SLD WIRE NO CLEAN 96.5 3 .5 4OZ. | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 113g 1 4 lb | 423 ~ 428°F 217 ~ 220°C | ||||||||||||||||
BA8-U74-R8![]() | BA8-U74-R8 |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN96 21GAUGE .5LBS | 4900 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
2A1R8-40-91![]() | 2A1R8-40-91 |
| Leadtime 2-3 weeks | Multicore | MP218 RWF | MP218 | Active | Leaded | Solder Paste | No-Clean | - | - | - | - | - | - | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
UMT-1RJB-3Z![]() | UMT-1RJB-3Z |
| Leadtime 2-3 weeks | Multicore | 97SC HYDRO-X 3C0.38MM 0.25KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
BU-ZQ-BO![]() | BU-ZQ-BO |
| Leadtime 2-3 weeks | Kester Solder | SOLDER RA 60 40 19AWG 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
LCR-IS2R-F6K![]() | LCR-IS2R-F6K | Leadtime 2 3 weeks | MG Chemicals | SOLDER 63 37 NOCLEAN .04DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
XK-6PC-HI6![]() | XK-6PC-HI6 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SAC305 250G T5 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
LC0J-778L-04![]() | LC0J-778L-04 |
| Leadtime 2-3 weeks | Multicore | 96S ARAX 4C 1.6MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
8U16I-A0-5YD![]() | 8U16I-A0-5YD |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 63 37 .032 1 2 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
D4-VC1N-T8![]() | D4-VC1N-T8 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER NO CLEAN 21AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
D1RU-7TO0-3N![]() | D1RU-7TO0-3N |
| Leadtime 2-3 weeks | Multicore | 96SC C400 3C 0.56MM 0.25KG.022 | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
OO-01S-8H![]() | OO-01S-8H |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE TWO PART MIX | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 15g 0.5 oz | 423 ~ 428°F 217 ~ 220°C | 24 Months Date of Manufacture Unmixed | ||||||||||||||
CA-S9SD-GC8![]() | CA-S9SD-GC8 |
| Leadtime 2-3 weeks | Kester Solder | OR-421 FLUX-CORED WIRESN99.3CU.7 | OR421 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
HXPMS-9EKW-IT![]() | HXPMS-9EKW-IT |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SAC305 250G T5 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated |