Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3RV-3D-3R![]() | 3RV-3D-3R |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER WIRE | 4880 | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
G5-YPXB-CW | G5-YPXB-CW |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
QBJZ-1ZI-6TU![]() | QBJZ-1ZI-6TU |
| Leadtime 2-3 weeks | Multicore | 63S4 WS200 ACP PASTE 600G SEMCO | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
4L0-KUU-U8![]() | 4L0-KUU-U8 |
| Leadtime 2-3 weeks | Kester Solder | SOLDERPASTE WATER SOLUABL 1000GM | R560 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Cartridge, 1000g 35 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
8Z3O-H0N-57F![]() | 8Z3O-H0N-57F |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES 63 37 .025 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 63 37 | - | - | - | - | - | - | ||||||||||||||
X6U-UKP-EHK![]() | X6U-UKP-EHK |
| Leadtime 2-3 weeks | Multicore | HMP 366 3% .028DIA. 22SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated RA | Pb93.5Sn5Ag1.5 93.5 5 1.5 | 21 AWG, 22 SWG | 0.028 0.71mm | 0.033 | Spool, 454g 1 lb | 565 ~ 574°F 296 ~ 301°C | No Shelf Life | ||||||||||||||
ZY0-D7-QXU | ZY0-D7-QXU |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLD WIRE NO-CLEAN 96.5 3 .5 4OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 113g 1 4 lb | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
CG546-AQE-8O![]() | CG546-AQE-8O |
| Leadtime 2 3 weeks | Multicore | 99C BAR SOLDER 2LB | Obsolete | Lead Free | Bar Solder | Sn99.3Cu0.7 99.3 0.7 | Bar, 907g 2 lb | 440°F 227°C | No Shelf Life | |||||||||||||||||||
CC8N7-BV-JPV![]() | CC8N7-BV-JPV |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES 63 37 .025 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 63 37 | - | - | - | - | - | - | ||||||||||||||
UR-LQ-HR![]() | UR-LQ-HR |
| Leadtime 2-3 weeks | LOCTITE | LOCTITE GC 10 SAC305T3 885 52U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 500g 17 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
FO6P-MQ-U3![]() | FO6P-MQ-U3 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
ED-THVD-4Z | ED-THVD-4Z |
| Leadtime 2-3 weeks | Kester Solder | SOLDER BAR 1.66LB SN96.5AG3CU0.5 | ULTRAPURE® | Active | Lead Free | Bar Solder | - | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Bar, 750g 1 2 3 lbs | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
YL8E-N2C9-GF2 | YL8E-N2C9-GF2 |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
XI-K7Y-PH![]() | XI-K7Y-PH |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 63 37 .025 1 2 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
K2S-69HO-RT1![]() | K2S-69HO-RT1 |
| Leadtime 2 3 weeks | Multicore | 96SC C502 5C 0.38MM 0.25KG.015 | C502 | Active | Wire Solder | No Clean | No Shelf Life | |||||||||||||||||||||
MN-KB1-ZL7 | MN-KB1-ZL7 |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN100E RA FLUX | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
TRXV-7NE4-KKH![]() | TRXV-7NE4-KKH |
| Leadtime 2-3 weeks | Kester Solder | R562 SOLDERPASTE WATER SOL 500G | R562 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
Z9-7VU-0AI![]() | Z9-7VU-0AI |
| Leadtime 2-3 weeks | Multicore | HMP 366 3% .028DIA. 22SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated RA | Pb93.5Sn5Ag1.5 93.5 5 1.5 | 21 AWG, 22 SWG | 0.028 0.71mm | 0.033 | Spool, 454g 1 lb | 565 ~ 574°F 296 ~ 301°C | No Shelf Life | ||||||||||||||
6C-JBM-YB | 6C-JBM-YB |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
C3-0PQ-W9![]() | C3-0PQ-W9 |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 60 40 .040 1 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
782J-VDP-ER8![]() | 782J-VDP-ER8 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES 63 37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 63 37 | - | - | - | - | - | - | ||||||||||||||
ACK3-QJ55-6K0![]() | ACK3-QJ55-6K0 | Leadtime 2-3 weeks | Kester Solder | SOLDER NO-CLEAN 25AWG 63 37 .5LB | 245 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.011 | Spool, 227g 1 2 lb | 361°F 183°C | 36 Months Date of Manufacture | |||||||||||||||
VK-6SUU-DHX![]() | VK-6SUU-DHX |
| Leadtime 2 3 weeks | Multicore | 60 40C511 3C 1.63MM AF 2.5KG AM | * | Active | ||||||||||||||||||||||||
2DV0-T50C-H1 | 2DV0-T50C-H1 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER WATER SOL .062 16AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
XE6U0-D30-EB![]() | XE6U0-D30-EB |
| Leadtime 2-3 weeks | Kester Solder | SOLDER RA .020 25AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture |