Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
U75R-2VU-8P | U75R-2VU-8P |
| Leadtime 2-3 weeks | BB-6M-HQ | SOLDER SOLID WIRE 21AWG 63 37 | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | - | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
SMDLTLFP500T3 | SMDLTLFP500T3 |
| 330 | 330K1-CH-TR0 | SOLDER PASTE SN42 BI58 500G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 500g 17 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
ICL8-B5U-EFG![]() | ICL8-B5U-EFG |
| 6 | 6K5-YM-LP | SOLDER RA FLUX 23AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
ON0OU-VI-VHM![]() | ON0OU-VI-VHM |
| Leadtime 2 3 weeks | KR9XB-TN-LW | SOLDER 66 .015 28AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
W4-FG-YA5![]() | W4-FG-YA5 |
| Leadtime 2-3 weeks | SQ-V1HI-OW | 63 37 400 2% .015DIA 28SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
7021020510![]() | 7021020510 |
| Leadtime 2-3 weeks | J97-L5-UP | R562 SOLDERPASTE WATER SOL 500G | R562 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
6H56 JBR ZN![]() | 6H56 JBR ZN |
| Leadtime 2 3 weeks | ITGO2-PFTO-FS | SOLDER SPHERES 63 37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | Sn63Pb37 63 37 | |||||||||||||||||||||
D5XHD-ZECJ-01![]() | D5XHD-ZECJ-01 |
| Leadtime 2-3 weeks | MOW3M-XW-7W | 60 40 370 5C 1.22MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
24-7068-7601![]() | 24-7068-7601 |
| Leadtime 2-3 weeks | ABJ-OJ7-12T | SOLDER NO-CLEAN .031 21 AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
42-3F-OF0![]() | 42-3F-OF0 |
| 5 | 5GF-1JKN-G7 | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
SMDLTLFP250T4![]() | SMDLTLFP250T4 |
| Leadtime 2-3 weeks | SJE-XU7-UYV | SOLDER PASTE LOW TEMP T4 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
0O-6W-M4Z![]() | 0O-6W-M4Z |
| Leadtime 2 3 weeks | M5L-0NU-8K | SOLDER PASTE NO CLEAN 10CC SYR | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
4L0-KUU-U8![]() | 4L0-KUU-U8 |
| Leadtime 2-3 weeks | NVXD-97-NA | SOLDERPASTE WATER SOLUABL 1000GM | R560 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Cartridge, 1000g 35 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
UW8C-C1-21U![]() | UW8C-C1-21U |
| Leadtime 2-3 weeks | QETR-SHK-X3V | SOLDER WIRE NO-CLEAN 63 37 4OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 113g 1 4 lb | 361°F 183°C | - | ||||||||||||||
QY7J-6Y66-SV![]() | QY7J-6Y66-SV |
| Leadtime 2 3 weeks | R71-BE93-T6 | 63 37 CRYSL 502 3% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
HE6Q-2R-CX![]() | HE6Q-2R-CX | Leadtime 2-3 weeks | QH-GTPI-SCO | SOLDER 63 37 NOCLEAN .04DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
6Y0I-HMZ-V7![]() | 6Y0I-HMZ-V7 |
| 1 | 1Q96-7U1U-77H | SOLDER SOLID WIRE 16AWG 63 37 | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | - | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
X8AS-ZJ80-HM![]() | X8AS-ZJ80-HM |
| Leadtime 2-3 weeks | 0QP6-FM-0HT | SOLDER IN TUBE 1MM 60 40 | - | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.039 0.99mm | - | Tube, 20g 0.7 oz | 360°F 180°C | 5 Years Date of Manufacture | ||||||||||||||
54-J58C-K1J![]() | 54-J58C-K1J |
| Leadtime 2-3 weeks | VSBM9-R6-F4 | SOLDER LF SN96 21GAUGE 1LB | 4900 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
7020020510![]() | 7020020510 |
| Leadtime 2-3 weeks | VP9I-MT-RX | SOLDERPASTE WATER SOLUABLE 500GM | R560 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
4944-112G![]() | 4944-112G |
| Leadtime 2-3 weeks | W37E7-YK-WPW | SOLDER LF SN100E RA FLUX | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
8CG-TWQ-IO![]() | 8CG-TWQ-IO |
| Leadtime 2-3 weeks | QUH4Q-MEZ4-DQB | SOLDER RA .050 18AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
6K1LH-SJL-SI6![]() | 6K1LH-SJL-SI6 | Leadtime 2-3 weeks | S0O-LUF8-TFJ | SOLDER SPHERES SAC305 .024 DIAM | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
24-6337-0039 | 24-6337-0039 |
| 2 | 2KI0-IXG-4O | SOLDER RA 19AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
PW6D-31TJ-F10![]() | PW6D-31TJ-F10 |
| Leadtime 2-3 weeks | A9P0P-DW-B7 | SOLDER PASTE SN63 PB37 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated |