Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
AA-Q7AB-VF![]() | AA-Q7AB-VF |
| Leadtime 2 3 weeks | AOF-31J-XR | 63 37 CRYSL 502 3% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
4915-112G | 4915-112G |
| Leadtime 2-3 weeks | UTK-Z95G-W2 | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
NRAYD-MH97-70Z![]() | NRAYD-MH97-70Z |
| Leadtime 2-3 weeks | WVLK-L90-IA | 97SC HYDROX3C 0.81MM 0.5KG.032 | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
SMD2050![]() | SMD2050 |
| Leadtime 2-3 weeks | G7-X0-NA1 | SOLDER SPHERES SAC305 .024 DIAM | SMD2 | Active | Lead Free | Solder Sphere | - | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | - | - | - | ||||||||||||||
SMDSW.031 1OZ![]() | SMDSW.031 1OZ |
| Leadtime 2-3 weeks | QPB-OFD-U0 | SOLDER WIRE NO-CLEAN 63 37 1OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 28g 1 oz | 361°F 183°C | - | ||||||||||||||
B8Z2-ET-RS![]() | B8Z2-ET-RS |
| Leadtime 2-3 weeks | KATH-C8RA-UZ | SLDR PST NO-CLEAN SAC305 T4 10CC | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
MM01075![]() | MM01075 | 6 | 6S092-16-OT | 63 37 HYDRO-X 2% .024DIA 23SWG | Hydro-X | Obsolete | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.024 0.61mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
SMD291AX500T4C![]() | SMD291AX500T4C |
| 49 | 49P-C59-0OE | SOLDER PASTE 63 37 T4 500G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
818006![]() | 818006 |
| Leadtime 2-3 weeks | ZIU-BV5J-XC | 63 37 C400 5C 0.71MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
SD4G U1N OF![]() | SD4G U1N OF |
| 9 | 9M-TGB-I5 | SOLDER NO CLEAN 23AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
5XEV R2 JAW![]() | 5XEV R2 JAW |
| Leadtime 2 3 weeks | N0QH-8GR-2T | 63S4 MP218 ACP89V PASTE | MP218 | Active | Leaded | Solder Paste | No Clean | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||||
IEP-HX5-CH![]() | IEP-HX5-CH |
| Leadtime 2-3 weeks | S8BCF-8W-CB | SOLDER RA 63 37 .062 1 2 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
T2E-YZQ0-WS7 | T2E-YZQ0-WS7 |
| Leadtime 2-3 weeks | UT-70-VSS | SN42 BI57.6 AG0.4 2-PART MIX 60G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | - | 281°F 138°C | 24 Months Date of Manufacture Unmixed | ||||||||||||||
ESJ4-BL2-8R | ESJ4-BL2-8R |
| Leadtime 2-3 weeks | RW2R-J8-KFC | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
16-6040-0031![]() | 16-6040-0031 |
| Leadtime 2-3 weeks | DAT1M-04J7-A5 | SOLDER 60 40 21AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.031 0.79mm | - | - | - | 36 Months Date of Manufacture | ||||||||||||||
85 TRGK 86![]() | 85 TRGK 86 |
| 4 | 4O4JK-CHU9-JBU | SOLDER SOLID WIRE 16AWG 60 40 | Active | Leaded | Wire Solder | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.062 1.57mm | Spool, 454g 1 lb | |||||||||||||||||||
76D D62M GS | 76D D62M GS |
| Leadtime 2 3 weeks | LB8B-OE1-K2 | 97SC C511 2% .032DIA 21SWG | C511™ | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
HQG-1T4-58![]() | HQG-1T4-58 |
| 3 | 3NN9H-AB9-PW4 | SOLDER PASTE NO-CLEAN 63 37 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
GI JW U5![]() | GI JW U5 |
| Leadtime 2 3 weeks | FK-DI-JCA | SOLDER RA 21AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
24-6337-8809![]() | 24-6337-8809 |
| Leadtime 2-3 weeks | ED2X-QS-4N | SOLDER NO-CLEAN 23AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
PH-CY-3J | PH-CY-3J |
| 6 | 6QZ2Q-H4S5-YM | SOLDER BAR 1.66LB SN96.5AG3CU0.5 | ULTRAPURE® | Active | Lead Free | Bar Solder | - | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Bar, 750g 1 2 3 lbs | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
7C-SR-4KV![]() | 7C-SR-4KV |
| Leadtime 2-3 weeks | BQOC-PKN-XC | HMP 366 3% .028DIA. 22SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated RA | Pb93.5Sn5Ag1.5 93.5 5 1.5 | 21 AWG, 22 SWG | 0.028 0.71mm | 0.033 | Spool, 454g 1 lb | 565 ~ 574°F 296 ~ 301°C | No Shelf Life | ||||||||||||||
EZ P9UB XZ | EZ P9UB XZ |
| Leadtime 2 3 weeks | NMP-3XW-K1O | SLD WIRE NO CLEAN 96.5 3 .5 2OZ. | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 57g 2 oz | 423 ~ 428°F 217 ~ 220°C | ||||||||||||||||
1354298![]() | 1354298 |
| Leadtime 2-3 weeks | HX9-G5-M3 | 63S4 WS200 ACP 500G JAR | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
BD3Q-07-AR![]() | BD3Q-07-AR |
| 1 | 1G-0TA-W2 | SOLDER PASTE HF 212 600GRAM JA | HF212 | Active | No Shelf Life |