Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
4TJD-9JH-YBH![]() | 4TJD-9JH-YBH |
| Leadtime 2-3 weeks | NFJ-DSP-TP | SOLDER 500G JAR, SN63 PB37 | HM531 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
ZON-86-SGU![]() | ZON-86-SGU |
| Leadtime 2-3 weeks | 0XNBC-MRT-UA | SOLDER WIRE NO-CLEAN 63 37 1OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 28g 1 oz | 361°F 183°C | - | ||||||||||||||
SS-S020![]() | SS-S020 | 2 | 2T1-9A4U-H0 | SOLDER WATER SOL .020 X 25 | - | Obsolete | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | - | 361°F 183°C | No Shelf Life | |||||||||||||||
9YC-37HA-YAX![]() | 9YC-37HA-YAX |
| Leadtime 2-3 weeks | AFAT3-VT5-1Y | 99C C511 3C 0.81MM 0.5KG AM | C511™ | Active | - | - | - | - | - | - | - | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
J3DU-XZYM-HB![]() | J3DU-XZYM-HB |
| Leadtime 2-3 weeks | M6-EFR-R3E | HMP 366 3% .050DIA. 18SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated RA | Pb93.5Sn5Ag1.5 93.5 5 1.5 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 565 ~ 574°F 296 ~ 301°C | No Shelf Life | ||||||||||||||
JAX-AN-M9K![]() | JAX-AN-M9K |
| Leadtime 2 3 weeks | MB8U-2V-YE0 | SOLDER WATER SOL .031 21AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
732998 | 732998 |
| Leadtime 2-3 weeks | ABA-581E-M73 | 97SC C511 2% .064DIA 16SWG | C511™ | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.064 1.63mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
SMD291AX10T4![]() | SMD291AX10T4 |
| 1 | 1PXJI-8V-SA | SLDR PST NO-CLEAN 63 37 T4 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
NWX9U-OK-LAK | NWX9U-OK-LAK |
| Leadtime 2 3 weeks | AAM-K4G9-8Q | SOLDER PASTE NO CLEAN SAC305 T3 | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||||
1OV66-J5-S2![]() | 1OV66-J5-S2 |
| 8 | 8ND6K-5H1-GTW | 96SC C502 5C 0.81MM 0.5KG AM | C502 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
4935-454G | 4935-454G |
| Leadtime 2-3 weeks | HOO-RHD-Y4I | SOLDER LF SN100E NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
IWLE-OK-FG![]() | IWLE-OK-FG |
| Leadtime 2-3 weeks | WLSYS-UH-BH | SOLDER 58 .015 28AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 28 AWG, 30 SWG | 0.015 0.39mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
24-7068-7601![]() | 24-7068-7601 |
| 3 | 3T13H-PT56-XX2 | SOLDER NO-CLEAN .031 21 AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
SMD4300SNL250T4![]() | SMD4300SNL250T4 |
| Leadtime 2-3 weeks | T288-ODH1-68F | SLDR PST WATR SOL SAC305 T4 250G | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
16-6040-0125![]() | 16-6040-0125 |
| Leadtime 2-3 weeks | PNCE-QTS-2Z | SOLDER 60 40 11AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn60Pb40 60 40 | - | 0.125 3.18mm | - | - | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
4885-454G![]() | 4885-454G |
| Leadtime 2-3 weeks | H6LBI-8JPV-5Z | SOLDER RA 63 37 .032 1 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
BXK-PR-7RR![]() | BXK-PR-7RR | Leadtime 2-3 weeks | FCR-82-2NE | SOLDER 63 37 NOCLEAN .04DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
ZON-86-SGU![]() | ZON-86-SGU |
| 1 | 1O-F40K-POS | SOLDER WIRE NO-CLEAN 63 37 1OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 28g 1 oz | 361°F 183°C | - | ||||||||||||||
OHVZX-52NE-98R![]() | OHVZX-52NE-98R |
| Leadtime 2-3 weeks | ALUML-TRRU-3V | SOLDER 66 .020 25AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
SMD291AX50T3![]() | SMD291AX50T3 |
| Leadtime 2-3 weeks | E6K-55O-JES | SLDR PASTE NO-CLN SN63 PB37 50G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Jar, 50g 1.8 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
24-7068-7606![]() | 24-7068-7606 |
| 87 | 87Z1L-2O-TTE | SOLDER NO-CLEAN .050 18AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
EJ6-GDY-M7![]() | EJ6-GDY-M7 |
| Leadtime 2-3 weeks | K9MEP-BW-ZB1 | SOLDER LF SN96 21GAUGE 1LB | 4900 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
289398![]() | 289398 |
| Leadtime 2-3 weeks | MR-GL-Q61 | 95A 362 5C 1.2MM 0.5KG RLR | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
C9QDT-HJ-KS3![]() | C9QDT-HJ-KS3 |
| 7 | 7QOF8-V62S-B1 | SOLDER NO-CLEAN .062 16AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
SMD2190-25000![]() | SMD2190-25000 | Leadtime 2-3 weeks | TEAKG-E9-UGF | SOLDER SPHERES SN63 PB37 .020 D | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - |