Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
FQN-25-0AI | FQN-25-0AI |
| Leadtime 2 3 weeks | TI-YKS-78U | SOLDER LF SAC305 NO CLEAN | * | Active | ||||||||||||||||||||||||
97H4-JCX-J2![]() | 97H4-JCX-J2 |
| Leadtime 2-3 weeks | EZE-MD-WC | SOLDER RA 60 40 .032 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
849328![]() | 849328 |
| Leadtime 2-3 weeks | F8JB-E6Y-994 | 97SC C502 3C 1.63MM 2.5KG AM | C502 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | 361°F 183°C | No Shelf Life | ||||||||||||||
24-9574-1401![]() | 24-9574-1401 |
| 30 | 30YVW-E6-5O | SOLDER 66 .020 25AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
OAK-VN6J-9XT![]() | OAK-VN6J-9XT |
| Leadtime 2-3 weeks | AI3A7-6V-WN | SLD PASTE LF WATER SOL T5 10CC | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
RC-UANS-VXY![]() | RC-UANS-VXY |
| Leadtime 2-3 weeks | N8J9V-IKAI-VGV | 63 37 CRYSL 502 2% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
NUM-9HC4-XE | NUM-9HC4-XE |
| Leadtime 2-3 weeks | UO-RS-7LY | SOLDER LF SN100E RA FLUX | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
PW6D-31TJ-F10![]() | PW6D-31TJ-F10 |
| Leadtime 2-3 weeks | KZDK-XYTN-1N | SOLDER PASTE SN63 PB37 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
C9QDT-HJ-KS3![]() | C9QDT-HJ-KS3 |
| 4 | 4UET3-20R-O70 | SOLDER NO-CLEAN .062 16AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
T8-7K-7WZ![]() | T8-7K-7WZ |
| Leadtime 2-3 weeks | YJEVQ-71-U22 | SOLDERPASTE NO CLEAN 63 37 100GM | R276 | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 100g 3.5 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
49500-454G | 49500-454G |
| 5 | 5K-FN1-QP | SOLDER WIRE NO CLEAN 0.032 DIA | 49500 | Active | Lead Free | Wire Solder | No-Clean | Sn99.5Cu0.5 99.5 0.5 | 21 AWG, 22 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 442°F 228°C | No Shelf Life | ||||||||||||||
JAX-AN-M9K![]() | JAX-AN-M9K |
| 92 | 92-TI-888 | SOLDER WATER SOL .031 21AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
D4-VC1N-T8![]() | D4-VC1N-T8 |
| 8 | 8UEX-UA-JO | SOLDER NO CLEAN 21AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
UAT-3Y2Y-4S7![]() | UAT-3Y2Y-4S7 |
| Leadtime 2-3 weeks | HYXD-A4-Z3O | LOCTITE GC 10 SAC305T4 885 52U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 500g 17 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
SMDSW.031 1OZ![]() | SMDSW.031 1OZ |
| 5 | 5PE-PD3K-NE | SOLDER WIRE NO-CLEAN 63 37 1OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 28g 1 oz | 361°F 183°C | - | ||||||||||||||
692857![]() | 692857 |
| Leadtime 2-3 weeks | PCP-5L66-PBG | 96SC C511 5C 0.81MM 0.5KG AM | C511™ | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
IUAP V5UE GGG![]() | IUAP V5UE GGG |
| Leadtime 2 3 weeks | LT-UK-VA | 63 37 381 5C 0.56MM 0.25KG AM | * | Active | ||||||||||||||||||||||||
BG4F-P11I-QP![]() | BG4F-P11I-QP |
| 6 | 6MMT-2L-YBV | SOLDERPASTE NO CLEAN 63 37 100GM | R276 | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 100g 3.5 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
ZRORF-KXT-5P | ZRORF-KXT-5P |
| Leadtime 2 3 weeks | P4-3C0R-728 | SOLDER NO CLEAN 18AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
LK-EOXK-JS | LK-EOXK-JS |
| Leadtime 2-3 weeks | XQV6-Y4-Q2 | SOLDER RA 63 37 .025 1 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
58-T4-DP![]() | 58-T4-DP |
| Leadtime 2-3 weeks | KXAA-4F3-MFS | SOLDER PASTE SN63 PB37 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
WR-QPAO-CS | WR-QPAO-CS |
| Leadtime 2-3 weeks | Y1-XRZ3-C9E | SLD WIRE NO-CLEAN 96.5 3 .5 4OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 113g 1 4 lb | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
00OS-47PB-G6K | 00OS-47PB-G6K |
| Leadtime 2-3 weeks | K7C6-IX-9J | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
IBWE9-HT-D0![]() | IBWE9-HT-D0 | 7 | 7KD-IK-GT5 | SN62 370 3% .032DIA. 21SWG | 370 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn62Pb38 62 38 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 350°F 177°C | No Shelf Life | |||||||||||||||
55I6Y-CQ3R-AP![]() | 55I6Y-CQ3R-AP |
| 6 | 6S1PL-QHPZ-854 | 96SC C400 3C 0.56MM 0.25KG.022 | * | Active | - | - | - | - | - | - | - | - | - | - |