Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
17554![]() | 17554 | Leadtime 2-3 weeks | H35XV-ADZ-44B | SOLDER 0.8MM 250G | - | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | - | 0.03 0.76mm | - | Spool, 227g 1 2 lb | - | No Shelf Life | |||||||||||||||
SMD2200-25000![]() | SMD2200-25000 | 573 | 573-W08-TV | SOLDER SPHERES SN63 PB37 .024 D | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
HSH67-DW-JSU![]() | HSH67-DW-JSU |
| Leadtime 2 3 weeks | DDHHF-5K6D-0CH | 97SC 400 2% .064DIA 16SWG | C400 | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.064 1.63mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
0A PRPN INS![]() | 0A PRPN INS |
| Leadtime 2 3 weeks | P7N-KNH-8BG | 97SC C511 2% .015DIA 28SWG | C511™ | Active | Lead Free | Wire Solder | Rosin Mildly Activated RMA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | |||||||||||||||
BI4W-8B-OZ![]() | BI4W-8B-OZ |
| 600000000 | 6E08-YP-SPT | 99C C511 3C 0.81MM 0.5KG AM | C511™ | Active | - | - | - | - | - | - | - | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
VN7DR-Z82N-BDM![]() | VN7DR-Z82N-BDM |
| Leadtime 2-3 weeks | JT-L3WO-39 | OR-421 FLUX-CORED WIRESN99.3CU.7 | OR421 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
4900-454G![]() | 4900-454G |
| Leadtime 2-3 weeks | VUZ-M1C9-E13 | SOLDER LF SN96 21GAUGE 1LB | 4900 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
U9PZ3-3D08-OW2![]() | U9PZ3-3D08-OW2 |
| 7 | 7K-36M-PO | SOLDER SPHERES 63 37 .020 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 63 37 | - | - | - | - | - | - | ||||||||||||||
8I-HF-TMJ | 8I-HF-TMJ |
| Leadtime 2-3 weeks | P2SD-IQQ2-44 | SLD WIRE NO-CLEAN 96.5 3 .5 4OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 113g 1 4 lb | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
8TGSS-U0AX-4I![]() | 8TGSS-U0AX-4I |
| Leadtime 2 3 weeks | L4ZK2-76H-S1J | SOLDER WIRE | 4880 | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
3TN 2L0 WQO![]() | 3TN 2L0 WQO |
| Leadtime 2 3 weeks | QD3I-C2R-GJ | 63S4 WS200 ACP PASTE 600G SEMCO | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
WRM W509 03T![]() | WRM W509 03T |
| Leadtime 2 3 weeks | M42-MJLT-I7N | SOLDER BAR 60 40 1.66LB | E Bar | Active | Leaded | Bar Solder | Sn60Pb40 60 40 | Bar, 750g 1 2 3 lbs | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||||||
SD4G U1N OF![]() | SD4G U1N OF |
| Leadtime 2 3 weeks | I9Q-RU5-3YY | SOLDER NO CLEAN 23AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
I9-IH-KL7![]() | I9-IH-KL7 |
| 76 | 76WCZ-KP-S6 | SOLDER 66 .031 22AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
23-6337-0027![]() | 23-6337-0027 | 4 | 4OS9-EEN5-6JH | SOLDER RA FLUX 21AWG 63 37 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
Z0DP-O6P-OXJ![]() | Z0DP-O6P-OXJ |
| Leadtime 2-3 weeks | PA-GU-3GX | SOLDER 1MM 100G | - | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.039 0.99mm | - | Spool, 100g 3.5 oz | 360°F 180°C | 5 Years Date of Manufacture | ||||||||||||||
23-6337-8806![]() | 23-6337-8806 | Leadtime 2-3 weeks | HE-ONN3-U9 | SOLDER NO-CLEAN 28AWG 63 37 .5LB | 245 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.011 | Spool, 227g 1 2 lb | 361°F 183°C | 36 Months Date of Manufacture | |||||||||||||||
SMD291AX10T4![]() | SMD291AX10T4 |
| Leadtime 2-3 weeks | NR0-6M-TP | SLDR PST NO-CLEAN 63 37 T4 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
BU-ZQ-BO![]() | BU-ZQ-BO |
| Leadtime 2-3 weeks | DI862-31QJ-ML7 | SOLDER RA 60 40 19AWG 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
FCC7-5P0A-FJ![]() | FCC7-5P0A-FJ |
| Leadtime 2-3 weeks | HDD2N-1O-P89 | SOLDER PASTE NO-CLEAN 63 37 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
SR2K-Q1E-9C![]() | SR2K-Q1E-9C |
| Leadtime 2-3 weeks | NWYV-IW3-T2K | 63 37 400 2% .015DIA 28SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
IJIP-ZO-GYF![]() | IJIP-ZO-GYF | Leadtime 2-3 weeks | LP-J27-GS | SOLDER SPHERES SAC305 .024 DIAM | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
RL7-SV9-MDU![]() | RL7-SV9-MDU |
| Leadtime 2-3 weeks | XZ-ZGSK-APZ | SOLDER LF SN100E RA FLUX | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
SMD4300SNL10T4![]() | SMD4300SNL10T4 |
| Leadtime 2-3 weeks | L98-F8-K1K | SLDR PST WATR SOL SAC305 T4 10CC | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
SMD291SNL10T5![]() | SMD291SNL10T5 |
| 4 | 4H5F-WPIX-NR | SOLDER PASTE LF T5 10CC | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated |