Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PI-IOO-PS![]() | PI-IOO-PS |
| Leadtime 2-3 weeks | RVA-R9CN-UU | SOLDER 1MM 100G | - | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.039 0.99mm | - | Spool, 100g 3.5 oz | 360°F 180°C | 5 Years Date of Manufacture | ||||||||||||||
32U2K E43C 844![]() | 32U2K E43C 844 |
| Leadtime 2 3 weeks | FP-RA-D1 | SOLDER WIRE NO CLEAN 63 37 1OZ. | Active | Leaded | Wire Solder | No Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 28g 1 oz | 361°F 183°C | ||||||||||||||||
7021020510![]() | 7021020510 |
| Leadtime 2-3 weeks | UH-DFE-B5 | R562 SOLDERPASTE WATER SOL 500G | R562 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
K9 HY 5P1![]() | K9 HY 5P1 |
| Leadtime 2 3 weeks | P2EV-3WYJ-1I7 | HMP 366 3% .050DIA. 18SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated RA | Pb93.5Sn5Ag1.5 93.5 5 1.5 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 565 ~ 574°F 296 ~ 301°C | No Shelf Life | ||||||||||||||
VG8A-Z1U7-OW![]() | VG8A-Z1U7-OW |
| Leadtime 2-3 weeks | U4VPI-L0-L2 | SOLDER WIRE NO-CLEAN 63 37 1OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 28g 1 oz | 361°F 183°C | - | ||||||||||||||
TRXV-7NE4-KKH![]() | TRXV-7NE4-KKH |
| 3 | 3Z-8C-BI | R562 SOLDERPASTE WATER SOL 500G | R562 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
ZA-F8YA-C1![]() | ZA-F8YA-C1 | 51 | 51S-VN-2G | SOLDER 0.8MM 250G | - | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | - | 0.03 0.76mm | - | Spool, 227g 1 2 lb | - | No Shelf Life | |||||||||||||||
1042100![]() | 1042100 |
| Leadtime 2-3 weeks | KWVF-VQ-1R | 60 40C511 3C 1.63MM AF 2.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
1179443![]() | 1179443 |
| Leadtime 2-3 weeks | I0-C1-7N | 63 37 381 5C 0.56MM 0.25KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
SMD291SNL250T3![]() | SMD291SNL250T3 |
| 51440 | 51440-2UV-6SZ | SOLDER PASTE SAC305 250G T3 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
38P3-F5-WBZ![]() | 38P3-F5-WBZ | Leadtime 2-3 weeks | YTNF-9CU-1B | SOLDER 63 37 NOCLEAN .04DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
T5NLS-A2R-4W![]() | T5NLS-A2R-4W |
| Leadtime 2-3 weeks | YLE-BX5V-04T | SOLDER 63 37 28AWG 1LB | 275 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 28 AWG, 30 SWG | 0.015 0.39mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
43IG-0NL-9XC![]() | 43IG-0NL-9XC |
| Leadtime 2-3 weeks | LWG3-GM5O-Z0 | 96S ARAX 4C 1.6MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
XI-K7Y-PH![]() | XI-K7Y-PH |
| Leadtime 2-3 weeks | BKS5-5H-ZWG | SOLDER RA 63 37 .025 1 2 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
XZ-DPB6-6Q | XZ-DPB6-6Q |
| 1 | 1JG9J-K9ZB-UQ | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
680290![]() | 680290 |
| Leadtime 2-3 weeks | CNV-LKO-WH | 99C BAR SOLDER 2LB | - | Obsolete | Lead Free | Bar Solder | - | Sn99.3Cu0.7 99.3 0.7 | - | - | - | Bar, 907g 2 lb | 440°F 227°C | No Shelf Life | ||||||||||||||
24-6337-6401![]() | 24-6337-6401 |
| Leadtime 2-3 weeks | O5R-VEIG-0SN | SOLDER WATER SOLUABLE 25AWG 1LB | 331 | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
SMD2190-25000![]() | SMD2190-25000 | Leadtime 2-3 weeks | O9UBT-52-81E | SOLDER SPHERES SN63 PB37 .020 D | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
HN9D KPA S1![]() | HN9D KPA S1 |
| Leadtime 2 3 weeks | QLFR-T2-ZJ4 | SOLDER PASTE SAC305 T4 500G | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||||
IJIP-ZO-GYF![]() | IJIP-ZO-GYF | 4 | 4YP-OQ-4R | SOLDER SPHERES SAC305 .024 DIAM | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
49500-454G | 49500-454G |
| Leadtime 2-3 weeks | HK-66WM-GS9 | SOLDER WIRE NO CLEAN 0.032 DIA | 49500 | Active | Lead Free | Wire Solder | No-Clean | Sn99.5Cu0.5 99.5 0.5 | 21 AWG, 22 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 442°F 228°C | No Shelf Life | ||||||||||||||
SMD4300SNL250T4![]() | SMD4300SNL250T4 |
| Leadtime 2-3 weeks | E27-TT1-EA8 | SLDR PST WATR SOL SAC305 T4 250G | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
70-1002-0510![]() | 70-1002-0510 |
| Leadtime 2-3 weeks | OX-PB-Q1 | SOLDER 500G JAR, SN63 PB37 | HM531 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
23-6337-0007![]() | 23-6337-0007 | Leadtime 2-3 weeks | 0GR8-TNK-HFJ | SOLDER RA FLUX 28AWG 63 37 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
PJ-E3-Q0![]() | PJ-E3-Q0 |
| 1 | 1OCN-U0-MDX | 63 37 400 1% .032DIA 21SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life |