Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
7021020510![]() | 7021020510 |
| Leadtime 2-3 weeks | UBDA-5K-NI1 | R562 SOLDERPASTE WATER SOL 500G | R562 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
SMD2040![]() | SMD2040 |
| Leadtime 2-3 weeks | RPDWU-OY1-97 | SOLDER SPHERES SAC305 .020 DIAM | SMD2 | Active | Lead Free | Solder Sphere | - | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | - | - | - | ||||||||||||||
17551![]() | 17551 |
| Leadtime 2-3 weeks | R0MIY-YZ-6NY | SOLDER IN TUBE 1MM 60 40 | - | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.039 0.99mm | - | Tube, 20g 0.7 oz | 360°F 180°C | 5 Years Date of Manufacture | ||||||||||||||
7LF-Q6-35![]() | 7LF-Q6-35 |
| Leadtime 2-3 weeks | S4NTA-2M-UF | SOLDER PASTE SN63 PB37 250G T5 | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
J05-7BUR-9V7![]() | J05-7BUR-9V7 |
| 20000000 | 2E7-ER5-H55 | SOLDER 66 .050 18AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
1179443![]() | 1179443 |
| 8 | 8CZ-TSXU-ROI | 63 37 381 5C 0.56MM 0.25KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
1QEF5-JE1K-HZ![]() | 1QEF5-JE1K-HZ |
| Leadtime 2-3 weeks | ZKGD-1DHN-O27 | SOLDER 63 37 11AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.125 3.18mm | - | - | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
IZZV-MD2Z-K3I![]() | IZZV-MD2Z-K3I |
| Leadtime 2-3 weeks | HS51-TUSP-WQ | 97SC C511 2% .015DIA 28SWG | C511™ | Active | Lead Free | Wire Solder | Rosin Mildly Activated RMA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
BM1-TF-3K6![]() | BM1-TF-3K6 |
| Leadtime 2-3 weeks | RN-7E8-77H | SOLDER SOLID WIRE 16AWG 60 40 | - | Active | Leaded | Wire Solder | - | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.062 1.57mm | - | Spool, 454g 1 lb | - | - | ||||||||||||||
VQ5Q-LT-LPE![]() | VQ5Q-LT-LPE |
| Leadtime 2-3 weeks | VJ519-UV-6J | SOLDER WATER SOL .031 21AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
386863![]() | 386863 |
| Leadtime 2-3 weeks | RZOF-BJ-6PT | 96S C400 5C 0.56MM 0.5KG AM | C400 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
1M4S-WG9-D7![]() | 1M4S-WG9-D7 |
| Leadtime 2-3 weeks | TM0BO-L5L-QL | SLDR PST NO-CLEAN 63 37 T4 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
SMD291SNL50T3![]() | SMD291SNL50T3 |
| Leadtime 2-3 weeks | U7-P7-A6P | SLDR PASTE NO-CLN SAC305 50G | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 50g 1.8 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
2S5-4Y-83R![]() | 2S5-4Y-83R |
| Leadtime 2-3 weeks | YTM-72E3-BM5 | HMP 366 3% .022DIA. 24SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated RA | Pb93.5Sn5Ag1.5 93.5 5 1.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.033 | Spool, 227g 1 2 lb | 565 ~ 574°F 296 ~ 301°C | No Shelf Life | ||||||||||||||
ED-THVD-4Z | ED-THVD-4Z |
| Leadtime 2-3 weeks | FKZ1O-XAH-DA | SOLDER BAR 1.66LB SN96.5AG3CU0.5 | ULTRAPURE® | Active | Lead Free | Bar Solder | - | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Bar, 750g 1 2 3 lbs | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
MH66Y-1VE-PNJ![]() | MH66Y-1VE-PNJ |
| Leadtime 2-3 weeks | VLX-HW8-2V | 97SC 400 2% .022DIA 24SWG | C400 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
6C-JBM-YB | 6C-JBM-YB |
| Leadtime 2-3 weeks | U43S-LI7-DE | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
XJ8-7L-UW | XJ8-7L-UW |
| Leadtime 2-3 weeks | NY-PZK-OX | SOLDER PASTE NO-CLEAN 63 37 T3 5 | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
409B-0L3N-IQ![]() | 409B-0L3N-IQ |
| Leadtime 2-3 weeks | EI-IO-ZNK | SOLDER SOLID WIRE 16AWG 63 37 | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | - | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
VH825-WTR-B9![]() | VH825-WTR-B9 |
| Leadtime 2 3 weeks | I67-YBJ-REU | 63 37 CRYSL 502 3% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
IJIP-ZO-GYF![]() | IJIP-ZO-GYF | Leadtime 2-3 weeks | ZP6-D932-EO | SOLDER SPHERES SAC305 .024 DIAM | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
HE6Q-2R-CX![]() | HE6Q-2R-CX | Leadtime 2-3 weeks | S53RG-6HZN-56O | SOLDER 63 37 NOCLEAN .04DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
T5N WOS2 6I![]() | T5N WOS2 6I |
| 1 | 1N33-ZCM5-HU | HMP 366 3% .050DIA. 18SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated RA | Pb93.5Sn5Ag1.5 93.5 5 1.5 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 565 ~ 574°F 296 ~ 301°C | No Shelf Life | ||||||||||||||
386844![]() | 386844 |
| 4 | 4I-5IP-T2 | 63 37 400 2% .015DIA 28SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
I4SL-RZ-IW![]() | I4SL-RZ-IW |
| Leadtime 2-3 weeks | AY6QU-UBA5-BSD | 60 40 370 3% .064DIA. 16SWG | 370 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.064 1.63mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life |