PA0170-S

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Product category
Description
MINI SOIC-8 EXP PAD STENCIL
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Specifications

ManufacturerChip Quik Inc.
SeriesProto-Advantage
Part StatusActive
TypeMini SOIC
Number of Positions8
Pitch0.026" (0.65mm)
Outer Dimension0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad0.067" L x 0.315" W (1.70mm x 8.00mm)
MaterialStainless Steel
Standard Package1

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Total $11.36 Price for 1