ManufacturerPackagingSeriesPart StatusApplicationsCurrent - SupplyVoltage - SupplyOperating TemperatureMounting TypePackage / CaseSupplier Device Package
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Applications
Current - Supply
Voltage - Supply
Operating Temperature ...
Mounting Type
Package / Case
Supplier Device Package ...
MC34911G5ACR2
MC34911G5ACR2
2000+1.58824
Increments of 2000
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP LIN 32-LQFPTape & Reel (TR)-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
MC34911G5AC
MC34911G5AC
250+1.84314
Increments of 250
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP LIN 32-LQFPTray-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
MC34911BACR2
MC34911BACR2
2000+1.58824
Increments of 2000
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP LIN 32-LQFPTape & Reel (TR)-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
MC34911BAC
MC34911BAC
250+1.84314
Increments of 250
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP LIN 32-LQFPTray-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
MC34910G5ACR2
MC34910G5ACR2
2000+1.38824
Increments of 2000
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP LIN 32-LQFPTape & Reel (TR)-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
MC34910G5AC
MC34910G5AC
250+1.60784
Increments of 250
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP LIN 32-LQFPTray-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
MC34910BACR2
MC34910BACR2
2000+1.36471
Increments of 2000
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP LIN 32-LQFPTape & Reel (TR)-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
MC34910BAC
MC34910BAC
250+1.56863
Increments of 250
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP LIN 32-LQFPTray-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
MC33912G5ACR2
MC33912G5ACR2
2000+1.88235
Increments of 2000
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP 32LQFPTape & Reel (TR)-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
MC33912G5AC
MC33912G5AC
1250+1.88235
Increments of 1250
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP 32LQFPTray-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
MC33912BACR2
MC33912BACR2
2000+1.88235
Increments of 2000
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP 32LQFPTape & Reel (TR)-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
MC33912BAC
MC33912BAC
250+2.01325
Increments of 250
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP 32LQFPTray-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
MC33911G5ACR2
MC33911G5ACR2
2000+1.64707
Increments of 2000
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP 32LQFPTape & Reel (TR)-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
MC33911G5AC
MC33911G5AC
1250+1.64707
Increments of 1250
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP 32LQFPTray-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
MC33911BACR2
MC33911BACR2
2000+1.64707
Increments of 2000
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP 32LQFPTape & Reel (TR)-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
MC33911BAC
MC33911BAC
1250+1.64707
Increments of 1250
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP 32LQFPTray-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
MC33910G5ACR2
MC33910G5ACR2
2000+1.48235
Increments of 2000
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP 32LQFPTape & Reel (TR)-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
MC33910G5AC
MC33910G5AC
1250+1.48235
Increments of 1250
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP 32LQFPTray-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
MC33910BACR2
MC33910BACR2
2000+1.48235
Increments of 2000
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP 32LQFPTape & Reel (TR)-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
MC33910BAC
MC33910BAC
250+1.72549
Increments of 250
Leadtime
2-3 weeks		NXP USA Inc.IC SYSTEM BASIS CHIP 32LQFPTray-ActiveSystem Basis Chip4.5mA5.5 V ~ 27 V-40°C ~ 125°CSurface Mount32-LQFP32-LQFP (7x7)
AP5727WG-7-Cut
AP5727WG-7
1+0.607843
10+0.533333
100+0.408726
500+0.323137
1000+0.25851
Increments of 1
Leadtime
2-3 weeks		Diodes IncorporatedIC LCD/OLED BIAS SUPPLY SOT25Cut Tape (CT)-ActiveLCD/OLED Display500µA2.7 V ~ 5.5 V-40°C ~ 85°CSurface MountSC-74A, SOT-753SOT-25
AP5727WG-7
AP5727WG-7
3000+0.227451
6000+0.211765
15000+0.203922
30000+0.196078
Increments of 3000
Leadtime
2-3 weeks		Diodes IncorporatedIC LCD/OLED BIAS SUPPLY SOT25Tape & Reel (TR)-ActiveLCD/OLED Display500µA2.7 V ~ 5.5 V-40°C ~ 85°CSurface MountSC-74A, SOT-753SOT-25
TPS65721RSNR-Cut
TPS65721RSNR
1+2.66667
10+2.39804
100+1.92716
500+1.58337
1000+1.31194
Increments of 1
Leadtime
2-3 weeks		Texas InstrumentsIC PMU 2CH CONV/LDO 32QFNCut Tape (CT)-ActiveHandheld/Mobile Devices-2.3 V ~ 5.6 V-40°C ~ 85°CSurface Mount32-WFQFN Exposed Pad32-QFN (4x4)
TPS65720YFFR-Cut
TPS65720YFFR
1+2.38235
10+2.14314
100+1.72284
500+1.41549
1000+1.17283
Increments of 1
Leadtime
2-3 weeks		Texas InstrumentsIC PMU 2CH CONV/LDO 25DSBGACut Tape (CT)-ActiveHandheld/Mobile Devices-2.3 V ~ 5.6 V-40°C ~ 85°CSurface Mount25-UFBGA, DSBGA25-DSBGA (2x2)
TPS650061RUKT-Cut
TPS650061RUKT
1+3.92157
10+3.52353
100+2.88676
Increments of 1
Leadtime
2-3 weeks		Texas InstrumentsIC CONV STPDWN 2.25MHZ DL 20WQFNCut Tape (CT)-ActiveHandheld/Mobile Devices-2.3 V ~ 6 V-40°C ~ 85°CSurface Mount20-WFQFN Exposed Pad20-WQFN (3x3)