Manufacturer | NXP USA Inc. |
Packaging | Tray |
Series | i.MX6DL |
Part Status | Active |
Core Processor | ARM® Cortex®-A9 |
Number of Cores/Bus Width | 2 Core, 32-Bit |
Speed | 800MHz |
Co-Processors/DSP | Multimedia; NEON™ SIMD |
RAM Controllers | LPDDR2, LVDDR3, DDR3 |
Graphics Acceleration | Yes |
Display & Interface Controllers | Keypad, LCD |
Ethernet | 10/100/1000 Mbps (1) |
SATA | - |
USB | USB 2.0 + PHY (4) |
Voltage - I/O | 1.8V, 2.5V, 2.8V, 3.3V |
Operating Temperature | -40°C ~ 105°C (TA) |
Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Package / Case | 624-LFBGA |
Supplier Device Package | 624-MAPBGA (21x21) |
Standard Package | 60 |
IC MPU Q OR IQ 1.5GHZ 1295FCBGA
BASEBAND PROC PILOT REV 1.0
IC MPU M683XX 33MHZ 357BGA
IC MPU MPC85XX 1.0GHZ 783FCBGA
IC MPU MPC8XX 66MHZ 256BGA
IC MPU MPC83XX 533MHZ 689TEBGA
IC MPU Q OR IQ 2.0GHZ 1295FCBGA
IC MPU Q OR IQ 500MHZ 457TEBGA
IC MPU I.MX31 532MHZ 473MAPBGA
IC MPU MPC85XX 1.25GHZ 783FCBGA
IC MPU MPC8XX 80MHZ 357BGA
IC MPU MPC82XX 266MHZ 352TBGA