ManufacturerPackagingSeriesPart StatusTypeNumber of CircuitsRatio - Input:OutputDifferential - Input:OutputInputOutputFrequency - MaxVoltage - SupplyOperating TemperatureMounting TypePackage / CaseSupplier Device Package
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Circuits
Ratio - Input:Output
Differential - Input:Output ...
Input
Output
Frequency - Max
Voltage - Supply
Operating Temperature ...
Mounting Type
Package / Case
Supplier Device Package ...
SY89837UMG-TR
SY89837UMG-TR
1000+4.88747
Increments of 1000
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:8 2GHZ 32MLFTape & Reel (TR)Precision Edge®ActiveFanout Buffer (Distribution), Multiplexer12:8Yes/YesCML, LVDS, PECLLVPECL2GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad, 32-MLF®32-MLF® (5x5)
SY89837UMG
SY89837UMG
1+6.44118
25+5.37216
100+4.88745
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:8 2GHZ 32MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Multiplexer12:8Yes/YesCML, LVDS, PECLLVPECL2GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad, 32-MLF®32-MLF® (5x5)
SY89834UMG-TR
SY89834UMG-TR
1000+4.44314
Increments of 1000
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:4 1GHZ 16MLFTape & Reel (TR)Precision Edge®ActiveFanout Buffer (Distribution), Multiplexer, Translator12:4No/YesLVCMOS, LVTTLLVPECL1GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89834UMG
SY89834UMG
1+5.85294
25+4.88745
100+4.44314
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:4 1GHZ 16MLFTubePrecision Edge®ActiveFanout Buffer (Distribution), Multiplexer, Translator12:4No/YesLVCMOS, LVTTLLVPECL1GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89831UMG-TR
SY89831UMG-TR
1000+4.44314
Increments of 1000
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:4 2GHZ 16MLFTape & Reel (TR)Precision Edge®ActiveFanout Buffer (Distribution), Translator11:4Yes/YesCML, LVDS, LVPECLLVPECL2GHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89830UK4G-TR
SY89830UK4G-TR
1000+3.10012
Increments of 1000
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:4 2.5GHZ 16TSSOPTape & Reel (TR)Precision Edge®ActiveFanout Buffer (Distribution), Multiplexer12:4Yes/YesHSTL, LVECL, LVPECLLVECL, LVPECL2.5GHz2.375 V ~ 5.5 V-40°C ~ 85°CSurface Mount16-TSSOP (0.173", 4.40mm Width)16-TSSOP
SY89829UHY-TR
SY89829UHY-TR
1000+9.55278
Increments of 1000
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:10 2GHZ 64TQFPTape & Reel (TR)Precision Edge®ActiveFanout Buffer (Distribution), Multiplexer22:10Yes/YesLVDS, LVPECLLVPECL2GHz2.37 V ~ 3.6 V-40°C ~ 85°CSurface Mount64-TQFP Exposed Pad64-EP-TQFP
SY89829UHY
SY89829UHY
1+12.598
25+10.502
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:10 2GHZ 64TQFPTrayPrecision Edge®ActiveFanout Buffer (Distribution), Multiplexer22:10Yes/YesLVDS, LVPECLLVPECL2GHz2.37 V ~ 3.6 V-40°C ~ 85°CSurface Mount64-TQFP Exposed Pad64-EP-TQFP
SY89828LHY-TR
SY89828LHY-TR
1000+9.55278
Increments of 1000
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:10 1GHZ 64TQFPTape & Reel (TR)Precision Edge®ActiveFanout Buffer (Distribution), Multiplexer, Translator22:10Yes/YesLVDS, PECLLVDS1GHz3 V ~ 3.6 V-40°C ~ 85°CSurface Mount64-TQFP Exposed Pad64-EP-TQFP
SY89828LHY
SY89828LHY
1+12.598
25+10.502
100+9.55274
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:10 1GHZ 64TQFPTrayPrecision Edge®ActiveFanout Buffer (Distribution), Multiplexer, Translator22:10Yes/YesLVDS, PECLLVDS1GHz3 V ~ 3.6 V-40°C ~ 85°CSurface Mount64-TQFP Exposed Pad64-EP-TQFP
SY89827LHY-TR
SY89827LHY-TR
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUF 4:20/2:10 64TQFPTape & Reel (TR)Precision Edge®ObsoleteFanout Buffer (Distribution), Multiplexer, Translator1 or 24:20, 2:10Yes/YesHSTL, LVPECLHSTL500MHz3.3 V ~ 3.47 V-40°C ~ 85°CSurface Mount64-TQFP Exposed Pad64-EP-TQFP
SY89827LHY
SY89827LHY
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUF 4:20/2:10 64TQFPTrayPrecision Edge®ObsoleteFanout Buffer (Distribution), Multiplexer, Translator1 or 24:20, 2:10Yes/YesHSTL, LVPECLHSTL500MHz3.3 V ~ 3.47 V-40°C ~ 85°CSurface Mount64-TQFP Exposed Pad64-EP-TQFP
SY89826LHY-TR
SY89826LHY-TR
1000+13.9152
Increments of 1000
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:22 1GHZ 64TQFPTape & Reel (TR)Precision Edge®ActiveFanout Buffer (Distribution), Multiplexer, Translator12:22Yes/YesLVDS, LVPECLLVDS1GHz3 V ~ 3.6 V-40°C ~ 85°CSurface Mount64-TQFP Exposed Pad64-EP-TQFP
SY89826LHY
SY89826LHY
1+18.3627
25+15.2984
100+13.9152
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:22 1GHZ 64TQFPTrayPrecision Edge®ActiveFanout Buffer (Distribution), Multiplexer, Translator12:22Yes/YesLVDS, LVPECLLVDS1GHz3 V ~ 3.6 V-40°C ~ 85°CSurface Mount64-TQFP Exposed Pad64-EP-TQFP
SY89825UHY-TR
SY89825UHY-TR
1000+9.55278
Increments of 1000
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:22 2GHZ 64TQFPTape & Reel (TR)Precision Edge®ActiveFanout Buffer (Distribution), Multiplexer, Translator12:22Yes/YesLVDS, LVPECLLVPECL2GHz2.37 V ~ 3.6 V-40°C ~ 85°CSurface Mount64-TQFP Exposed Pad64-EP-TQFP
SY89825UHY
SY89825UHY
1+12.598
25+10.502
100+9.55274
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:22 2GHZ 64TQFPTrayPrecision Edge®ActiveFanout Buffer (Distribution), Multiplexer, Translator12:22Yes/YesLVDS, LVPECLLVPECL2GHz2.37 V ~ 3.6 V-40°C ~ 85°CSurface Mount64-TQFP Exposed Pad64-EP-TQFP
SY89824LHZ-TR
SY89824LHZ-TR
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:22 64TQFPTape & Reel (TR)Precision Edge®ObsoleteFanout Buffer (Distribution), Multiplexer12:22Yes/YesHSTL, LVPECLHSTL-3 V ~ 3.6 V0°C ~ 85°CSurface Mount64-TQFP Exposed Pad64-EP-TQFP
SY89824LHZ
SY89824LHZ
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:22 64TQFPTrayPrecision Edge®ObsoleteFanout Buffer (Distribution), Multiplexer12:22Yes/YesHSTL, LVPECLHSTL-3 V ~ 3.6 V0°C ~ 85°CSurface Mount64-TQFP Exposed Pad64-EP-TQFP
SY89823LHY-TR
SY89823LHY-TR
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:22 500MHZ 64TQFPTape & Reel (TR)Precision Edge®ObsoleteFanout Buffer (Distribution), Multiplexer, Translator12:22Yes/YesHSTL, LVPECLHSTL500MHz3.15 V ~ 3.45 V-40°C ~ 85°CSurface Mount64-TQFP Exposed Pad64-EP-TQFP
SY89823LHY
SY89823LHY
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:22 500MHZ 64TQFPTrayPrecision Edge®ObsoleteFanout Buffer (Distribution), Multiplexer, Translator12:22Yes/YesHSTL, LVPECLHSTL500MHz3.15 V ~ 3.45 V-40°C ~ 85°CSurface Mount64-TQFP Exposed Pad64-EP-TQFP
SY89809LTH-TR
SY89809LTH-TR
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:9 500MHZ 32TQFPTape & Reel (TR)Precision Edge®ObsoleteFanout Buffer (Distribution), Multiplexer12:9Yes/YesHSTL, LVPECLHSTL500MHz3 V ~ 3.6 V0°C ~ 85°CSurface Mount32-TQFP32-TQFP (7x7)
SY89809LTH
SY89809LTH
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:9 500MHZ 32TQFPTrayPrecision Edge®ObsoleteFanout Buffer (Distribution), Multiplexer12:9Yes/YesHSTL, LVPECLHSTL500MHz3 V ~ 3.6 V0°C ~ 85°CSurface Mount32-TQFP32-TQFP (7x7)
SY89808LTG-TR
SY89808LTG-TR
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:9 500MHZ 32TQFPTape & Reel (TR)Precision Edge®ObsoleteFanout Buffer (Distribution), Multiplexer, Translator12:9Yes/YesHSTL, LVPECLHSTL500MHz3.15 V ~ 3.45 V-40°C ~ 85°CSurface Mount32-TQFP32-TQFP (7x7)
SY89808LTG-1
SY89808LTG
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 2:9 500MHZ 32TQFPTrayPrecision Edge®ObsoleteFanout Buffer (Distribution), Multiplexer, Translator12:9Yes/YesHSTL, LVPECLHSTL500MHz3.15 V ~ 3.45 V-40°C ~ 85°CSurface Mount32-TQFP32-TQFP (7x7)
SY89645LK4G-TR
SY89645LK4G-TR
1000+2.38315
Increments of 1000
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:4 650MHZ 20TSSOPTape & Reel (TR)Precision Edge®ActiveFanout Buffer (Distribution)11:4No/YesLVCMOS, LVTTLLVDS650MHz3.135 V ~ 3.465 V-40°C ~ 85°CSurface Mount20-TSSOP (0.173", 4.40mm Width)20-TSSOP