ManufacturerPackagingSeriesPart StatusTypeNumber of CircuitsRatio - Input:OutputDifferential - Input:OutputInputOutputFrequency - MaxVoltage - SupplyOperating TemperatureMounting TypePackage / CaseSupplier Device Package
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Circuits
Ratio - Input:Output
Differential - Input:Output ...
Input
Output
Frequency - Max
Voltage - Supply
Operating Temperature ...
Mounting Type
Package / Case
Supplier Device Package ...
CY7B991V-7JCT
CY7B991V-7JCT
Leadtime
2-3 weeks		Cypress Semiconductor CorpIC CLK BUFFER 8:8 80MHZ 32PLCCTape & Reel (TR)RoboClock™ObsoleteBuffer/Driver18:8Yes/Yes3-StateLVTTL80MHz2.97 V ~ 3.63 V0°C ~ 70°CSurface Mount32-LCC (J-Lead)32-PLCC (11.43x13.97)
SY54011RMG
SY54011RMG
1+6.44118
25+5.37216
100+4.88745
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:2 3.2GHZ 16MLFTubePrecision Edge®ActiveFanout Buffer (Distribution)11:2Yes/YesCML, LVDS, LVPECLCML3.2GHz2.375 V ~ 2.625 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89876LMI TR-Cut
SY89876LMI TR
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:2 2GHZ 16MLFCut Tape (CT)Precision Edge®ObsoleteFanout Buffer (Distribution), Divider11:2Yes/YesCML, HSTL, LVDS, LVPECLLVDS2GHz2.97 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad, 16-MLF®16-MLF® (3x3)
SY89311UMG-TR-Cut
SY89311UMG-TR
1+3.59804
25+2.99922
100+2.72647
Increments of 1
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:2 3GHZ 8MLFCut Tape (CT)Precision Edge®Fanout Buffer (Distribution)11:2Yes/YesECL, PECLECL, PECL3GHz2.375 V ~ 5.5 V-40°C ~ 85°CSurface Mount8-VFDFN Exposed Pad, 8-MLF®8-MLF® (2x2)
SY10E111LEJZ
SY10E111LEJZ
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:9 28PLCCTube100E, Precision Edge®ObsoleteFanout Buffer (Distribution)11:9Yes/YesPECLPECL-3 V ~ 5.5 V0°C ~ 85°CSurface Mount28-LCC (J-Lead)28-PLCC (11.51x11.51)
SY10E111LJZ
SY10E111LJZ
Leadtime
2-3 weeks		Microchip TechnologyIC CLK BUFFER 1:9 28PLCCTube100E, Precision Edge®ObsoleteFanout Buffer (Distribution)11:9Yes/YesPECLPECL-3 V ~ 3.8 V0°C ~ 85°CSurface Mount28-LCC (J-Lead)28-PLCC (11.51x11.51)
NBSG11MAG
NBSG11MAG
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 1:2 12GHZ 16LGATube-ObsoleteFanout Buffer (Distribution)11:2Yes/YesCML, LVCMOS, LVDS, LVTTL, NECL, RSNECL, PECLRSECL, RSNECL, RSPECL12GHz2.375 V ~ 3.465 V-40°C ~ 70°CSurface Mount16-TLGA16-LGA (4x4)
NB6N11SMNR2G
NB6N11SMNR2G
3000+4.90686
Increments of 3000
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 1:2 2GHZ 16QFNTape & Reel (TR)AnyLevel™ ECLinPS MAX™ActiveFanout Buffer (Distribution), Translator11:2Yes/YesCML, LVCMOS, LVDS, LVPECL, LVTTLLVDS2GHz3 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad16-QFN (3x3)
NB6N11SMNG
NB6N11SMNG
1+8.98039
10+8.11569
100+6.71863
500+5.85049
1000+5.09559
Increments of 1
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 1:2 2GHZ 16QFNTubeAnyLevel™ ECLinPS MAX™ActiveFanout Buffer (Distribution), Translator11:2Yes/YesCML, LVCMOS, LVDS, LVPECL, LVTTLLVDS2GHz3 V ~ 3.6 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad16-QFN (3x3)
NB6L611MNR2G
NB6L611MNR2G
3000+3.5049
Increments of 3000
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 1:2 4GHZ 16QFNTape & Reel (TR)ECLinPS MAX™ActiveFanout Buffer (Distribution)11:2Yes/YesCML, LVCMOS, LVDS, LVPECL, LVTTLLVPECL4GHz2.375 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad16-QFN (3x3)
NB6L611MNG
NB6L611MNG
1+6.42157
10+5.79706
100+4.79902
500+4.17892
1000+3.63971
Increments of 1
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 1:2 4GHZ 16QFNTubeECLinPS MAX™ActiveFanout Buffer (Distribution)11:2Yes/YesCML, LVCMOS, LVDS, LVPECL, LVTTLLVPECL4GHz2.375 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad16-QFN (3x3)
NB6L14MNR2G
NB6L14MNR2G
3000+6.83922
Increments of 3000
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 1:4 3GHZ 16QFNTape & Reel (TR)ECLinPS MAX™ActiveFanout Buffer (Distribution)11:4Yes/YesCML, LVCMOS, LVDS, LVPECL, LVTTLLVCMOS, LVPECL3GHz2.375 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad16-QFN (3x3)
NB6L14MNG
NB6L14MNG
1+11.2255
10+10.3127
100+8.70931
500+7.74755
1000+7.10637
Increments of 1
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 1:4 3GHZ 16QFNTubeECLinPS MAX™ActiveFanout Buffer (Distribution)11:4Yes/YesCML, LVCMOS, LVDS, LVPECL, LVTTLLVCMOS, LVPECL3GHz2.375 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad16-QFN (3x3)
NB6L14MMNR2G
NB6L14MMNR2G
3000+6.83922
Increments of 3000
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 1:4 3GHZ 16QFNTape & Reel (TR)ECLinPS MAX™ActiveFanout Buffer (Distribution)11:4Yes/YesCML, LVDS, LVPECLCML3GHz2.375 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad16-QFN (3x3)
NB6L14MMNG
NB6L14MMNG
1+11.2255
10+10.3127
100+8.70931
500+7.74755
1000+7.10637
Increments of 1
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 1:4 3GHZ 16QFNTubeECLinPS MAX™ActiveFanout Buffer (Distribution)11:4Yes/YesCML, LVDS, LVPECLCML3GHz2.375 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad16-QFN (3x3)
NB6L11MMNR2G
NB6L11MMNR2G
3000+5.09804
Increments of 3000
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 1:2 4GHZ 16QFNTape & Reel (TR)ECLinPS MAX™ActiveFanout Buffer (Distribution)11:2Yes/YesCML, LVCMOS, LVDS, LVNECL, LVPECL, LVTTLCML4GHz2.375 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad16-QFN (3x3)
NB6L11MMNG
NB6L11MMNG
1+9.33333
10+8.43137
100+6.98039
500+6.07843
1000+5.29412
Increments of 1
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 1:2 4GHZ 16QFNTubeECLinPS MAX™ActiveFanout Buffer (Distribution)11:2Yes/YesCML, LVCMOS, LVDS, LVNECL, LVPECL, LVTTLCML4GHz2.375 V ~ 3.63 V-40°C ~ 85°CSurface Mount16-VFQFN Exposed Pad16-QFN (3x3)
NB4N121KMNR2G
NB4N121KMNR2G
2000+5.09804
Increments of 2000
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 1:21 400MHZ 52QFNTape & Reel (TR)-ActiveFanout Buffer (Distribution)11:21Yes/YesCML, LVCMOS, LVDS, LVPECL, LVTTLHCSL400MHz3 V ~ 3.6 V-40°C ~ 70°CSurface Mount52-VFQFN Exposed Pad52-QFN (8x8)
NB4N121KMNG
NB4N121KMNG
260+6.66667
Increments of 260
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 1:21 400MHZ 52QFNTray-ActiveFanout Buffer (Distribution)11:21Yes/YesCML, LVCMOS, LVDS, LVPECL, LVTTLHCSL400MHz3 V ~ 3.6 V-40°C ~ 70°CSurface Mount52-VFQFN Exposed Pad52-QFN (8x8)
NB4N111KMNR4G
NB4N111KMNR4G
1000+6.35294
Increments of 1000
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 1:10 400MHZ 32QFNTape & Reel (TR)-ActiveFanout Buffer (Distribution)11:10Yes/YesCML, LVCMOS, LVDS, LVPECL, LVTTLHCSL400MHz3 V ~ 3.6 V-40°C ~ 70°CSurface Mount32-VFQFN Exposed Pad32-QFN (5x5)
NB4N111KMNG
NB4N111KMNG
74+9.64706
Increments of 74
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 1:10 400MHZ 32QFNTube-ActiveFanout Buffer (Distribution)11:10Yes/YesCML, LVCMOS, LVDS, LVPECL, LVTTLHCSL400MHz3 V ~ 3.6 V-40°C ~ 70°CSurface Mount32-VFQFN Exposed Pad32-QFN (5x5)
NB4L6254FAR2G
NB4L6254FAR2G
2000+11.2941
Increments of 2000
Leadtime
2-3 weeks		ON SemiconductorIC CLK MULTI 1:6/1:3 3GHZ 32LQFPTape & Reel (TR)-ActiveMultiplexer, Switch1 or 21:6, 1:3Yes/YesLVCMOS, LVPECLLVPECL3GHz2.375 V ~ 3.465 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
NB4L6254FAG
NB4L6254FAG
250+13.6765
Increments of 250
Leadtime
2-3 weeks		ON SemiconductorIC CLK MULTI 1:6/1:3 3GHZ 32LQFPTray-ActiveMultiplexer, Switch1 or 21:6, 1:3Yes/YesLVCMOS, LVPECLLVPECL3GHz2.375 V ~ 3.465 V-40°C ~ 85°CSurface Mount32-LQFP32-LQFP (7x7)
NB4L339MNR4G
NB4L339MNR4G
1000+14.6569
Increments of 1000
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 2:4 700MHZ 32QFNTape & Reel (TR)-ActiveFanout Buffer (Distribution), Divider, Multiplexer12:4Yes/YesCML, LVDS, LVPECLLVPECL700MHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad32-QFN (5x5)
NB4L339MNG
NB4L339MNG
74+19.1667
Increments of 74
Leadtime
2-3 weeks		ON SemiconductorIC CLK BUFFER 2:4 700MHZ 32QFNTube-ActiveFanout Buffer (Distribution), Divider, Multiplexer12:4Yes/YesCML, LVDS, LVPECLLVPECL700MHz2.375 V ~ 3.6 V-40°C ~ 85°CSurface Mount32-VFQFN Exposed Pad32-QFN (5x5)