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Easy Board 
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GSM / 3G / LTE / IoT Module 
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Memory & Data Acquisition IC 
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| Manufacturer | Assmann WSW Components |
| Series | - |
| Part Status | Active |
| Type | Top Mount |
| Package Cooled | 6-Dip and 8-Dip |
| Attachment Method | Press Fit |
| Shape | Rectangular, Fins |
| Length | 0.334" (8.50mm) |
| Width | 0.250" (6.35mm) |
| Diameter | - |
| Height Off Base (Height of Fin) | 0.189" (4.80mm) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | - |
| Thermal Resistance @ Natural | 80°C/W |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Standard Package | 250 |
HEATSINK 25X25X15MM R-TAB
HEATSINK 50X50X25MM XCUT
HEATSINK 36.83X57.6X22.86MM T412
HEATSINK 70X70X25MM XCUT T766
HEATSINK 60X60X6MM XCUT
HEATSINK 40X40X15MM L-TAB T766
HEATSINK 45X45X30MM R-TAB T766
HEATSINK 25X25X10MM L-TAB T412
HEATSINK 45X45X30MM L-TAB T412
SUPERGRIP HEATSINK 23X23X12.5MM
HEATSINK 36.83X57.6X22.86MM T766
HEATSINK 25X25X10MM R-TAB T412
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