Manufacturer | t-Global Technology |
Series | PH3n |
Part Status | Active |
Type | Heat Spreader |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method | Adhesive |
Shape | Rectangular |
Length | 2.000" (50.80mm) |
Width | 0.500" (12.70mm) |
Diameter | - |
Height Off Base (Height of Fin) | 0.002" (0.06mm) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | - |
Thermal Resistance @ Natural | - |
Material | Copper |
Material Finish | Polyester |
Standard Package | 1 |
HEATSINK 25X25X15MM R-TAB
HEATSINK 50X50X25MM XCUT
HEATSINK 36.83X57.6X22.86MM T412
HEATSINK 70X70X25MM XCUT T766
HEATSINK 60X60X6MM XCUT
HEATSINK 40X40X15MM L-TAB T766
HEATSINK 45X45X30MM R-TAB T766
HEATSINK 25X25X10MM L-TAB T412
HEATSINK 45X45X30MM L-TAB T412
SUPERGRIP HEATSINK 23X23X12.5MM
HEATSINK 36.83X57.6X22.86MM T766
HEATSINK 25X25X10MM R-TAB T412