ManufacturerSeriesPart StatusTypePackage CooledAttachment MethodShapeLengthWidthDiameterHeight Off Base (Height of Fin)Power Dissipation @ Temperature RiseThermal Resistance @ Forced Air FlowThermal Resistance @ NaturalMaterialMaterial Finish
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Series
Part Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Height Off Base (Height ...
Power Dissipation ...
Thermal Resistance ...
Thermal Resistance ...
Material
Material Finish
V8511Z
V8511Z
1+1.66667
10+1.44118
25+1.36275
50+1.30392
100+1.25176
Increments of 1
Leadtime
2-3 weeks
Assmann WSW ComponentsHEATSINK ALUM ANOD-ActiveBoard Level, VerticalSOT-32, TO-220, TOP-3Bolt On and PC PinRectangular, Fins2.500" (63.50mm)1.638" (41.60mm)-0.984" (25.00mm)--3.5°C/WAluminumBlack Anodized
634-10ABPE
634-10ABPE
1+1.64706
10+1.56176
25+1.52039
50+1.47941
100+1.39716
Increments of 1
Leadtime
2-3 weeks
Wakefield-VetteHEATSINK TO-220 VERT MT BLK 1""634ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins1.000" (25.40mm)0.640" (16.26mm)-0.640" (16.26mm)---AluminumBlack Anodized
V8818Q
V8818Q
1+1.63725
10+1.41667
25+1.34
50+1.28235
100+1.23108
Increments of 1
Leadtime
2-3 weeks
Assmann WSW ComponentsHEATSINK ALUM ANOD-ActiveBoard LevelSOT-32, TO-220Bolt On and PC PinRectangular, Fins1.575" (40.01mm)0.748" (19.00mm)-0.844" (21.44mm)--8.8°C/WAluminumBlack Anodized
628-40AB
628-40AB
1+1.62745
10+1.54314
25+1.50196
50+1.46157
100+1.38029
Increments of 1
Leadtime
2-3 weeks
Wakefield-VetteHEATSINK CPU 43MM SQ BLK H=.4""628ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Thermal Tape, Adhesive (Not Included)Square, Pin Fins1.750" (44.45mm)1.700" (43.18mm)-0.400" (10.16mm)2.5W @ 30°C4°C/W @ 300 LFM-AluminumBlack Anodized
529701B02500G
529701B02500G
1+1.5
10+1.42941
25+1.39176
50+1.35431
100+1.27902
Increments of 1
Leadtime
2-3 weeks
Aavid ThermalloyHEATSINK TO-218 SOLDER PIN-ActiveBoard Level, VerticalTO-218Bolt On and PC PinRectangular, Fins1.000" (25.40mm)1.650" (41.91mm)-1.000" (25.40mm)12W @ 70°C4.0°C/W @ 200 LFM5.5°C/WAluminumBlack Anodized
3083
3083
1+1.47059
Increments of 1
Leadtime
2-3 weeks
Adafruit Industries LLCALUMINUM HEAT SINK FOR RASPBERRY-ActiveTop MountRaspberry PiThermal Tape, Adhesive (Included)Square0.551" (14.00mm)0.545" (13.84mm)-0.315" (8.00mm)---Aluminum-
V8511Y
V8511Y
1+1.44118
10+1.24118
25+1.17412
50+1.12353
100+1.07863
Increments of 1
Leadtime
2-3 weeks
Assmann WSW ComponentsHEATSINK ALUM ANOD-ActiveBoard Level, VerticalSOT-32, TO-220, TOP-3Bolt On and PC PinRectangular, Fins2.000" (50.80mm)1.638" (41.60mm)-0.984" (25.00mm)--4°C/WAluminumBlack Anodized
V7466Z
V7466Z
1+1.43137
10+1.23725
25+1.1698
50+1.11961
100+1.0748
Increments of 1
Leadtime
2-3 weeks
Assmann WSW ComponentsHEATSINK ALUM ANOD-ActiveBoard Level, VerticalSOT-32, TO-220, TOP-3Bolt On and PC PinRectangular, Fins2.500" (63.50mm)1.772" (45.00mm)-0.500" (12.70mm)--5.6°C/WAluminumBlack Anodized
V5220L
V5220L
1+1.42157
10+1.23039
25+1.16392
50+1.11373
100+1.06922
Increments of 1
Leadtime
2-3 weeks
Assmann WSW ComponentsHEATSINK ALUM ANOD TO-220-ActiveBoard LevelTO-220Bolt OnRectangular, Fins1.181" (30.00mm)1.260" (32.00mm)-0.787" (19.99mm)--8°C/WAluminumBlack Anodized
PH3N-101.6-38.1-0.07-1A
PH3N-101.6-38.1-0.07-1A
1+1.41176
10+1.33627
25+1.30157
50+1.26627
100+1.19598
Increments of 1
Leadtime
2-3 weeks
t-Global TechnologyPH3N NANO 101.6X38.1X0.07MMPH3nActiveHeat SpreaderAssorted (BGA, LGA, CPU, ASIC...)AdhesiveRectangular4.000" (101.60mm)1.500" (38.10mm)-0.003" (0.07mm)---CopperPolyester
V5229L
V5229L
1+1.41176
10+1.21765
25+1.15137
50+1.10196
100+1.05784
Increments of 1
Leadtime
2-3 weeks
Assmann WSW ComponentsHEATSINK ALUM ANOD-ActiveTop MountTO-220Bolt OnRectangular, Fins1.181" (30.00mm)1.260" (32.00mm)-0.551" (14.00mm)---AluminumBlack Anodized
V-1102-SMD/A-L
V-1102-SMD/A-L
1+1.39216
10+1.20294
25+1.13725
50+1.08824
100+1.04471
Increments of 1
Leadtime
2-3 weeks
Assmann WSW ComponentsHEATSINK TO-263 19.38X25.40MM-ActiveTop MountTO-263SMD PadRectangular0.763" (19.38mm)1.000" (25.40mm)-0.450" (11.43mm)--23°C/WCopperTin
PH3-76.2-25.4-0.21-1A
PH3-76.2-25.4-0.21-1A
1+1.38235
10+1.31765
25+1.28275
50+1.24804
100+1.17863
Increments of 1
Leadtime
2-3 weeks
t-Global TechnologyPH3 76.2X25.4X0.21MMPH3ActiveHeat SpreaderAssorted (BGA, LGA, CPU, ASIC...)AdhesiveRectangular3.000" (76.20mm)1.000" (25.40mm)-0.008" (0.21mm)---CopperPolyester
DV-T263-201E-TR-2
DV-T263-201E-TR
1+1.76471
10+1.68039
25+1.63608
50+1.59176
100+1.50333
Increments of 1
Leadtime
2-3 weeks
OhmiteHEATSINK FOR TO-263DActiveTop MountTO-263Solderable FeetRectangular, Fins0.500" (12.70mm)1.020" (25.91mm)-0.480" (12.19mm)2W @ 30°C8°C/W @ 500 LFM-AluminumDegreased
DV-T263-201E-TR-1
DV-T263-201E-TR
1+1.76471
10+1.68039
25+1.63608
50+1.59176
100+1.50333
Increments of 1
Leadtime
2-3 weeks
OhmiteHEATSINK FOR TO-263DActiveTop MountTO-263Solderable FeetRectangular, Fins0.500" (12.70mm)1.020" (25.91mm)-0.480" (12.19mm)2W @ 30°C8°C/W @ 500 LFM-AluminumDegreased
DV-T263-201E-TR
DV-T263-201E-TR
200+1.36667
400+1.28627
600+1.20588
1000+1.12549
5000+1.08529
Increments of 200
Leadtime
2-3 weeks
OhmiteHEATSINK FOR TO-263DActiveTop MountTO-263Solderable FeetRectangular, Fins0.500" (12.70mm)1.020" (25.91mm)-0.480" (12.19mm)2W @ 30°C8°C/W @ 500 LFM-AluminumDegreased
PH3N-101.6-38.1-0.062-1A
PH3N-101.6-38.1-0.062-1A
1+1.28431
10+1.22059
25+1.18824
50+1.15627
100+1.09196
Increments of 1
Leadtime
2-3 weeks
t-Global TechnologyPH3N NANO 101.6X38.1X0.062MMPH3nActiveHeat SpreaderAssorted (BGA, LGA, CPU, ASIC...)AdhesiveRectangular4.000" (101.60mm)1.500" (38.10mm)-0.002" (0.06mm)---CopperPolyester
V8813Y
V8813Y
1+1.28431
10+1.11176
25+1.05294
50+1.00451
100+0.960882
Increments of 1
Leadtime
2-3 weeks
Assmann WSW ComponentsHEATSINK TO-220/TOP-3/SOT-32-ActiveBoard Level, VerticalSOT-32, TO-220, TOP-3Bolt On and PC PinRectangular, Fins1.969" (50.00mm)1.359" (34.50mm)-0.492" (12.50mm)--4°C/WAluminumBlack Anodized
V8511X
V8511X
1+1.27451
10+1.10196
25+1.04471
50+0.996471
100+0.953137
Increments of 1
Leadtime
2-3 weeks
Assmann WSW ComponentsHEATSINK ALUM ANOD-ActiveBoard Level, VerticalSOT-32, TO-220, TOP-3Bolt On and PC PinRectangular, Fins1.500" (38.10mm)1.638" (41.60mm)-0.984" (25.00mm)--5°C/WAluminumBlack Anodized
501503B00000G
501503B00000G
1+1.21569
10+1.15294
25+1.12275
50+1.09235
100+1.03176
Increments of 1
Leadtime
2-3 weeks
Aavid ThermalloyHEATSINK TO-3 1.00"" BLK-ActiveBoard LevelTO-3Bolt OnRhombus1.88" (47.75mm)1.400" (35.56mm)-1.000" (25.40mm)5W @ 40°C2.0°C/W @ 500 LFM8.4°C/WAluminumBlack Anodized
XL25-40-40-3
XL25-40-40-3
1+1.18627
10+1.13137
25+1.10157
50+1.07176
100+1.01225
Increments of 1
Leadtime
2-3 weeks
t-Global TechnologyXL25 CERAMIC BOARD 40X40X3MMXL-25ActiveHeat SpreaderAssorted (BGA, LGA, CPU, ASIC...)-Square1.575" (40.01mm)1.575" (40.01mm)-0.118" (3.00mm)---Ceramic-
V7238SN
V7238SN
1+1.17647
10+1.01275
25+0.959608
50+0.915294
100+0.87549
Increments of 1
Leadtime
2-3 weeks
Assmann WSW ComponentsHEATSINK ALUM ANOD-ActiveBoard Level, VerticalTO-220Bolt On and Board MountsRectangular, Fins1.102" (27.99mm)0.728" (18.50mm)-0.590" (15.00mm)--16°C/WAluminumTin
PH3-76.2-19.1-0.21-1A
PH3-76.2-19.1-0.21-1A
1+1.16667
10+1.10392
25+1.07529
50+1.04608
100+0.988039
Increments of 1
Leadtime
2-3 weeks
t-Global TechnologyPH3 76.2X19.1X0.21MMPH3ActiveHeat SpreaderAssorted (BGA, LGA, CPU, ASIC...)AdhesiveRectangular3.000" (76.20mm)0.750" (19.05mm)-0.008" (0.21mm)---CopperPolyester
XLI98C-30-2.15-P
XLI98C-30-2.15-P
1+1.16667
10+1.10392
25+1.07529
50+1.04608
100+0.988039
Increments of 1
Leadtime
2-3 weeks
t-Global TechnologyXL25 CERAMIC 30X30MM W/LI98C ADHXL-25ActiveHeat SpreaderAssorted (BGA, LGA, CPU, ASIC...)Thermal Tape, Adhesive (Included)Square1.181" (30.00mm)1.181" (30.00mm)-0.085" (2.15mm)---Ceramic-
V4330K
V4330K
1+1.15686
10+0.997059
25+0.944706
50+0.90098
100+0.861863
Increments of 1
Leadtime
2-3 weeks
Assmann WSW ComponentsHEATSINK ANOD ALUM-ActiveBoard LevelKLPBolt OnRectangular, Fins1.476" (37.50mm)1.142" (29.00mm)-0.472" (12.00mm)--11°C/WAluminumBlack Anodized