Online Electronic Components
Easy Board 
Development Board 
GSM / 3G / LTE / IoT Module 
GNSS Module 
Short Range Module 
GPS / GSM / 3G / Wifi / ISM Antenna 
Memory & Data Acquisition IC 
Clock/Timing & Linear IC 
Power Management IC 
Digital Logic IC 
Interface IC 
Embedded MCU 
Discrete Semiconductor 
Resistors 
Potentiometers, Variable Resistors 
Capacitors 
Optoelectronics 
Crystals, Oscillators, Resonators 
| Manufacturer | Omron Electronics Inc-EMC Div |
| Packaging | Bulk |
| Series | XR2 |
| Part Status | Active |
| Type | Housing |
| Number of Positions or Pins (Grid) | 20 (1 x 20) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | - |
| Contact Finish Thickness - Mating | - |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | - |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | - |
| Contact Finish Thickness - Post | - |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Operating Temperature | -55°C ~ 125°C |
| Standard Package | 1,000 |
CONN SOCKET SIP 30POS TIN
CONN IC DIP SOCKET 20POS GOLD
ADAPTOR PLUG
CONN SOCKET SIP 8POS TIN
CONN SOCKET PLCC 84POS GOLD
CONN IC DIP SOCKET 18POS GOLD
CONN SOCKET PGA 289POS GOLD
CONN IC DIP SOCKET 12POS GOLD
CONN IC DIP SOCKET 2POS GOLD
CONN IC DIP SOCKET 12POS TIN
510-AG91D20-IES-LF= SPECIAL SIP,
CONN IC DIP SOCKET 4POS GOLD
English
Vietnam
