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| Manufacturer | Aries Electronics |
| Packaging | Bulk |
| Series | 57 |
| Part Status | Active |
| Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) | 48 (2 x 24) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Tin |
| Contact Finish Thickness - Mating | 200µin (5.08µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 200µin (5.08µm) |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature | - |
| Standard Package | 6 |
CONN SOCKET SIP 30POS TIN
CONN IC DIP SOCKET 20POS GOLD
ADAPTOR PLUG
CONN SOCKET SIP 8POS TIN
CONN SOCKET PLCC 84POS GOLD
CONN IC DIP SOCKET 18POS GOLD
CONN SOCKET PGA 289POS GOLD
CONN IC DIP SOCKET 12POS GOLD
CONN IC DIP SOCKET 2POS GOLD
CONN IC DIP SOCKET 12POS TIN
510-AG91D20-IES-LF= SPECIAL SIP,
CONN IC DIP SOCKET 4POS GOLD
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