ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
110-93-324-41-001000
110-93-324-41-001000
1+2.45098
10+2.03333
50+1.69412
100+1.50588
250+1.31765
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 24POS GOLDTube110ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
84-537-21
84-537-21
1+217.941
25+204.829
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN SOCKET PLCC ZIF 84POS GOLD-537ActivePLCC, ZIF (ZIP)84 (4 x 21)0.100" (2.54mm)Gold12µin (0.30µm)-Surface MountClosed Frame-------
25-0511-10
25-0511-10
1+6.83333
25+5.51765
100+4.46667
500+3.67843
1000+3.41569
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN SOCKET SIP 25POS TINBulk511ActiveSIP25 (1 x 25)0.100" (2.54mm)Tin50µin (1.27µm)Phosphor BronzeThrough Hole-Solder0.100" (2.54mm)Tin50µin (1.27µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
214-99-316-01-670800
214-99-316-01-670800
1+1.60784
10+1.33431
25+1.23529
50+1.11176
100+0.988235
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 16POS TINLEADTube214ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Tin-Lead100µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-13-632-41-001000
110-13-632-41-001000
1+4.73529
10+3.91569
50+3.26275
100+2.93647
250+2.70808
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 32POS GOLDTube110ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
12-0511-10
12-0511-10
1+4.54902
25+3.52941
100+2.82353
500+2.35294
1000+2.08627
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN SOCKET SIP 12POS TINBulk511ActiveSIP12 (1 x 12)0.100" (2.54mm)Tin50µin (1.27µm)Phosphor BronzeThrough Hole-Solder0.100" (2.54mm)Tin50µin (1.27µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
110-13-628-41-001000
110-13-628-41-001000
1+4.13725
10+3.42549
50+2.8549
100+2.56941
250+2.36957
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 28POS GOLDTube110ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-13-328-41-001000
110-13-328-41-001000
1+4.13725
10+3.42549
50+2.8549
100+2.56941
250+2.36957
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 28POS GOLDTube110ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-13-624-41-001000
110-13-624-41-001000
1+3.54902
10+2.93627
50+2.44706
100+2.20235
250+2.03106
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 24POS GOLDTube110ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-93-318-41-001000
110-93-318-41-001000
1+1.83333
10+1.52451
50+1.27059
100+1.12941
250+0.988235
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 18POS GOLDTube110ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
14-810-90R
14-810-90R
1+8.11765
25+7.05882
100+5.64706
500+4.76471
1000+4.5
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 14POS TINBulkVertisockets™ 800ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Tin50µin (1.27µm)Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin50µin (1.27µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
20-0511-10
20-0511-10
1+6.08824
25+4.72078
100+3.77647
500+3.14706
1000+2.79039
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN SOCKET SIP 20POS TINBulk511ActiveSIP20 (1 x 20)0.100" (2.54mm)Tin50µin (1.27µm)Phosphor BronzeThrough Hole-Solder0.100" (2.54mm)Tin50µin (1.27µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
25-0513-10
25-0513-10
1+4.06863
25+3.15451
100+2.52353
500+2.10294
1000+1.86461
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN SOCKET SIP 25POS GOLDBulk0513ActiveSIP25 (1 x 25)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
110-93-320-41-001000
110-93-320-41-001000
1+2.03922
10+1.69412
50+1.41176
100+1.2549
250+1.09804
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 20POS GOLDTube110ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-93-314-41-001000
110-93-314-41-001000
1+1.66667
10+1.29608
50+1.09804
100+0.988235
250+0.83451
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 14POS GOLDTube110ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-93-308-41-001000
110-93-308-41-001000
1+0.95098
10+0.740196
25+0.690196
50+0.627451
100+0.564706
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 8POS GOLDTube110ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C