ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
40-526-10
40-526-10
1+10.7059
25+9.36784
100+8.29706
500+6.95882
1000+6.69118
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 40POS TINBulkLo-PRO®file, 526ActiveDIP, ZIF (ZIP)40 (2 x 20)0.100" (2.54mm)Tin10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin10µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
117-93-668-41-005000
117-93-668-41-005000
144+5.67219
Increments of 144
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 68POS GOLDTube117ActiveDIP, 0.6" (15.24mm) Row Spacing68 (2 x 34)0.070" (1.78mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
20-823-90
20-823-90
1+10.3235
25+8.98039
100+7.18431
500+6.06176
1000+5.725
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 20POS GOLDBulkVertisockets™ 800ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
110-13-316-41-001000
110-13-316-41-001000
1+2.64706
10+2.20196
25+2.03922
50+1.83529
100+1.63137
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 16POS GOLDTube110ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
123-13-624-41-001000
123-13-624-41-001000
192+4.55331
Increments of 192
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 24POS GOLDTube123ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Gold10µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-93-316-41-001000
110-93-316-41-001000
1+1.62745
10+1.3549
25+1.2549
50+1.12941
100+1.00392
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 16POS GOLDTube110ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
117-93-664-41-005000
117-93-664-41-005000
152+5.6833
Increments of 152
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 64POS GOLDTube117ActiveDIP, 0.6" (15.24mm) Row Spacing64 (2 x 32)0.070" (1.78mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
214-99-640-01-670800
214-99-640-01-670800
1+3.29412
10+2.72745
50+2.27255
100+2.04529
250+1.88624
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 40POS TINLEADTube214ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin-Lead100µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
24-516-10
24-516-10
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 24POS TINBulk516ObsoleteDIP, ZIF (ZIP)24 (2 x 12)0.100" (2.54mm)Tin10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin10µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-
40-516-10
40-516-10
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 40POS TINBulk516ObsoleteDIP, ZIF (ZIP)40 (2 x 20)0.100" (2.54mm)Tin10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin10µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-
C9140-00
C9140-00
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 40POS GOLDBulkEdge-Grip™, C91ObsoleteDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
C9128-00
C9128-00
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 28POS GOLDBulkEdge-Grip™, C91ObsoleteDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
C9124-00
C9124-00
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 24POS GOLDBulkEdge-Grip™, C91ObsoleteDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
C9122-00
C9122-00
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 22POS GOLDBulkEdge-Grip™, C91ObsoleteDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
C9120-00
C9120-00
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 20POS GOLDBulkEdge-Grip™, C91ObsoleteDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
C9118-00
C9118-00
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 18POS GOLDBulkEdge-Grip™, C91ObsoleteDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
C9116-00
C9116-00
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 16POS GOLDBulkEdge-Grip™, C91ObsoleteDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
C9114-00
C9114-00
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 14POS GOLDBulkEdge-Grip™, C91ObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
C9108-00
C9108-00
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 8POS GOLDBulkEdge-Grip™, C91ObsoleteDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
C8140-04
C8140-04
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 40POS TINBulkEdge-Grip™, C81ObsoleteDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
C8128-04
C8128-04
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 28POS TINBulkEdge-Grip™, C81ObsoleteDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
C8124-04
C8124-04
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 24POS TINBulkEdge-Grip™, C81ObsoleteDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
C8122-04
C8122-04
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 22POS TINBulkEdge-Grip™, C81ObsoleteDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
C8120-04
C8120-04
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 20POS TINBulkEdge-Grip™, C81ObsoleteDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
C8118-04
C8118-04
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 18POS TINBulkEdge-Grip™, C81ObsoleteDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C