ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
2-640379-4
2-640379-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 40POS GOLDTubeDiplomate DLObsoleteDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
2-640362-4
2-640362-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 28POS GOLDTubeDiplomate DLObsoleteDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
2-640361-4
2-640361-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 24POS GOLDTubeDiplomate DLObsoleteDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold15µin (0.38µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Beryllium CopperThermoplastic-55°C ~ 125°C
2-640464-4
2-640464-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 20POS GOLDTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
2-640359-4
2-640359-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 18POS GOLDTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic-55°C ~ 125°C
2-640358-4
2-640358-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 16POS GOLDTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 105°C
2-640357-4
2-640357-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 14POS GOLDTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 105°C
2-640463-4
2-640463-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 8POS GOLDTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
2-641296-4
2-641296-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 6POS GOLDTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
48-6554-11
48-6554-11
1+20.5294
25+19.1608
100+17.7922
500+17.1078
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 48POS GLDBulk55ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Gold-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold-Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
48-6554-10
48-6554-10
1+14.2647
25+13.0498
100+11.749
500+10.7
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 48POS TINBulk55ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
40-6554-11
40-6554-11
1+17.549
25+16.3745
100+15.2049
500+14.6201
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 40POS GLDBulk55ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold-Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
40-6554-10
40-6554-10
1+14.2941
25+12.5075
100+11.0779
500+9.29118
1000+8.93382
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 40POS TINBulk55ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
32-6554-11
32-6554-11
1+14.7059
25+13.7255
100+12.7451
500+12.2549
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 32POS GLDBulk55ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold-Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
32-6554-10
32-6554-10
1+11.9804
25+10.4827
100+9.2848
500+7.78725
1000+7.48774
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 32POS TINBulk55ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
28-6554-11
28-6554-11
1+15.0294
25+13.751
100+12.3804
500+11.275
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 28POS GLDBulk55ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold-Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
28-6554-10
28-6554-10
1+10.7451
25+9.40196
100+8.32745
500+6.98431
1000+6.71569
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 28POS TINBulk55ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
24-6554-11
24-6554-11
1+13.8627
25+12.6839
100+11.4196
500+10.4
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 24POS GLDBulk55ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold-Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
24-6554-10
24-6554-10
1+10.8235
25+9.41177
100+7.52941
500+6.35294
1000+6
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 24POS TINBulk55ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
110-13-320-41-001000
110-13-320-41-001000
1+2.96078
10+2.44706
50+2.03922
100+1.83529
250+1.69255
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 20POS GOLDTube110ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
4600
4600
1+2.28431
10+1.48431
50+1.33294
100+1.27235
250+1.15118
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 (Oval)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
4606
4606
1+2.08824
10+1.41275
50+1.26824
100+1.21059
250+1.09529
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 (Rectangular)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
4601
4601
1+2.70588
10+1.6598
50+1.49039
100+1.42265
250+1.28718
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 (Oval)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
117-93-428-41-005000
117-93-428-41-005000
1+4.7451
10+3.92745
50+3.27255
100+2.94529
250+2.71624
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 28POS GOLDTube117ActiveDIP, 0.4" (10.16mm) Row Spacing28 (2 x 14)0.070" (1.78mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
44-547-11
44-547-11
1+151.029
25+141.949
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN SOCKET SOIC ZIF 44POS GOLDBulk547ActiveSOIC, ZIF (ZIP)44 (2 x 22)-Gold20µin (0.51µm)Beryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)Gold20µin (0.51µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-