ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
16-3518-10
16-3518-10
1+1.72549
25+1.32353
100+1.05882
500+0.847059
1000+0.767647
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 16POS GOLDBulk518ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
14-3518-10
14-3518-10
1+1.52941
25+1.10549
100+0.904412
500+0.723529
1000+0.643137
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 14POS GOLDBulk518ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
08-3518-10
08-3518-10
1+1.17647
25+0.705882
100+0.552941
500+0.447059
1000+0.4
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 8POS GOLDBulk518ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
510-93-145-15-081001
510-93-145-15-081001
50+17.7367
100+13.5745
250+9.66078
Increments of 50
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN SOCKET PGA 145POS GOLDBulk510ActivePGA145 (15 x 15)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)--Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
28-526-10
28-526-10
1+10.2647
25+8.92157
100+7.13726
500+6.02206
1000+5.6875
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 28POS TINBulkLo-PRO®file, 526ActiveDIP, ZIF (ZIP)28 (2 x 14)0.100" (2.54mm)Tin10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin10µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
110-93-328-41-001000
110-93-328-41-001000
1+2.85294
10+2.37157
50+1.97647
100+1.75686
250+1.53725
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 28POS GOLDTube110ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
24-6823-90
24-6823-90
9+11.6078
Increments of 9
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 24POS GOLDBulkVertisockets™ 800ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
28-516-10
28-516-10
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 28POS TINBulk516ObsoleteDIP, ZIF (ZIP)28 (2 x 14)0.100" (2.54mm)Tin10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin10µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-
16-C280-10
16-C280-10
1+4.71569
25+3.66196
100+2.92941
500+2.44118
1000+2.16451
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 16POS GOLDBulkEJECT-A-DIP™ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
BU640Z-178-HT
BU640Z-178-HT
54+5.56464
Increments of 54
Leadtime
2-3 weeks		On Shore Technology Inc.CONN IC DIP SOCKET 64POS GOLDTubeBU-178HTActiveDIP, 0.6" (15.24mm) Row Spacing64 (2 x 32)0.100" (2.54mm)Gold78.7µin (2.00µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)CopperFlashBrassPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
BU480Z-178-HT
BU480Z-178-HT
56+6.83928
Increments of 56
Leadtime
2-3 weeks		On Shore Technology Inc.CONN IC DIP SOCKET 48POS GOLDTubeBU-178HTActiveDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Gold78.7µin (2.00µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)CopperFlashBrassPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
BU400Z-178-HT
BU400Z-178-HT
1+6.84314
10+6.56176
50+5.70588
100+5.42059
250+4.85
Increments of 1
Leadtime
2-3 weeks		On Shore Technology Inc.CONN IC DIP SOCKET 40POS GOLDTubeBU-178HTActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold78.7µin (2.00µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)CopperFlashBrassPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
BU280Z-178-HT
BU280Z-178-HT
56+2.83701
Increments of 56
Leadtime
2-3 weeks		On Shore Technology Inc.CONN IC DIP SOCKET 28POS GOLDTubeBU-178HTActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold78.7µin (2.00µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)CopperFlashBrassPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
BU240Z-178-HT
BU240Z-178-HT
1+2.90196
10+2.78627
50+2.43765
100+2.32157
250+2.03137
Increments of 1
Leadtime
2-3 weeks		On Shore Technology Inc.CONN IC DIP SOCKET 24POS GOLDTubeBU-178HTActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold78.7µin (2.00µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)CopperFlashBrassPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
BU220Z-178-HT
BU220Z-178-HT
810+2.03324
Increments of 810
Leadtime
2-3 weeks		On Shore Technology Inc.CONN IC DIP SOCKET 22POS GOLDTubeBU-178HTActiveDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold78.7µin (2.00µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)CopperFlashBrassPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
BU200Z-178-HT
BU200Z-178-HT
1+3.14706
10+3.02157
50+2.64353
100+2.51765
250+2.20294
Increments of 1
Leadtime
2-3 weeks		On Shore Technology Inc.CONN IC DIP SOCKET 20POS GOLDTubeBU-178HTActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold78.7µin (2.00µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)CopperFlashBrassPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
BU180Z-178-HT
BU180Z-178-HT
1+2.4902
10+2.26275
50+2.03176
100+1.93941
250+1.75471
Increments of 1
Leadtime
2-3 weeks		On Shore Technology Inc.CONN IC DIP SOCKET 18POS GOLDTubeBU-178HTActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold78.7µin (2.00µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)CopperFlashBrassPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
BU160Z-178-HT
BU160Z-178-HT
1+2.32353
25+1.97765
50+1.89157
100+1.80559
250+1.63365
Increments of 1
Leadtime
2-3 weeks		On Shore Technology Inc.CONN IC DIP SOCKET 16POS GOLDTubeBU-178HTActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold78.7µin (2.00µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)CopperFlashBrassPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
BU140Z-178-HT
BU140Z-178-HT
1+2.22549
10+2.01569
50+1.80961
100+1.72735
250+1.56286
Increments of 1
Leadtime
2-3 weeks		On Shore Technology Inc.CONN IC DIP SOCKET 14POS GOLDTubeBU-178HTActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold78.7µin (2.00µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)CopperFlashBrassPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
BU080Z-178-HT
BU080Z-178-HT
1+2.10784
10+1.91667
50+1.72118
100+1.64294
250+1.48647
Increments of 1
Leadtime
2-3 weeks		On Shore Technology Inc.CONN IC DIP SOCKET 8POS GOLDTubeBU-178HTActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold78.7µin (2.00µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)CopperFlashBrassPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
BU060Z-178-HT
BU060Z-178-HT
1+1.09804
10+0.962745
50+0.868235
100+0.830392
250+0.754902
Increments of 1
Leadtime
2-3 weeks		On Shore Technology Inc.CONN IC DIP SOCKET 6POS GOLDTubeBU-178HTActiveDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold78.7µin (2.00µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)CopperFlashBrassPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
123-93-640-41-801000
123-93-640-41-801000
100+7.66186
Increments of 100
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 40POS GOLDTube123ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorWire Wrap0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
123-93-628-41-801000
123-93-628-41-801000
168+5.30835
Increments of 168
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 28POS GOLDTube123ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorWire Wrap0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
123-93-624-41-801000
123-93-624-41-801000
176+4.85668
Increments of 176
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 24POS GOLDTube123ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorWire Wrap0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
123-93-320-41-801000
123-93-320-41-801000
1+15.598
10+14.6775
50+13.3016
100+12.8429
250+11.9256
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 20POS GOLDTube123ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorWire Wrap0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C