ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
117-93-448-41-005000
117-93-448-41-005000
1+6.59804
10+5.58235
50+4.82078
100+4.31333
250+3.80588
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 48POS GOLDTube117ActiveDIP, 0.4" (10.16mm) Row Spacing48 (2 x 24)0.070" (1.78mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-13-324-41-001000
110-13-324-41-001000
1+3.54902
10+2.93627
50+2.44706
100+2.20235
250+2.03106
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 24POS GOLDTube110ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
117-93-620-41-005000
117-93-620-41-005000
420+1.94155
Increments of 420
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 20POS GOLDTube117ActiveDIP, 0.6" (15.24mm) Row Spacing20 (2 x 10)0.070" (1.78mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
117-93-640-41-005000
117-93-640-41-005000
238+3.84001
Increments of 238
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 40POS GOLDTube117ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.070" (1.78mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
117-93-652-41-005000
117-93-652-41-005000
187+4.65497
Increments of 187
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 52POS GOLDTube117ActiveDIP, 0.6" (15.24mm) Row Spacing52 (2 x 26)0.070" (1.78mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
117-93-656-41-005000
117-93-656-41-005000
1+7.63725
10+6.46667
50+5.58451
100+4.99667
250+4.40882
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 56POS GOLDTube117ActiveDIP, 0.6" (15.24mm) Row Spacing56 (2 x 28)0.070" (1.78mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
214-99-308-01-670800
214-99-308-01-670800
1+0.941176
10+0.731373
25+0.681961
50+0.620196
100+0.558137
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 8POS TIN-LEADTube214ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Tin-Lead100µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
214-99-314-01-670800
214-99-314-01-670800
1+1.64706
10+1.27549
50+1.08098
100+0.972843
250+0.82149
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 14POS TINLEADTube214ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Tin-Lead100µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
214-99-632-01-670800
214-99-632-01-670800
1+3.07843
10+2.5598
50+2.13314
100+1.89608
250+1.65906
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 32POS TINLEADTube214ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Tin-Lead100µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
214-99-320-01-670800
214-99-320-01-670800
1+2.31373
10+1.91961
50+1.59922
100+1.42157
250+1.24388
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 20POS TINLEADTube214ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Tin-Lead100µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
214-99-628-01-670800
214-99-628-01-670800
1+2.69608
10+2.24216
50+1.86843
100+1.66078
250+1.45318
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 28POS TINLEADTube214ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin-Lead100µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
214-99-318-01-670800
214-99-318-01-670800
1+1.81373
10+1.50392
50+1.25294
100+1.11373
250+0.97451
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 18POS TINLEADTube214ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Tin-Lead100µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
24-526-10
24-526-10
1+9.4902
25+8.2549
100+6.60392
500+5.57206
1000+5.2625
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 24POS TINBulkLo-PRO®file, 526ActiveDIP, ZIF (ZIP)24 (2 x 12)0.100" (2.54mm)Tin10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin10µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
64-9518-10
64-9518-10
17+6.53518
Increments of 17
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 64POS GOLDBulk518ActiveDIP, 0.9" (22.86mm) Row Spacing64 (2 x 32)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
50-9518-10
50-9518-10
22+5.57665
Increments of 22
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 50POS GOLDBulk518ActiveDIP, 0.9" (22.86mm) Row Spacing50 (2 x 25)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
48-6518-10
48-6518-10
1+4.51961
25+3.50745
100+2.80588
500+2.33824
1000+2.07324
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 48POS GOLDBulk518ActiveDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
40-6518-10
40-6518-10
1+3.5
25+2.71333
100+2.17059
500+1.80882
1000+1.60382
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 40POS GOLDBulk518ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
32-6518-10
32-6518-10
1+3.0098
25+2.33843
100+1.87059
500+1.55882
1000+1.38216
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 32POS GOLDBulk518ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
28-6518-10
28-6518-10
1+2.96078
25+2.27961
100+1.82353
500+1.45882
1000+1.32206
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 28POS GOLDBulk518ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
24-6518-10
24-6518-10
1+2.4902
25+1.91176
100+1.52941
500+1.22353
1000+1.10882
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 24POS GOLDBulk518ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
24-4518-10
24-4518-10
1+3.38235
25+2.6251
100+2.1
500+1.75
1000+1.55167
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 24POS GOLDBulk518ActiveDIP, 0.4" (10.16mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
22-4518-10
22-4518-10
1+2.96078
25+2.29412
100+1.83529
500+1.52941
1000+1.35608
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 22POS GOLDBulk518ActiveDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
24-3518-10
24-3518-10
1+2.39216
25+1.83843
100+1.47059
500+1.17647
1000+1.06618
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 24POS GOLDBulk518ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
20-3518-10
20-3518-10
1+1.91176
25+1.47059
100+1.17647
500+0.941176
1000+0.852941
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 20POS GOLDBulk518ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
18-3518-10
18-3518-10
1+2.13725
25+1.64235
100+1.31373
500+1.05098
1000+0.952451
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 18POS GOLDBulk518ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-