ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
916715-1
916715-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 321POS GOLDTray-ObsoletePGA, ZIF (ZIP)321 (19 x 19)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeLiquid Crystal Polymer (LCP)-
916657-1
916657-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 321POS GOLDTray-ObsoletePGA, ZIF (ZIP)321 (19 x 19)0.100" (2.54mm)Gold30µin (0.76µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Phosphor BronzeLiquid Crystal Polymer (LCP)-
916657-2
916657-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 321POS GOLDTray-ObsoletePGA, ZIF (ZIP)321 (19 x 19)0.100" (2.54mm)Gold30µin (0.76µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Phosphor BronzeLiquid Crystal Polymer (LCP)-
916657-3
916657-3
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 321POS GOLDTray-ObsoletePGA, ZIF (ZIP)321 (19 x 19)0.100" (2.54mm)Gold30µin (0.76µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Phosphor BronzeLiquid Crystal Polymer (LCP)-
916715-2
916715-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 321POS GOLDTray-ObsoletePGA, ZIF (ZIP)321 (19 x 19)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeLiquid Crystal Polymer (LCP)-
916715-3
916715-3
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 321POS GOLDTray-ObsoletePGA, ZIF (ZIP)321 (19 x 19)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeLiquid Crystal Polymer (LCP)-
916716-1
916716-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 321POS GOLDTray-ObsoletePGA, ZIF (ZIP)321 (19 x 19)0.100" (2.54mm)Gold30µin (0.76µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Phosphor BronzeLiquid Crystal Polymer (LCP)-
916716-3
916716-3
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 321POS GOLDTray-ObsoletePGA, ZIF (ZIP)321 (19 x 19)0.100" (2.54mm)Gold30µin (0.76µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Phosphor BronzeLiquid Crystal Polymer (LCP)-
916716-2
916716-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 321POS GOLDTray-ObsoletePGA, ZIF (ZIP)321 (19 x 19)0.100" (2.54mm)Gold30µin (0.76µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Phosphor BronzeLiquid Crystal Polymer (LCP)-
1-916783-5
1-916783-5
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 370POS GOLDTray-ObsoletePGA, ZIF (ZIP)370 (19 x 19)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeLiquid Crystal Polymer (LCP)-
5-916783-2
5-916783-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 370POS GOLDTray-ObsoletePGA, ZIF (ZIP)370 (19 x 19)0.100" (2.54mm)Gold30µin (0.76µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Phosphor BronzeLiquid Crystal Polymer (LCP)-
2-916783-5
2-916783-5
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 370POS GOLDTray-ObsoletePGA, ZIF (ZIP)370 (19 x 19)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeLiquid Crystal Polymer (LCP)-
11-0513-10
11-0513-10
73+1.52203
Increments of 73
Leadtime
2-3 weeks		Aries ElectronicsCONN SOCKET SIP 11POS GOLDBulk0513ActiveSIP11 (1 x 11)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
299-99-210-12-001800
299-99-210-12-001800
136+7.64547
Increments of 136
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 10POS TINLEADTube299ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Tin-Lead100µin (2.54µm)Beryllium CopperThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
08-6810-90C
08-6810-90C
18+6.29793
Increments of 18
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 8POS GOLDBulkVertisockets™ 800ActiveDIP, 0.6" (15.24mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
10-2810-90
10-2810-90
1+8.63726
25+6.97961
100+5.65
500+4.65294
1000+4.32059
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 10POS GOLDBulkVertisockets™ 800ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
08-6810-90
08-6810-90
15+7.37647
Increments of 15
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 8POS GOLDBulkVertisockets™ 800ActiveDIP, 0.6" (15.24mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
40-0518-11
40-0518-11
1+6.02941
25+4.67647
100+3.74118
500+3.11765
1000+2.76431
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN SOCKET SIP 40POS GOLDBulk518ActiveSIP40 (1 x 40)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
40-0518-10
40-0518-10
1+4.14706
25+3.22078
100+2.57647
500+2.14706
1000+1.90373
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN SOCKET SIP 40POS GOLDBulk518ActiveSIP40 (1 x 40)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
48-6574-11
48-6574-11
7+24.5294
Increments of 7
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 48POS GLDBulk57ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
48-6574-10
48-6574-10
7+15.0588
Increments of 7
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 48POS GLDBulk57ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
40-6574-11
40-6574-11
8+20.9853
Increments of 8
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 40POS TINBulk57ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
40-6574-10
40-6574-10
1+14.5294
25+13.2937
100+11.9686
500+10.9
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 40POS TINBulk57ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
32-6574-11
32-6574-11
10+17.1588
Increments of 10
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 32POS TINBulk57ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
32-6574-10
32-6574-10
10+13.3853
Increments of 10
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 32POS TINBulk57ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-