ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
4607
4607
1+2.73529
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 (Rectangular)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
4603
4603
1+2.70588
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 (Oval)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
4602
4602
1+2.70588
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 (Oval)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
4594
4594
1+4.28431
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN SOCKET TRANSIST TO100 10POSBulk-ActiveTransistor, TO-10010 (Round)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
4593
4593
1+3.61765
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN SOCKET TRANSIST TO-100 8POSBulk-ActiveTransistor, TO-1008 (Round)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
4592
4592
1+3.52941
10+2.94118
50+2.57353
100+2.45098
250+2.14463
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN TRANSIST TO-5 8POS TINBulk-ActiveTransistor, TO-58 (Round)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
4591
4591
1+2.34314
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN TRANSIST TO-5 4POS TINBulk-ActiveTransistor, TO-54 (Round)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
4590
4590
1+2.07843
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN TRANSIST TO-5 3POS TINBulk-ActiveTransistor, TO-53 (Round)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
4513
4513
1+4.30392
10+2.61176
50+2.28529
100+2.17647
250+1.90443
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 (Oval)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolybutylene Terephthalate (PBT)-
110-13-210-41-001000
110-13-210-41-001000
80+11.5158
320+3.35417
1040+1.33782
Increments of 80
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 10POS GOLDTube110ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-13-310-41-001000
110-13-310-41-001000
80+11.2945
320+3.17677
1040+1.32917
Increments of 80
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 10POS GOLDTube110ActiveDIP, 0.3" (7.62mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
28-526-11
28-526-11
1+13.3824
25+12.242
100+11.0216
500+10.0375
1000+9.64387
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 28POS GLDBulkLo-PRO®file, 526ActiveDIP, ZIF (ZIP)28 (2 x 14)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
0804MC
0804MC
1+23.3137
10+21.0422
25+20.16
100+18.27
250+17.262
Increments of 1
Leadtime
2-3 weeks		Texas InstrumentsCONN TRANSIST TO-3 8POS GOLDBulk-ActiveTransistor, TO-38 (Oval)-Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder-Tin200µin (5.08µm)BrassPolyester, Glass Filled-55°C ~ 150°C
2-641600-4
2-641600-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 16POS GOLDTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
2-641600-2
2-641600-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 16POS GOLDTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThermoplastic, Glass Filled-55°C ~ 125°C
2-641599-2
2-641599-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 14POS GOLDTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C
2-641296-2
2-641296-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 6POS GOLDTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThermoplastic, Glass Filled-55°C ~ 125°C
2-641268-1
2-641268-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 40POS TINTubeDiplomate DLObsoleteDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C
2-641605-4
2-641605-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 28POS GOLDTubeDiplomate DLObsoleteDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
2-641612-1
2-641612-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 20POS TINTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic-55°C ~ 105°C
2-641605-2
2-641605-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 28POS GOLDTubeDiplomate DLObsoleteDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThermoplastic, Glass Filled-55°C ~ 125°C
2-641610-1
2-641610-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 16POS TIN-Diplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Beryllium Copper--
2-641609-1
2-641609-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 14POS TINTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C
2-641606-2
2-641606-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 40POS GOLDTubeDiplomate DLObsoleteDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThermoplastic, Glass Filled-55°C ~ 125°C
2-641615-1
2-641615-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 28POS TINTubeDiplomate DLObsoleteDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin-Beryllium CopperThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C