ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
AR24-HZL/01-TT
AR24-HZL/01-TT
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN IC DIP SOCKET 24POS GOLDTube-ObsoleteDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
AR20-HZL/01-TT
AR20-HZL/01-TT
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN IC DIP SOCKET 20POS GOLDTube-ObsoleteDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
AR16-HZL/01-TT
AR16-HZL/01-TT
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN IC DIP SOCKET 16POS GOLDTube-ObsoleteDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
AR14-HZL/01-TT
AR14-HZL/01-TT
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN IC DIP SOCKET 14POS GOLDTube-ObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
AR08-HZL/01-TT
AR08-HZL/01-TT
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN IC DIP SOCKET 8POS GOLDTube-ObsoleteDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
AR06-HZL/01-TT
AR06-HZL/01-TT
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN IC DIP SOCKET 6POS GOLDTube-ObsoleteDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
390261-3
390261-3
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 14POS TINLEADTube-ObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Tin-Lead-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead-Phosphor Bronze--40°C ~ 105°C
60-1518-10
60-1518-10
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 60POS GOLDBulk518ObsoleteDIP, 0.2" (5.08mm) Row Spacing60 (2 x 30)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
22-16-4
22-16-4
Leadtime
2-3 weeks		Grayhill Inc.CONN TRANSIST TO-5 4POS GOLDBulk22ObsoleteTransistor, TO-54 (Round)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-Beryllium CopperThermoplastic, Glass Filled-
232-1297-00-3303
232-1297-00-3303
100+11.5147
Increments of 100
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET ZIF 32POS GLDBulkOEMActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold250µin (6.35µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold250µin (6.35µm)Beryllium CopperPolyether Imide (PEI), Glass Filled-55°C ~ 105°C
AW-127A-20-Z
AW-127A-20-Z
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN SOCKET SIP 20POS TIN--ObsoleteSIP20 (1 x 20)0.100" (2.54mm)Tin78.7µin (2.00µm)-Through HoleClosed Frame-------
822473-4
822473-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PLCC 44POS TIN-LEADTube-ObsoletePLCC44 (4 x 11)0.050" (1.27mm)Tin-Lead-Phosphor BronzeThrough HoleClosed FrameSolder0.050" (1.27mm)Tin-Lead-Phosphor BronzeThermoplastic-
10-6810-90TWR
10-6810-90TWR
13+8.27677
Increments of 13
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 10POS TINBulkVertisockets™ 800ActiveDIP, 0.6" (15.24mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
643662-1
643662-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET SIP 30POS TINTubeDiplomate DLObsoleteSIP30 (1 x 30)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C
643654-1
643654-1
400+2.6491
Increments of 400
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET SIP 22POS TINTubeDiplomate DLActiveSIP22 (1 x 22)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C
643649-1
643649-1
480+1.78241
Increments of 480
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET SIP 17POS TINTubeDiplomate DLActiveSIP17 (1 x 17)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C
643648-1
643648-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET SIP 16POS TINTubeDiplomate DLObsoleteSIP16 (1 x 16)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C
643644-1
643644-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET SIP 12POS TINTubeDiplomate DLObsoleteSIP12 (1 x 12)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C
382437-1
382437-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET SIP 3POS TINTrayDiplomate DLObsoleteSIP3 (1 x 3)0.100" (2.54mm)Tin-Phosphor BronzeThrough Hole-Solder0.100" (2.54mm)Tin-Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 105°C
822114-3
822114-3
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PQFP 144POS TIN-LEADTube-ObsoleteQFP144 (4 x 36)0.050" (1.27mm)Tin-Lead200µin (5.08µm)Phosphor BronzeThrough HoleClosed FrameSolder0.050" (1.27mm)Tin-Lead200µin (5.08µm)Phosphor BronzeLiquid Crystal Polymer (LCP)-
10-2823-90C
10-2823-90C
18+6.2549
Increments of 18
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 10POS GOLDBulkVertisockets™ 800ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
4734
4734
1+3.5
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCOVER PWR TRANS .210""ID TO-3--Active---------------
4733
4733
1+3.5
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCOVER PWR TRANS .140""ID TO-66--Active---------------
4732
4732
1+3.31373
10+2.78137
50+2.43353
100+2.31765
250+2.02796
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCOVER PWR TRANS .210""ID TO-3--Active---------------
4609
4609
1+2.73529
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 (Rectangular)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-