ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
8060-1G5
8060-1G5
1+14.1176
10+12.8382
25+12.5176
50+11.5547
100+10.9128
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN TRANSIST TO-5 3POS GOLDBulk8060ActiveTransistor, TO-53 (Round)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-Beryllium CopperPolytetrafluoroethylene (PTFE)-55°C ~ 125°C
A48-LC-TR
A48-LC-TR
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN IC DIP SOCKET 48POS TINTube-ObsoleteDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor BronzePolybutylene Terephthalate (PBT)-55°C ~ 85°C
A28-LC-TR
A28-LC-TR
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN IC DIP SOCKET 28POS TINTube-ObsoleteDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor BronzePolybutylene Terephthalate (PBT)-55°C ~ 85°C
A22-LC-TR
A22-LC-TR
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN IC DIP SOCKET 22POS TINTube-ObsoleteDIP, 0.3" (7.62mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor BronzePolybutylene Terephthalate (PBT)-55°C ~ 85°C
A16-LC-TR
A16-LC-TR
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN IC DIP SOCKET 16POS TINTube-ObsoleteDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor BronzePolybutylene Terephthalate (PBT)-55°C ~ 85°C
216-7224-55-1902
216-7224-55-1902
1+27.5
10+24.8206
25+23.7804
50+22.2941
100+21.551
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET SOIC 16POS GOLDBulkTextool™ActiveSOIC16 (2 x 8)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold30µin (0.76µm)Beryllium CopperPolyethersulfone (PES), Glass Filled-55°C ~ 150°C
216-7383-55-1902
216-7383-55-1902
1+27.5098
10+24.8373
25+23.7961
50+22.3088
100+21.5652
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET SOIC 16POS GOLDBulkTextool™ActiveSOIC16 (2 x 8)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold30µin (0.76µm)Beryllium CopperPolyethersulfone (PES), Glass Filled-55°C ~ 150°C
144-PRS12001-16
144-PRS12001-16
1+85.8137
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN SOCKET PGA ZIF GOLDBulkPRSActivePGA, ZIF (ZIP)-0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Nickel Bronze50µin (1.27µm)Beryllium CopperPolyphenylene Sulfide (PPS)-65°C ~ 200°C
08-4513-10
08-4513-10
1+1.72549
25+1.32353
100+1.05882
500+0.847059
1000+0.767647
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 8POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.4" (10.16mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
14-823-90CV0
14-823-90CV0
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 14POS GOLDBulkVertisockets™ 800ObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
44-547-11E
44-547-11E
1+151.029
25+141.949
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN SOCKET SOIC ZIF 44POS GOLDBulk547ActiveSOIC, ZIF (ZIP)44 (2 x 22)-Gold20µin (0.51µm)Beryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)Gold20µin (0.51µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
40-6554-18
40-6554-18
7+89.7241
Increments of 7
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 40POSBulk55ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Nickel Boron50µin (1.27µm)Beryllium NickelThrough HoleClosed FrameSolder0.100" (2.54mm)Nickel Boron50µin (1.27µm)Beryllium NickelPolyetheretherketone (PEEK), Glass Filled-55°C ~ 250°C
SBU130Z
SBU130Z
200+0.525392
Increments of 200
Leadtime
2-3 weeks		On Shore Technology Inc.CONN SOCKET SIP 13POS GOLDBulkSBUActiveSIP13 (1 x 13)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
16-6810-90T
16-6810-90T
11+9.47059
Increments of 11
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 16POS TINBulkVertisockets™ 800ActiveDIP, 0.6" (15.24mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
18-6810-90T
18-6810-90T
1+10.0392
25+8.78431
100+7.78039
500+6.52549
1000+6.27451
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 18POS TINBulkVertisockets™ 800ActiveDIP, 0.6" (15.24mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
714-93-164-31-007000
714-93-164-31-007000
51+14.8526
102+10.6139
255+7.41973
Increments of 51
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN SOCKET SIP 64POS GOLDBulk714ActiveSIP64 (1 x 64)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
714-93-132-31-018000
714-93-132-31-018000
1+14.5882
10+13.7333
50+12.4459
100+12.0167
250+11.1584
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN SOCKET SIP 32POS GOLDBulk714ActiveSIP32 (1 x 32)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
714-93-120-31-018000
714-93-120-31-018000
50+10.9775
100+7.1749
250+3.86322
Increments of 50
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN SOCKET SIP 20POS GOLDBulk714ActiveSIP20 (1 x 20)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
712-13-120-41-001000
712-13-120-41-001000
50+12.4502
100+8.39127
250+5.12502
Increments of 50
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN SOCKET SIP 20POS GOLDBulk712ActiveSIP20 (1 x 20)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold10µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
614-93-652-31-018000
614-93-652-31-018000
56+13.3915
112+10.23
280+6.64583
Increments of 56
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 52POS GOLDTube614ActiveDIP, 0.6" (15.24mm) Row Spacing52 (2 x 26)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
614-93-650-41-001000
614-93-650-41-001000
56+13.8071
112+10.6631
280+7.02255
Increments of 56
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 50POS GOLDTube614ActiveDIP, 0.6" (15.24mm) Row Spacing50 (2 x 25)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
614-93-650-31-018000
614-93-650-31-018000
56+14.1588
112+10.0127
280+6.45532
Increments of 56
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 50POS GOLDTube614ActiveDIP, 0.6" (15.24mm) Row Spacing50 (2 x 25)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
614-93-642-31-018000
614-93-642-31-018000
54+13.2576
108+9.61302
270+5.69623
Increments of 54
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 42POS GOLDTube614ActiveDIP, 0.6" (15.24mm) Row Spacing42 (2 x 21)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
614-93-636-31-018000
614-93-636-31-018000
55+12.9633
110+8.89126
275+5.37922
Increments of 55
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 36POS GOLDTube614ActiveDIP, 0.6" (15.24mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
614-93-636-31-007000
614-93-636-31-007000
55+13.1239
110+9.04928
275+5.51283
Increments of 55
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 36POS GOLDTube614ActiveDIP, 0.6" (15.24mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C