ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
228-1290-00-0602J
228-1290-00-0602J
1+19.9118
10+17.9775
25+17.2235
50+16.1471
100+15.6088
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET ZIF 28POS GLDBulkTextool™ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing28 (2 x 14)0.070" (1.78mm)Gold30µin (0.76µm)Beryllium CopperConnectorClosed FramePress-Fit0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
242-1289-00-0602J
242-1289-00-0602J
1+34.1863
10+30.8627
25+29.5686
50+27.7206
100+26.7966
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET ZIF 42POS GLDBulkTextool™ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing42 (2 x 21)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperConnectorClosed FramePress-Fit0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
248-1282-00-0602J
248-1282-00-0602J
1+26.7843
10+24.1824
25+23.1686
50+21.7206
100+20.9966
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET ZIF 48POS GLDTubeTextool™ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperConnectorClosed FramePress-Fit0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
242-1281-00-0602J
242-1281-00-0602J
1+20.6176
10+18.6157
25+17.8353
50+16.7206
100+16.1632
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET ZIF 42POS GLDBulkTextool™ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing42 (2 x 21)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperConnectorClosed FramePress-Fit0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
240-3639-00-0602J
240-3639-00-0602J
1+31.0882
10+28.0627
25+26.8863
50+25.2059
100+24.3657
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET ZIF 40POS GLDBulkTextool™ActiveDIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperConnectorClosed FramePress-Fit0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
228-4817-00-0602J
228-4817-00-0602J
1+21.6765
10+19.5657
25+18.7451
50+17.5735
100+16.9877
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET ZIF 28POS GLDBulkTextool™ActiveDIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperConnectorClosed FramePress-Fit0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
224-5248-00-0602J
224-5248-00-0602J
1+22.5098
10+20.3186
25+19.4667
50+18.25
100+17.6417
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET ZIF 24POS GLDBulkTextool™ActiveDIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperConnectorClosed FramePress-Fit0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
2-641266-1
2-641266-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 24POS TINTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Phosphor BronzeThermoplastic-55°C ~ 105°C
1-390262-2
1-390262-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 28POS TINTube-ObsoleteDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin-Phosphor BronzeThrough Hole, Right Angle, VerticalOpen FrameSolder0.100" (2.54mm)Tin-Phosphor Bronze--40°C ~ 105°C
1-390261-4
1-390261-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 16POS TINTube-ObsoleteDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Tin60µin (1.52µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin60µin (1.52µm)Phosphor Bronze--40°C ~ 105°C
1-390261-3
1-390261-3
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 14POS TINTube-ObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Tin60µin (1.52µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin60µin (1.52µm)Phosphor Bronze--40°C ~ 105°C
1-390261-2
1-390261-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 8POS TINTube-ObsoleteDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Tin60µin (1.52µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin60µin (1.52µm)Phosphor Bronze--40°C ~ 105°C
5916716-1
5916716-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 321POS GOLDTray-ObsoletePGA, ZIF (ZIP)321 (19 x 19)0.100" (2.54mm)Gold30µin (0.76µm)Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Copper AlloyThermoplastic-
1-1825108-2
1-1825108-2
1500+1.68148
Increments of 1500
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 28POS GOLDTubeDiplomate DLActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThermoplastic, Glass Filled-55°C ~ 125°C
5-5916783-2
5-5916783-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 370POS GOLDTray-ObsoletePGA, ZIF (ZIP)370 (19 x 19)0.100" (2.54mm)Gold30µin (0.76µm)Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Copper AlloyLiquid Crystal Polymer (LCP)-
1-1825093-4
1-1825093-4
2600+1.08451
Increments of 2600
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 16POS GOLDTubeDiplomate DLActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThermoplastic, Glass Filled-55°C ~ 125°C
AR-64-HZL-TT
AR-64-HZL-TT
7+3.7507
Increments of 7
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN IC DIP SOCKET 64POS TINTube-ActiveDIP, 0.9" (22.86mm) Row Spacing64 (2 x 32)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
AR-08-HZL/01-TT
AR-08-HZL/01-TT
1+0.941176
10+0.82549
25+0.776471
50+0.744118
100+0.711765
Increments of 1
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN IC DIP SOCKET 8POS GOLDTube-ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
A24-LC-7R
A24-LC-7R
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN IC DIP SOCKET 24POS TIN--ObsoleteDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin--Through HoleOpen Frame-------
2-822114-4
2-822114-4
504+20.1065
Increments of 504
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PQFP 160POS TIN-LEADTube-ActiveQFP160 (4 x 40)0.050" (1.27mm)Tin-Lead200µin (5.08µm)Phosphor BronzeThrough HoleClosed FrameSolder0.050" (1.27mm)Tin-Lead200µin (5.08µm)Phosphor BronzeLiquid Crystal Polymer (LCP)-
2-822114-3
2-822114-3
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PQFP 144POS TIN-LEADTube-ObsoleteQFP144 (4 x 36)0.050" (1.27mm)Tin-Lead200µin (5.08µm)Phosphor BronzeThrough HoleClosed FrameSolder0.050" (1.27mm)Tin-Lead200µin (5.08µm)Phosphor BronzeLiquid Crystal Polymer (LCP)-
1-1825376-3
1-1825376-3
1000+3.06579
Increments of 1000
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 40POS GOLDTubeDiplomate DLActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThermoplastic, Glass Filled-55°C ~ 125°C
1825373-2
1825373-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 8POS GOLDTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
1-1825109-3
1-1825109-3
1000+2.72931
Increments of 1000
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 40POS GOLDTubeDiplomate DLActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThermoplastic, Glass Filled-55°C ~ 125°C
1-1825276-2
1-1825276-2
1300+2.57976
Increments of 1300
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 32POS GOLDTubeDiplomate DLActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThermoplastic, Glass Filled-55°C ~ 125°C