ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
200-6325-9UN-1900
200-6325-9UN-1900
1+104.235
10+98.102
25+95.0365
50+88.9049
100+83.9998
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET PGA ZIF 625POS GOLDBulkTextool™ActivePGA, ZIF (ZIP)625 (25 x 25)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolyethersulfone (PES)-55°C ~ 150°C
200-6321-9UN-1900
200-6321-9UN-1900
1+90.6471
10+85.3176
25+82.6514
50+77.3192
100+73.0532
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET PGA ZIF 441POS GOLDBulkTextool™ActivePGA, ZIF (ZIP)441 (21 x 21)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolyethersulfone (PES)-55°C ~ 150°C
200-6319-9UN-1900
200-6319-9UN-1900
1+73.8137
10+69.4745
25+67.3035
50+62.9614
100+59.4875
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET PGA ZIF 361POS GOLDBulkTextool™ActivePGA, ZIF (ZIP)361 (19 x 19)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolyethersulfone (PES)-55°C ~ 150°C
200-6317-9UN-1900
200-6317-9UN-1900
1+54.402
10+51.2
25+49.6
50+46.4
100+43.84
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET PGA ZIF 289POS GOLDBulkTextool™ActivePGA, ZIF (ZIP)289 (17 x 17)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolyethersulfone (PES)-55°C ~ 150°C
200-6315-9UN-1900
200-6315-9UN-1900
1+68.098
10+64.0941
25+62.0914
50+58.0853
100+54.8806
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET PGA ZIF 225POS GOLDBulkTextool™ActivePGA, ZIF (ZIP)225 (15 x 15)0.100" (2.54mm)------0.100" (2.54mm)---Polyethersulfone (PES)-55°C ~ 150°C
200-6313-9UN-1900
200-6313-9UN-1900
1+43.3824
10+40.8314
25+39.5553
50+37.0035
100+34.9619
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET PGA ZIF 169POS GOLDBulkTextool™ActivePGA, ZIF (ZIP)169 (13 x 13)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolyethersulfone (PES)-55°C ~ 150°C
200-6311-9UN-1900
200-6311-9UN-1900
1+43.4608
10+39.2284
25+37.5843
50+35.2353
100+34.0608
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET PGA ZIF 121POS GOLDBulkTextool™ActivePGA, ZIF (ZIP)121 (11 x 11)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolyethersulfone (PES)-55°C ~ 150°C
200-6310-9UN-1900
200-6310-9UN-1900
1+42.3137
10+38.1971
25+36.5961
50+34.3088
100+33.1652
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET PGA ZIF 100POS GOLDBulkTextool™ActivePGA, ZIF (ZIP)100 (10 x 10)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolyethersulfone (PES)-55°C ~ 150°C
236-6225-00-0602
236-6225-00-0602
1+44.8137
10+40.4569
25+38.7608
50+36.3382
100+35.127
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET SIP ZIF 36POS GOLDBulkTextool™ActiveSIP, ZIF (ZIP)36 (1 x 36)0.100" (2.54mm)Gold-Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
232-2601-00-0602
232-2601-00-0602
1+42.8431
10+38.6716
25+37.051
50+34.7353
100+33.5774
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET SIP ZIF 32POS GOLDBulkTextool™ActiveSIP, ZIF (ZIP)32 (1 x 32)0.100" (2.54mm)Gold-Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
224-5809-00-0602
224-5809-00-0602
1+39.1765
10+35.3647
25+33.8824
50+31.7647
100+30.7059
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET SIP ZIF 24POS GOLDBulkTextool™ActiveSIP, ZIF (ZIP)24 (1 x 24)0.100" (2.54mm)Gold-Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
220-2600-00-0602
220-2600-00-0602
1+37.9804
10+34.2843
25+32.8471
50+30.7941
100+29.7676
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET SIP ZIF 20POS GOLDBulkTextool™ActiveSIP, ZIF (ZIP)20 (1 x 20)0.100" (2.54mm)Gold-Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
210-2599-00-0602
210-2599-00-0602
1+33.3529
10+30.1088
25+28.8471
50+27.0441
100+26.1426
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET SIP ZIF 10POS GOLDBulkTextool™ActiveSIP, ZIF (ZIP)10 (1 x 10)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
228-7474-55-1902
228-7474-55-1902
1+38.9804
10+35.1843
25+33.7098
50+31.6029
100+30.5495
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET SOIC 28POS GOLDBulkTextool™ActiveSOIC28 (2 x 14)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold30µin (0.76µm)Beryllium CopperPolyethersulfone (PES), Glass Filled-55°C ~ 150°C
228-7396-55-1902
228-7396-55-1902
1+37.3431
10+33.7108
25+32.298
50+30.2794
100+29.2701
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET SOIC 28POS GOLDBulkTextool™ActiveSOIC28 (2 x 14)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold30µin (0.76µm)Beryllium CopperPolyethersulfone (PES), Glass Filled-55°C ~ 150°C
224-7397-55-1902
224-7397-55-1902
1+33.0098
10+29.798
25+28.549
50+26.7647
100+25.8725
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET SOIC 24POS GOLDBulkTextool™ActiveSOIC24 (2 x 12)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold30µin (0.76µm)Beryllium CopperPolyethersulfone (PES), Glass Filled-55°C ~ 150°C
220-7201-55-1902
220-7201-55-1902
1+31.1765
10+28.1441
25+26.9647
50+25.2794
100+24.4368
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET SOIC 20POS GOLDBulkTextool™ActiveSOIC20 (2 x 10)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold30µin (0.76µm)Beryllium CopperPolyethersulfone (PES), Glass Filled-55°C ~ 150°C
218-7223-55-1902
218-7223-55-1902
1+27.9314
10+25.2137
25+24.1569
50+22.6471
100+21.8922
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET SOIC 18POS GOLDBulkTextool™ActiveSOIC18 (2 x 9)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold30µin (0.76µm)Beryllium CopperPolyethersulfone (PES), Glass Filled-55°C ~ 150°C
214-7390-55-1902
214-7390-55-1902
1+25.1765
10+22.7255
25+21.7725
50+20.4118
100+19.7314
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET SOIC 14POS GOLDBulkTextool™ActiveSOIC14 (2 x 7)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold30µin (0.76µm)Beryllium CopperPolyethersulfone (PES), Glass Filled-55°C ~ 150°C
208-7391-55-1902
208-7391-55-1902
1+24.7059
10+22.299
25+21.3647
50+20.0294
100+19.3618
Increments of 1
Leadtime
2-3 weeks		3MCONN SOCKET SOIC 8POS GOLDBulkTextool™ActiveSOIC8 (2 x 4)-Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder-Gold30µin (0.76µm)Beryllium CopperPolyethersulfone (PES), Glass Filled-55°C ~ 150°C
290-1294-00-3302J
290-1294-00-3302J
1+43.4706
10+40.9098
25+39.6314
50+37.0745
100+35.029
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET ZIF 90POS GLDBulkTextool™ActiveDIP, ZIF (ZIP)90 (2 x 45)0.070" (1.78mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.070" (1.78mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
264-1300-00-0602J
264-1300-00-0602J
1+33.098
10+29.8804
25+28.6275
50+26.8382
100+25.9436
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET ZIF 64POS GLDBulkTextool™ActiveDIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing64 (2 x 32)0.070" (1.78mm)Gold30µin (0.76µm)Beryllium CopperConnectorClosed FramePress-Fit0.070" (1.78mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
256-1292-00-0602J
256-1292-00-0602J
1+34.8235
10+31.4353
25+30.1176
50+28.2353
100+27.2941
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET ZIF 56POS GLDBulkTextool™ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing56 (2 x 28)0.070" (1.78mm)Gold30µin (0.76µm)Beryllium CopperConnectorClosed FramePress-Fit0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
242-1293-00-0602J
242-1293-00-0602J
1+25.3333
10+22.8725
25+21.9137
50+20.5441
100+19.8593
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET ZIF 42POS GLDBulkTextool™ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing42 (2 x 21)0.070" (1.78mm)Gold30µin (0.76µm)Beryllium CopperConnectorClosed FramePress-Fit0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
232-1291-00-0602J
232-1291-00-0602J
1+25.2255
10+22.7745
25+21.8196
50+20.4559
100+19.774
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET ZIF 32POS GLDBulkTextool™ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing32 (2 x 16)0.070" (1.78mm)Gold30µin (0.76µm)Beryllium CopperConnectorClosed FramePress-Fit0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C