ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
4828-3000-CP
4828-3000-CP
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 28POS TINTube4800ObsoleteDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin35µin (0.90µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin35µin (0.90µm)Phosphor BronzePolyester, Glass Filled-25°C ~ 85°C
4824-6000-CP
4824-6000-CP
1+0.754902
10+0.705882
25+0.635294
50+0.564706
100+0.541176
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 24POS TINTube4800ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin35µin (0.90µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin35µin (0.90µm)Phosphor BronzePolyester, Glass Filled-25°C ~ 85°C
4824-3000-CP
4824-3000-CP
1+0.754902
10+0.705882
25+0.635294
50+0.564706
100+0.541176
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 24POS TINTube4800ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin35µin (0.90µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin35µin (0.90µm)Phosphor BronzePolyester, Glass Filled-25°C ~ 85°C
4820-3000-CP
4820-3000-CP
1+0.598039
10+0.558824
25+0.503137
50+0.447059
100+0.428431
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 20POS TINTube4800ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Tin35µin (0.90µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin35µin (0.90µm)Phosphor BronzePolyester, Glass Filled-25°C ~ 85°C
4818-3000-CP
4818-3000-CP
1+0.568627
10+0.529412
25+0.476471
50+0.423529
100+0.405882
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 18POS TINTube4800ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Tin35µin (0.90µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin35µin (0.90µm)Phosphor BronzePolyester, Glass Filled-25°C ~ 85°C
4816-3000-CP
4816-3000-CP
1+0.470588
10+0.441176
25+0.397255
50+0.352941
100+0.338235
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 16POS TINTube4800ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Tin35µin (0.90µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin35µin (0.90µm)Phosphor BronzePolyester, Glass Filled-25°C ~ 85°C
4814-3000-CP
4814-3000-CP
1+0.470588
10+0.441176
25+0.397255
50+0.352941
100+0.338235
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 14POS TINTube4800ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Tin35µin (0.90µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin35µin (0.90µm)Phosphor BronzePolyester, Glass Filled-25°C ~ 85°C
4808-3000-CP
4808-3000-CP
1+0.470588
10+0.441176
25+0.397255
50+0.352941
100+0.338235
Increments of 1
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 8POS TINTube4800ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Tin35µin (0.90µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin35µin (0.90µm)Phosphor BronzePolyester, Glass Filled-25°C ~ 85°C
203-2737-55-1102
203-2737-55-1102
1+35.3726
10+31.9265
25+30.5882
50+28.6765
100+27.7206
Increments of 1
Leadtime
2-3 weeks		3MCONN TRANSIST TO-3/TO-66 3POSBulkTextool™ActiveTransistor, TO-3 and TO-663 (Rectangular)-Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.234" (5.94mm)Gold30µin (0.76µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-55°C ~ 150°C
100-048-000
100-048-000
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 48POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-042-000
100-042-000
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 42POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing42 (2 x 21)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-040-001
100-040-001
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 40POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-040-000
100-040-000
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 40POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-032-001
100-032-001
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 32POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-032-000
100-032-000
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 32POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-028-001
100-028-001
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 28POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-028-000
100-028-000
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 28POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-024-001
100-024-001
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 24POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-024-000
100-024-000
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 24POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-022-000
100-022-000
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 22POS GOLDBulk100ObsoleteDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-020-001
100-020-001
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 20POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-020-000
100-020-000
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 20POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-018-001
100-018-001
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 18POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-018-000
100-018-000
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 18POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-016-001
100-016-001
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 16POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C