ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
1-1437542-9
1-1437542-9
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 16POS GOLD-700ObsoleteDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold20µin (0.51µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold20µin (0.51µm)Beryllium CopperAluminum Alloy-55°C ~ 125°C
1-1437542-1
1-1437542-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 8POS GOLD-700ObsoleteDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold20µin (0.51µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold20µin (0.51µm)Beryllium CopperAluminum Alloy-55°C ~ 125°C
1-1437542-0
1-1437542-0
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 8POS GOLD-700ObsoleteDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold20µin (0.51µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold20µin (0.51µm)Beryllium CopperAluminum Alloy-55°C ~ 125°C
1-1437540-2
1-1437540-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 36POS TINTube800ObsoleteDIP, 0.6" (15.24mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Tin-Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)---Polyester-55°C ~ 105°C
1-1437540-0
1-1437540-0
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 36POS GOLDTube800ObsoleteDIP, 0.6" (15.24mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)---Polyester-55°C ~ 105°C
1-1437537-7
1-1437537-7
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 8POS GOLD-800ObsoleteDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)-----
1-1437537-1
1-1437537-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 8POS GOLDTube800ObsoleteDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloySurface MountOpen FrameSolder0.100" (2.54mm)--BrassThermoplastic-55°C ~ 125°C
508-AG10D-ESL
508-AG10D-ESL
2400+1.09924
Increments of 2400
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 8POS GOLDTube500ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold5µin (0.127µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold5µin (0.13µm)Brass--55°C ~ 125°C
1-1437532-5
1-1437532-5
200+12.9233
Increments of 200
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 24POS GOLD-500ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold--Through HoleClosed FrameWire Wrap0.100" (2.54mm)Tin-Lead----
1-1437508-3
1-1437508-3
400+11.1447
Increments of 400
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN TRANSIST TO-5 8POS GOLDBulk8058ActiveTransistor, TO-58 (Round)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-BrassPolytetrafluoroethylene (PTFE)-55°C ~ 125°C
1-1437504-1
1-1437504-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN TRANSIST TO-5 4POS GOLDBulk8060ObsoleteTransistor, TO-54 (Round)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-Beryllium CopperPolytetrafluoroethylene (PTFE)-55°C ~ 125°C
1-1437504-0
1-1437504-0
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN TRANSIST TO-5 4POS GOLDBulk8060ObsoleteTransistor, TO-54 (Round)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-Beryllium CopperPolytetrafluoroethylene (PTFE)-55°C ~ 125°C
1-1825093-6
1-1825093-6
2100+1.53225
Increments of 2100
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 20POS GOLDTubeDiplomate DLActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThermoplastic, Glass Filled-55°C ~ 125°C
1825375-2
1825375-2
510+1.67901
Increments of 510
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 28POS GOLDTubeDiplomate DLActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
1825375-3
1825375-3
1000+1.94765
Increments of 1000
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 40POS GOLDTubeDiplomate DLActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
42-6554-10
42-6554-10
7+13.1499
Increments of 7
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 42POS TINBulk55ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing42 (2 x 21)0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
508-AG8D
508-AG8D
300+18.644
Increments of 300
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 8POS TIN-LEADTube500ActiveDIP, 0.6" (15.24mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Tin-Lead-Copper AlloyThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin-Lead-Copper Alloy--55°C ~ 125°C
7-1437539-2
7-1437539-2
500+2.28525
Increments of 500
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 24POS TINTube800ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin-Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)---Polyester-55°C ~ 105°C
7-1437532-1
7-1437532-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 36POS GOLDTube500ObsoleteDIP, 0.6" (15.24mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyPolyester-55°C ~ 125°C
643653-3
643653-3
400+2.20137
Increments of 400
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET SIP 21POS TINTubeDiplomate DLActiveSIP21 (1 x 21)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 105°C
532-AG11D-ESL
532-AG11D-ESL
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 32POS GOLDTube500ObsoleteDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold5µin (0.127µm)Copper AlloyThrough HoleClosed FrameSolder0.100" (2.54mm)Gold-Copper AlloyPolyester-55°C ~ 125°C
6-1437536-1
6-1437536-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 28POS TINTube500ObsoleteDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)--Brass--55°C ~ 105°C
382437-3
382437-3
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET SIP 3POS TINTrayDiplomate DLObsoleteSIP3 (1 x 3)0.100" (2.54mm)Tin-Phosphor BronzeThrough Hole-Solder0.100" (2.54mm)Tin-Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 105°C
3-1437538-2
3-1437538-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 40POS TINLEADTube800ObsoleteDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin-Lead-Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)---Polyester-55°C ~ 105°C
524-AG10D-ES
524-AG10D-ES
800+3.93594
Increments of 800
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 24POS GOLDTube500ActiveDIP, 0.4" (10.16mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)--Brass--55°C ~ 125°C