ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
100-018-051
100-018-051
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 18POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-018-050
100-018-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 18POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-016-051
100-016-051
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 16POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-016-050
100-016-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 16POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-014-051
100-014-051
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 14POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-014-050
100-014-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 14POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-010-050
100-010-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 10POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-008-051
100-008-051
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 8POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-008-050
100-008-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 8POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-006-050
100-006-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 6POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
24-6554-16
24-6554-16
1+33.3726
25+31.1431
100+28.9186
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 24POSBulk55ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Nickel Boron50µin (1.27µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Nickel Boron50µin (1.27µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
28-6554-16
28-6554-16
9+36.1765
Increments of 9
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 28POSBulk55ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Nickel Boron50µin (1.27µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Nickel Boron50µin (1.27µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
40-6554-16
40-6554-16
7+44.1134
Increments of 7
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET ZIF 40POSBulk55ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Nickel Boron50µin (1.27µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Nickel Boron50µin (1.27µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
18-6810-90TWR
18-6810-90TWR
10+9.84902
Increments of 10
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 18POS TINBulkVertisockets™ 800ActiveDIP, 0.6" (15.24mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
10-2810-90C
10-2810-90C
1+7.08824
25+5.72353
100+4.63333
500+3.81569
1000+3.54314
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 10POS GOLDBulkVertisockets™ 800ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
MHAS-181-ZMGG-15
MHAS-181-ZMGG-15
500+34.3608
Increments of 500
Leadtime
2-3 weeks		Samtec Inc.CONN SOCKET BGA 181POS GOLDBulkMHAActiveBGA181 (15 x 15)0.100" (2.54mm)Gold--Through HoleOpen FrameSolder0.100" (2.54mm)Gold----
A28-LC-7-TT-R
A28-LC-7-TT-R
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN IC DIP SOCKET 28POS TINTube-ObsoleteDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin60µin (1.52µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin60µin (1.52µm)Phosphor BronzePolybutylene Terephthalate (PBT)-55°C ~ 85°C
A 24-LC/7-T
A 24-LC/7-T
1+0.45098
10+0.423529
25+0.381176
50+0.338824
100+0.324706
Increments of 1
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN IC DIP SOCKET 24POS TINTube-ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin60µin (1.52µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin60µin (1.52µm)Phosphor BronzePolybutylene Terephthalate (PBT)-55°C ~ 85°C
8180-E1
8180-E1
3000+2.68034
Increments of 3000
Leadtime
2-3 weeks		Aavid ThermalloyCONN TRANSIST TO-3 4POS TINBulk8180ActiveTransistor, TO-34 (Oval)-Tin-SteelThrough HoleClosed FrameSolder-Tin-SteelPolyamide (PA), Nylon, Glass Filled-
8114LB603 REV J
8114LB603 REV J
5000+2.88055
Increments of 5000
Leadtime
2-3 weeks		Aavid ThermalloyCONN TRANSIST TO-3 4POS TINBulk8180ActiveTransistor, TO-34 (Oval)-Tin-BrassThrough HoleClosed FrameSolder-Tin-BrassPhenolic-
1674770-6-Cut
1674770-6
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 479POS GOLDCut Tape (CT)-ObsoletePGA, ZIF (ZIP)479 (26 x 26)0.050" (1.27mm)Gold30µin (0.76µm)Copper AlloySurface MountOpen FrameSolder0.050" (1.27mm)Gold30µin (0.76µm)Copper AlloyThermoplastic-
1-1903401-4-Cut
1-1903401-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA 638POS GOLDCut Tape (CT)-ObsoletePGA638 (26 x 26)0.050" (1.27mm)GoldFlashCopper AlloySurface MountOpen FrameSolder0.050" (1.27mm)Gold-Copper AlloyThermoplastic-
1761503-1
1761503-1
2600+13.3824
Increments of 2600
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA 940POS GOLD--ActivePGA940 (30 x 30)0.050" (1.27mm)Gold30µin (0.76µm)-Surface MountClosed Frame-------
1674770-6
1674770-6
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 479POS GOLDTape & Reel (TR)-ObsoletePGA, ZIF (ZIP)479 (26 x 26)0.050" (1.27mm)Gold30µin (0.76µm)Copper AlloySurface MountOpen FrameSolder0.050" (1.27mm)Gold30µin (0.76µm)Copper AlloyThermoplastic-
1735315-4
1735315-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PGA ZIF 939POS GOLDTray-ObsoletePGA, ZIF (ZIP)939 (31 x 31)0.050" (1.27mm)Gold15µin (0.38µm)Copper AlloySurface MountClosed FrameSolder0.050" (1.27mm)Gold15µin (0.38µm)Copper AlloyThermoplastic-