ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
MS06
MS06
1+11.5784
10+10.9333
25+10.2902
50+9.64706
100+9.00392
Increments of 1
Leadtime
2-3 weeks		Apex MicrotechnologyCONN SOCKET SIP 20POS GOLDBulkApex Precision Power®ActiveSIP20 (1 x 20)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyester, Glass Filled-
MS05
MS05
1+52.1961
10+49.1294
25+46.0588
50+42.9882
100+41.4529
Increments of 1
Leadtime
2-3 weeks		Apex MicrotechnologyCONN IC DIP SOCKET 12POS GOLDBulkApex Precision Power®ActiveDIP, 1.2" (30.48mm) Row Spacing12 (2 x 6)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyester, Glass Filled-
MS03
MS03
1+28.5294
10+26.8549
25+25.1765
50+23.498
100+22.6588
Increments of 1
Leadtime
2-3 weeks		Apex MicrotechnologyCONN TRANSIST TO-3 8POS GOLDBulkApex Precision Power®ActiveTransistor, TO-38 (Oval)-Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder-Tin200µin (5.08µm)BrassPolyester, Glass Filled-
ICA-308-SGG
ICA-308-SGG
1+2.11765
Increments of 1
Leadtime
2-3 weeks		Samtec Inc.CONN IC DIP SOCKET 8POS GOLDBulkICAActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)BrassPolyester, Glass Filled-55°C ~ 125°C
20-0511-11
20-0511-11
10+12.7686
Increments of 10
Leadtime
2-3 weeks		Aries ElectronicsCONN SOCKET SIP 20POS GOLDBulk511ActiveSIP20 (1 x 20)0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzeThrough Hole-Solder0.100" (2.54mm)Gold10µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
500-032-050
500-032-050
Leadtime
2-3 weeks		3MCONN SOCKET SIP 32POS GOLD--ObsoleteSIP32 (1 x 32)0.100" (2.54mm)Gold8µin (0.20µm)-Through HoleClosed Frame-0.100" (2.54mm)Gold8µin (0.20µm)---
400-040-050
400-040-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 40POS GOLD-400ObsoleteDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold8µin (0.20µm)-Through HoleOpen Frame-0.100" (2.54mm)Gold8µin (0.20µm)---
400-032-050
400-032-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 32POS GOLD-400ObsoleteDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold8µin (0.20µm)-Through HoleOpen Frame-0.100" (2.54mm)Gold8µin (0.20µm)---
400-028-050
400-028-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 28POS GOLD-400ObsoleteDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold8µin (0.20µm)-Through HoleOpen Frame-0.100" (2.54mm)Gold8µin (0.20µm)---
300-032-050
300-032-050
Leadtime
2-3 weeks		3MCONN SOCKET SIP 32POS GOLD-300ObsoleteSIP32 (1 x 32)0.100" (2.54mm)Gold8µin (0.20µm)-Through HoleClosed Frame-0.100" (2.54mm)Gold8µin (0.20µm)---
130-028-050
130-028-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 28POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
130-024-050
130-024-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 24POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
110-024-050
110-024-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 24POS GOLDBulk100ObsoleteDIP, 0.4" (10.16mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-048-050
100-048-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 48POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-042-050
100-042-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 42POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing42 (2 x 21)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-040-051
100-040-051
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 40POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-040-050
100-040-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 40POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-032-051
100-032-051
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 32POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-032-050
100-032-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 32POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-028-051
100-028-051
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 28POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-028-050
100-028-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 28POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-024-051
100-024-051
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 24POS GOLDBulk100ObsoleteDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-022-050
100-022-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 22POS GOLDBulk100ObsoleteDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-020-051
100-020-051
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 20POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleClosed Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C
100-020-050
100-020-050
Leadtime
2-3 weeks		3MCONN IC DIP SOCKET 20POS GOLDBulk100ObsoleteDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold8µin (0.20µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBrassPolyphenylene Sulfide (PPS), Glass Filled-65°C ~ 125°C