ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
209-PGM17020-10
209-PGM17020-10
1+14.9314
25+13.6596
100+12.298
500+11.2
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN SOCKET PGA GOLDBulkPGMActivePGA-0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
234-3034-01-0602
234-3034-01-0602
10+61.4118
Increments of 10
Leadtime
2-3 weeks		3MCONN ZIG-ZAG ZIF 34POS GOLDBulkTextool™ActiveZig-Zag, ZIF (ZIP)34 (1 x 34)0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
XR2H-1611-N
XR2H-1611-N
30+2.25
Increments of 30
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN ZIG-ZAG 16POS GOLDBulkXR2ActiveZig-Zag16 (2 x 8)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2E-3204
XR2E-3204
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN SOCKET SIP 32POS GOLDBulkXR2ObsoleteSIP32 (1 x 32)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2C-3205
XR2C-3205
100+4.78049
Increments of 100
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN SOCKET SIP 32POS GOLDBulkXR2ActiveSIP32 (1 x 32)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2C-2011-N
XR2C-2011-N
100+1.9052
Increments of 100
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN SOCKET SIP 20POS GOLDBulkXR2ActiveSIP20 (1 x 20)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2C-2005
XR2C-2005
100+3.44431
Increments of 100
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN SOCKET SIP 20POS GOLDBulkXR2ActiveSIP20 (1 x 20)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2C-2002
XR2C-2002
200+4.67667
Increments of 200
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN SOCKET SIP 20POS GOLDBulkXR2ActiveSIP20 (1 x 20)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2C-1611-N
XR2C-1611-N
200+1.65338
Increments of 200
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN SOCKET SIP 16POS GOLDBulkXR2ActiveSIP16 (1 x 16)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2C-1511-N
XR2C-1511-N
100+1.91402
Increments of 100
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN SOCKET SIP 15POS GOLDBulkXR2ActiveSIP15 (1 x 15)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-4011-N
XR2A-4011-N
12+5.22794
Increments of 12
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 40POS GOLDBulkXR2ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-4001-N
XR2A-4001-N
12+5.64134
Increments of 12
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 40POS GOLDBulkXR2ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-3211-N
XR2A-3211-N
15+4.18105
Increments of 15
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 32POS GOLDBulkXR2ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-3201-N
XR2A-3201-N
15+4.93529
Increments of 15
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 32POS GOLDBulkXR2ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-2815
XR2A-2815
17+6.4977
Increments of 17
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 28POS GOLDBulkXR2ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-2811-N
XR2A-2811-N
17+3.5173
Increments of 17
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 28POS GOLDBulkXR2ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-2801-N
XR2A-2801-N
17+4.26471
Increments of 17
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 28POS GOLDBulkXR2ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-2411-N
XR2A-2411-N
1+3.46078
10+3.31961
25+3.04314
50+2.9049
100+2.76657
Increments of 1
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 24POS GOLDBulkXR2ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-2401-N
XR2A-2401-N
20+3.70882
Increments of 20
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 24POS GOLDBulkXR2ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-2001-N
XR2A-2001-N
24+3.99796
Increments of 24
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 20POS GOLDBulkXR2ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-1801-N
XR2A-1801-N
26+2.11652
Increments of 26
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 18POS GOLDBulkXR2ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-1611-N
XR2A-1611-N
1+2.13725
10+1.9402
25+1.82157
50+1.74216
100+1.66304
Increments of 1
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 16POS GOLDBulkXR2ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-1411-N
XR2A-1411-N
34+1.74192
Increments of 34
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 14POS GOLDBulkXR2ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-1401-N
XR2A-1401-N
1+2.27451
10+2.06176
25+1.93569
50+1.85176
100+1.76755
Increments of 1
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 14POS GOLDBulkXR2ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-0811-N
XR2A-0811-N
60+0.748696
Increments of 60
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 8POS GOLDBulkXR2ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C