ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
116-83-424-41-004101
116-83-424-41-004101
136+3.76442
Increments of 136
Leadtime
2-3 weeks		QR-ZR-7NOCONN IC DIP SOCKET 24POS GOLDTube116ActiveDIP, 0.4 10.16mm Row Spacing24 2 x 12 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
121-PLS13121-12
121-PLS13121-12
2+58.5686
Increments of 2
33JY-03XK-OVCONN SOCKET PGA ZIF GOLDBulkPLSActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
08-2503-31
08-2503-31
17+6.59976
Increments of 17
Leadtime
2-3 weeks		DE-OBD-YQCONN IC DIP SOCKET 8POS GOLDBulk503ActiveDIP, 0.2 5.08mm Row Spacing8 2 x 4 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
126-93-322-41-003000
126-93-322-41-003000
54+13.7565
108+9.66775
270+6.03598
Increments of 54
Leadtime
2-3 weeks		BQ2W-9Z-8WCONN IC DIP SOCKET 22POS GOLDTube126ActiveDIP, 0.3 7.62mm Row Spacing22 2 x 11 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
110-87-310-41-001101
110-87-310-41-001101
1+0.578431
10+0.546078
100+0.418333
500+0.363804
1000+0.300137
Increments of 1
Leadtime
2-3 weeks		LNCY5-PLP5-ABCONN IC DIP SOCKET 10POS GOLDTube110ActiveDIP, 0.3 7.62mm Row Spacing10 2 x 5 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
XY34T FA P5
XY34T FA P5
7+14.4902
Increments of 7
838838-WT7I-BXCONN IC DIP SOCKET 28POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled 55°C ~ 105°C
210715-4
210715-4
110+20.0076
Increments of 110
Leadtime
2-3 weeks		HVEN-8H2-AKPGA 18X18 241-*Active---------------
550-10-192M16-001152
550-10-192M16-001152
22+54.0856
Increments of 22
Leadtime
2-3 weeks		EE-PI-GHBGA SOLDER TAILBulk550ActiveBGA192 16 x 16 0.050 1.27mm Gold10µin 0.25µm BrassThrough HoleClosed FrameSolder0.050 1.27mm Gold10µin 0.25µm BrassFR4 Epoxy Glass-55°C ~ 125°C
20-7420-10
20-7420-10
10+9.25
Increments of 10
Leadtime
2-3 weeks		G8SJY-HTRU-8LMCONN SOCKET SIP 20POS TINBulk700 Elevator Strip-Line™ActiveSIP20 1 x 20 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
110-93-640-41-605000
110-93-640-41-605000
50+4.66863
250+3.26953
500+2.73529
Increments of 50
33R-E1EN-OSCONN IC DIP SOCKET 40POS GOLDTube110ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
400-040-000
400-040-000
44YUVC-GR1X-S6BCONN IC DIP SOCKET 40POS GOLD-400ObsoleteDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold8µin 0.20µm -Through HoleOpen Frame-0.100 2.54mm Gold8µin 0.20µm ---
116-93-420-41-007000
116-93-420-41-007000
60+11.5204
120+7.72238
300+4.32794
Increments of 60
Leadtime
2-3 weeks		F06-5O-FY4CONN IC DIP SOCKET 20POS GOLDTube116ActiveDIP, 0.4 10.16mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
248-5205-01
248-5205-01
1+89
10+83.7647
25+81.1471
50+75.9118
100+71.7235
Increments of 1
Leadtime
2-3 weeks		LF9G2-9ICW-UBCONN SOCKET QFN 48POS GOLDBulkTextool™ActiveQFN48 4 x 12 0.020 0.50mm Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-Beryllium CopperPolyethersulfone PES -
114-83-324-41-134191
114-83-324-41-134191
800+1.4518
Increments of 800
Leadtime
2-3 weeks		IHAAB-5U-RECONN IC DIP SOCKET 24POS GOLDTape & Reel TR 114ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
14-8870-10
14-8870-10
50+3
Increments of 50
Leadtime
2-3 weeks		MIRHK-XHET-YWUCONN IC DIP SOCKET 14POS TINBulk8ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
7-1437539-7
7-1437539-7
Leadtime
2-3 weeks		FRT2-JSNJ-T2BCONN IC DIP SOCKET 24POS GOLDTube800ObsoleteDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Gold5µin 0.127µm Copper AlloyThrough HoleOpen FrameSolder0.100 2.54mm ---Polyester-55°C ~ 105°C
122-83-314-41-001101
122-83-314-41-001101
390+1.31159
Increments of 390
Leadtime
2-3 weeks		XQW-J3-WMCONN IC DIP SOCKET 14POS GOLDTube122ActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
12-0518-11H
12-0518-11H
40+2.82353
Increments of 40
Leadtime
2-3 weeks		Z27HI-K8-U2XCONN SOCKET SIP 12POS GOLDBulk518ActiveSIP12 1 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
24-C300-20
24-C300-20
7+13.6162
Increments of 7
6565DKF-66L-QQCONN IC DIP SOCKET 24POS GOLDBulkEJECT-A-DIP™ActiveDIP, 0.6 15.24mm Row Spacing24 2 x 12 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
299-43-310-11-001000
299-43-310-11-001000
1+4.56863
10+3.78333
50+3.15294
100+2.83765
250+2.61694
Increments of 1
Leadtime
2-3 weeks		HW4O-0U2L-TG7CONN IC DIP SOCKET 10POS GOLDTube299ActiveDIP, 0.3 7.62mm Row Spacing10 2 x 5 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
10-7775-10
10-7775-10
13+8.29714
Increments of 13
Leadtime
2-3 weeks		KEA6L-3XK6-0ADCONN SOCKET SIP 10POS TINBulk700 Elevator Strip-Line™ActiveSIP10 1 x 10 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
8060-1G4
8060-1G4
1+8.27451
10+7.91372
25+7.19451
50+6.8349
100+6.655
Increments of 1
6868-2R-A1PCONN TRANSIST TO-5 4POS GOLDBulk8060ActiveTransistor, TO-54 Round -Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-Beryllium CopperPolytetrafluoroethylene PTFE -55°C ~ 125°C
AR28-HZL-TT
AR28-HZL-TT
Leadtime
2-3 weeks		U4T-5M08-K8XCONN IC DIP SOCKET 28POS TINTube-ObsoleteDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
APA-318-T-K
APA-318-T-K
1+2.57843
Increments of 1
909UN-OCL-FWADAPTOR PLUG-*Active---------------
940-99-020-17-400000
940-99-020-17-400000
Leadtime
2-3 weeks		L3WB1-MY0-VKCONN SOCKET PLCC 20POS TIN-LEADTube940ObsoletePLCC20 4 x 5 0.050 1.27mm Tin-Lead100µin 2.54µm Beryllium CopperSurface MountClosed FrameSolder0.050 1.27mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C