ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
4-1571551-8
4-1571551-8
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 24POS GOLDTube500ObsoleteDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)NickelPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
9-1437535-1
9-1437535-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 14POS GOLDTube500ObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)Copper Alloy--55°C ~ 125°C
4-1571551-4
4-1571551-4
1+2.13725
10+1.93824
50+1.74078
100+1.66176
250+1.50345
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 16POS GOLDTube500ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)NickelPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
4-1437531-1
4-1437531-1
600+7.24279
Increments of 600
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 16POS GOLDTube500ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold-Copper AlloyThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Gold-Copper Alloy--55°C ~ 125°C
1-1437531-8
1-1437531-8
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 14POS GOLDTube500ObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold-Copper AlloyThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Gold-Copper Alloy--55°C ~ 125°C
8058-1G32
8058-1G32
1+15.7941
10+14.6637
25+13.1596
50+12.7835
100+11.2795
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN TRANSIST TO-5 8POS GOLDBulk8058ActiveTransistor, TO-58 (Round)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-BrassPolytetrafluoroethylene (PTFE)-55°C ~ 125°C
1-1437536-3
1-1437536-3
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 18POS GOLD-500ObsoleteDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold--Through HoleClosed Frame-0.100" (2.54mm)-----
2-1571550-8
2-1571550-8
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 24POS GOLDTube500ObsoleteDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
3-1437508-6
3-1437508-6
1+16.2549
10+15.098
25+13.5494
50+13.1622
100+11.6136
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN TRANSIST TO-5 8POS GOLDBulk8058ActiveTransistor, TO-58 (Round)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-BrassPolytetrafluoroethylene (PTFE)-55°C ~ 125°C
5-1571551-2
5-1571551-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 40POS GOLDTube500ObsoleteDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)NickelPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
8058-1G30
8058-1G30
1+15.9608
10+14.8216
25+13.3012
50+12.921
100+11.4009
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN TRANSIST TO-5 4POS GOLDBulk8058ActiveTransistor, TO-54 (Round)-Gold-Beryllium CopperPanel MountClosed FrameSolder-Gold-BrassPolytetrafluoroethylene (PTFE)-55°C ~ 125°C
8058-1G49
8058-1G49
1+15.7941
10+14.6637
25+13.1596
50+12.7835
100+11.2795
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN TRANSIST TO-5 8POS GOLDBulk8058ActiveTransistor, TO-58 (Round)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-BrassPolytetrafluoroethylene (PTFE)-55°C ~ 125°C
1571539-2
1571539-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PLCC 28POS TINBulk-ObsoletePLCC28 (4 x 7)0.100" (2.54mm)Tin180µin (4.57µm)Copper AlloyThrough HoleClosed FrameSolder0.100" (2.54mm)Tin180µin (4.57µm)Copper AlloyPolyphenylene Sulfide (PPS), Glass Filled-55°C ~ 125°C
8060-1G4
8060-1G4
1+8.27451
10+7.91372
25+7.19451
50+6.8349
100+6.655
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN TRANSIST TO-5 4POS GOLDBulk8060ActiveTransistor, TO-54 (Round)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-Beryllium CopperPolytetrafluoroethylene (PTFE)-55°C ~ 125°C
3-1571550-2
3-1571550-2
1+12.5
10+11.3647
50+10.2282
100+9.6599
250+8.80757
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 40POS GOLDTube500ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
3-1437536-8
3-1437536-8
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 24POS GOLDTube500ObsoleteDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)--Brass--55°C ~ 125°C
8060-1G13
8060-1G13
1+7.9902
10+7.66078
25+6.9949
50+6.66196
100+6.32873
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN TRANSIST TO-5 3POS GOLDBulk8060ActiveTransistor, TO-53 (Round)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-Beryllium CopperPolytetrafluoroethylene (PTFE)-55°C ~ 125°C
4-1571552-2
4-1571552-2
1+1.66667
10+1.51078
50+1.35647
100+1.2948
250+1.17153
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 14POS GOLDTube800ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold20µin (0.51µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold20µin (0.51µm)CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 105°C
5-1571551-0
5-1571551-0
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 32POS GOLDTube500ObsoleteDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)NickelPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
2-1571550-3
2-1571550-3
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 14POS GOLDTube500ObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
2-1571550-9
2-1571550-9
1+8.14706
10+7.79412
50+6.73157
100+6.55431
250+5.84576
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 28POS GOLDTube500ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
2-641616-1
2-641616-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 40POS TINTubeDiplomate DLObsoleteDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic-55°C ~ 105°C
2-1571550-2
2-1571550-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 8POS GOLDTube500ObsoleteDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
2-1437537-1
2-1437537-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 14POS GOLDTube800ObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)---Polyester-55°C ~ 105°C
7-1437531-8
7-1437531-8
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 20POS GOLDTube500ObsoleteDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold-Copper AlloyThrough HoleClosed FrameSolder0.100" (2.54mm)Gold-Copper Alloy--55°C ~ 125°C