ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
2-1571550-6
2-1571550-6
960+4.45279
Increments of 960
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 20POS GOLDTube500ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
2-1571550-5
2-1571550-5
2080+3.15905
Increments of 2080
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 18POS GOLDTube500ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
2-1571550-4
2-1571550-4
4800+2.26456
Increments of 4800
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 16POS GOLDTube500ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
2-1571550-1
2-1571550-1
3200+2.01362
Increments of 3200
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 6POS GOLDTube500ActiveDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
528-AG12D-LF
528-AG12D-LF
425+5.88312
Increments of 425
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 28POS TINTube500ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Beryllium CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 105°C
516-AG12D-LF
516-AG12D-LF
4800+10.3861
Increments of 4800
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 16POS TINTube500ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Beryllium CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 105°C
1571550-2
1571550-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 8POS TINTube500ObsoleteDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Beryllium CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 105°C
506-AG12D-LF
506-AG12D-LF
12800+0.899843
Increments of 12800
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 6POS TINTube500ActiveDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Beryllium CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 105°C
2-1571994-0
2-1571994-0
1+6.27451
10+6.00882
50+5.2249
100+4.96373
250+4.44122
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET SIP 20POS GOLDBulk510ActiveSIP20 (1 x 20)0.100" (2.54mm)Gold20µin (0.51µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin20µin (0.51µm)CopperThermoplastic, Polyester-
1-1437540-4
1-1437540-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 40POS GOLDTube800ObsoleteDIP, 0.3" (7.62mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)---Polyester-55°C ~ 105°C
520-AG10D-ES
520-AG10D-ES
3840+2.9768
Increments of 3840
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 20POS GOLDTube500ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)--Brass--55°C ~ 125°C
8058-1G19
8058-1G19
1+21.7451
10+19.6304
25+18.8075
50+17.632
100+17.0442
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN TRANSIST TO-5 8POS GOLDBulk8058ActiveTransistor, TO-58 (Round)-Gold-Beryllium CopperPanel Mount-Solder Cup-Gold-BrassPolytetrafluoroethylene (PTFE)-55°C ~ 125°C
8060-1G7
8060-1G7
400+8.08113
Increments of 400
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN TRANSIST TO-5 3POS GOLDBulk8060ActiveTransistor, TO-53 (Round)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-Beryllium CopperPolytetrafluoroethylene (PTFE)-55°C ~ 125°C
8060-1G12
8060-1G12
1+12.5784
10+11.4353
25+11.1494
50+10.2916
100+9.7198
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN TRANSIST TO-5 4POS GOLDBulk8060ActiveTransistor, TO-54 (Round)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-Beryllium CopperFluoropolymer (FP)-55°C ~ 125°C
822475-2-Cut
822475-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET PLCC 32POS TINCut Tape (CT)-ObsoletePLCC32 (2 x 7, 2 x 9)0.050" (1.27mm)Tin150µin (3.81µm)Phosphor BronzeSurface MountClosed FrameSolder0.050" (1.27mm)Tin150µin (3.81µm)Phosphor BronzePolyphenylene Sulfide (PPS)-
1825094-3
1825094-3
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 14POS GOLDTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
2-641611-1
2-641611-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 18POS TINTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic-55°C ~ 105°C
1825373-4
1825373-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 16POS GOLDTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
643648-3
643648-3
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET SIP 16POS TINTubeDiplomate DLObsoleteSIP16 (1 x 16)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 105°C
4-1571552-5
4-1571552-5
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 18POS GOLDTube800ObsoleteDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold20µin (0.51µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold20µin (0.51µm)CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 105°C
532-AG10D
532-AG10D
1+10.8431
10+9.8598
50+8.87353
100+8.38059
250+7.64114
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 32POS GOLDTube500ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyPolyester-55°C ~ 125°C
7-1437529-6
7-1437529-6
1+8.23529
10+7.8902
50+6.86137
100+6.51833
250+5.83216
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 8POS GOLDTube500ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold-Copper AlloyThrough HoleClosed FrameSolder0.100" (2.54mm)Gold-Copper Alloy--55°C ~ 125°C
6-1437536-3
6-1437536-3
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 32POS GOLDTube500ObsoleteDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)--Brass--55°C ~ 125°C
1-1571994-0
1-1571994-0
1+4.69608
10+4.51177
50+3.94824
100+3.7601
250+3.29012
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET SIP 10POS GOLDBulk510ActiveSIP10 (1 x 10)0.100" (2.54mm)Gold20µin (0.51µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin20µin (0.51µm)CopperThermoplastic, Polyester-
8058-1G23
8058-1G23
1+9
10+8.61176
25+7.82902
50+7.43765
100+7.24196
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN TRANSIST TO-5 3POS GOLDBulk8058ActiveTransistor, TO-53 (Round)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-BrassPolytetrafluoroethylene (PTFE)-55°C ~ 125°C