ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
1571550-7
1571550-7
3080+4.35644
Increments of 3080
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 22POS TINTube500ActiveDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Beryllium CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 105°C
514-AG12D-LF
514-AG12D-LF
1360+3.26433
Increments of 1360
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 14POS TINTube500ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Beryllium CopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 105°C
864-AG10D
864-AG10D
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 64POS GOLDTube800ObsoleteDIP, 0.3" (7.62mm) Row Spacing64 (2 x 32)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)---Polyester-55°C ~ 105°C
832-AG10D-ES
832-AG10D-ES
375+5.06737
Increments of 375
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 32POS GOLDTube800ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)---Polyester-55°C ~ 105°C
8-1437539-9
8-1437539-9
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 28POS GOLDTube800ObsoleteDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)---Polyester-55°C ~ 105°C
824-AG30D-ES
824-AG30D-ES
800+3.79307
Increments of 800
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 24POS GOLDTube800ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)---Polyester-55°C ~ 105°C
832-AG10D
832-AG10D
1500+6.13388
Increments of 1500
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 32POS GOLDTube800ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)---Polyester-55°C ~ 105°C
824-AG10D
824-AG10D
2000+5.66036
Increments of 2000
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 24POS GOLDTube800ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)---Polyester-55°C ~ 105°C
7-1437536-1
7-1437536-1
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 36POS GOLDTube500ObsoleteDIP, 0.6" (15.24mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Gold-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)--Brass--55°C ~ 125°C
1-1437536-4
1-1437536-4
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 18POS GOLDTube500ObsoleteDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold-Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)--Beryllium Copper--55°C ~ 125°C
7-1437532-6
7-1437532-6
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 40POS GOLDTube500ObsoleteDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperPolyester-55°C ~ 125°C
522-AG10D
522-AG10D
1+10.7843
10+10.3147
50+8.90784
100+8.67343
250+7.73576
Increments of 1
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 22POS GOLDTube500ActiveDIP, 0.3" (7.62mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold-Copper AlloyThrough HoleClosed FrameSolder0.100" (2.54mm)Gold-Copper Alloy--55°C ~ 125°C
5-1437529-9
5-1437529-9
Leadtime
2-3 weeks
TE Connectivity AMP Connectors504-AG10D=SOCKET ASSY--Obsolete---------------
641855-1
641855-1
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 24POS TINTubeDiplomate DLObsoleteDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic-55°C ~ 125°C
2-382882-1
2-382882-1
7000+0.202618
Increments of 7000
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 6POS TINTubeDiplomate DLActiveDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C
2-382724-6
2-382724-6
1000+0.83152
Increments of 1000
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 40POS TINTubeDiplomate DLActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C
2-382724-3
2-382724-3
1000+0.670882
Increments of 1000
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 40POS TINTubeDiplomate DLActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 105°C
2-382724-1
2-382724-1
1000+0.756882
Increments of 1000
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 40POS TINTubeDiplomate DLActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C
2-382718-8
2-382718-8
1500+0.586323
Increments of 1500
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 28POS TINTubeDiplomate DLActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 105°C
2-382718-3
2-382718-3
1500+0.469059
Increments of 1500
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 28POS TINTubeDiplomate DLActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 105°C
2-382713-8
2-382713-8
2300+0.501029
Increments of 2300
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 18POS TINTubeDiplomate DLActiveDIP, 0.6" (15.24mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 105°C
2-382713-6
2-382713-6
2300+0.628951
Increments of 2300
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 18POS TINTubeDiplomate DLActiveDIP, 0.6" (15.24mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C
2-382713-3
2-382713-3
2300+0.426412
Increments of 2300
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 18POS TINTubeDiplomate DLActiveDIP, 0.6" (15.24mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 105°C
2-382713-1
2-382713-1
2300+0.479706
Increments of 2300
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 18POS TINTubeDiplomate DLActiveDIP, 0.6" (15.24mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Beryllium CopperThermoplastic, Glass Filled-55°C ~ 105°C
2-382568-5
2-382568-5
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 24POS TINTubeDiplomate DLObsoleteDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 105°C