ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
0479890112
0479890112
Leadtime
2-3 weeks		Molex, LLCCONN SOCKET PGA 989POS GOLDTray47989ObsoletePGA989 (35 x 36)0.039" (1.00mm)Gold15µin (0.38µm)Copper AlloySurface MountOpen FrameSolder0.039" (1.00mm)---Liquid Crystal Polymer (LCP)-
XR2T-2021-N
XR2T-2021-N
24+4.15196
Increments of 24
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 20POS GOLDBulkXR2ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBeryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2T-1621-N
XR2T-1621-N
30+2.66438
Increments of 30
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 16POS GOLDBulkXR2ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen Frame, Seal TapeSolder0.100" (2.54mm)GoldFlashBeryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2E-3201-N
XR2E-3201-N
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN SOCKET SIP 32POS GOLDBulkXR2ObsoleteSIP32 (1 x 32)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleCarrierSolder0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2D-4001-N
XR2D-4001-N
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 40POS GOLDBulkXR2ObsoleteDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleCarrierSolder0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2C-1501-N
XR2C-1501-N
200+1.77549
Increments of 200
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN SOCKET SIP 15POS GOLDBulkXR2ActiveSIP15 (1 x 15)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2C-0311-N
XR2C-0311-N
1000+0.240951
Increments of 1000
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN SOCKET SIP 3POS GOLDBulkXR2ActiveSIP3 (1 x 3)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-3211-NZ
XR2A-3211-NZ
15+3.4098
Increments of 15
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 32POS GOLDBulkXR2ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold25µin (0.63µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-2025
XR2A-2025
24+4.02615
Increments of 24
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 20POS GOLDBulkXR2ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBeryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-1625
XR2A-1625
30+2.63333
Increments of 30
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 16POS GOLDBulkXR2ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBeryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-1425
XR2A-1425
34+2.32583
Increments of 34
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 14POS GOLDBulkXR2ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBeryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2A-0825
XR2A-0825
60+1.32304
Increments of 60
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 8POS GOLDBulkXR2ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashBeryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2D-2401-N
XR2D-2401-N
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC DIP SOCKET 24POS GOLDBulkXR2ObsoleteDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleCarrierSolder0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR3G-6401
XR3G-6401
10+15.4657
Increments of 10
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC SOCKET 64POS--Active---------------
XR2E-3205
XR2E-3205
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN SOCKET SIP 32POS GOLDBulkXR2ObsoleteSIP32 (1 x 32)0.100" (2.54mm)Gold-Beryllium Copper--Solder0.100" (2.54mm)Gold-Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2C-3200-HSG
XR2C-3200-HSG
1000+0.194559
Increments of 1000
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC SOCKET 32POSBulkXR2ActiveHousing32 (1 x 32)0.100" (2.54mm)--Beryllium CopperThrough HoleClosed FrameWire Wrap0.100" (2.54mm)--Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2C-2015
XR2C-2015
100+2.90647
Increments of 100
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN SOCKET SIP 20POS GOLDBulkXR2ActiveSIP20 (1 x 20)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
XR2C-2000-HSG
XR2C-2000-HSG
1000+0.138814
Increments of 1000
Leadtime
2-3 weeks		Omron Electronics Inc-EMC DivCONN IC SOCKET 20POSBulkXR2ActiveHousing20 (1 x 20)0.100" (2.54mm)--Beryllium Copper-Closed FrameSolder0.100" (2.54mm)--Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
68-PRS11033-12
68-PRS11033-12
2+47.4216
Increments of 2
Leadtime
2-3 weeks		Aries ElectronicsCONN SOCKET PGA ZIF GOLDBulkPRSActivePGA, ZIF (ZIP)-0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS)-65°C ~ 125°C
110-43-306-41-001000
110-43-306-41-001000
1+0.960784
10+0.743137
50+0.63
100+0.566961
250+0.478745
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 6POS GOLDTube110ActiveDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-41-640-41-001000
110-41-640-41-001000
1+2.85294
10+2.3598
50+1.96667
100+1.77
250+1.63235
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 40POS GOLDTube110ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-41-632-41-001000
110-41-632-41-001000
1+2.66667
10+2.21863
50+1.84863
100+1.64314
250+1.43776
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 32POS GOLDTube110ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-41-628-41-001000
110-41-628-41-001000
1+2.33333
10+1.93725
50+1.61471
100+1.43529
250+1.25588
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 28POS GOLDTube110ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-41-320-41-001000
110-41-320-41-001000
1+1.66667
10+1.38431
50+1.15373
100+1.02549
250+0.897294
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 20POS GOLDTube110ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-41-318-41-001000
110-41-318-41-001000
1+1.82353
10+1.41765
50+1.20098
100+1.08088
250+0.912745
Increments of 1
Leadtime
2-3 weeks		Mill-Max Manufacturing Corp.CONN IC DIP SOCKET 18POS GOLDTube110ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C