ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
1050281001
1050281001
800+0.833333
1600+0.710784
2400+0.686274
5600+0.651961
8000+0.637255
Increments of 800
Leadtime
2-3 weeks		Molex, LLCCONN CAM SOCKET 32POS GOLDTape & Reel (TR)105028ActiveCamera Socket32 (4 x 8)0.035" (0.90mm)Gold3µin (0.08µm)Copper AlloySurface MountOpen FrameSolder0.035" (0.90mm)Nickel50µin (1.27µm)Copper AlloyThermoplastic-
0475940001
0475940001
Leadtime
2-3 weeks		Molex, LLCCONN SOCKET LGA 1366POS GOLDTray47594ObsoleteLGA1366 (32 x 41)0.040" (1.01mm)Gold15µin (0.38µm)Copper AlloySurface MountOpen FrameSolder0.040" (1.01mm)---Liquid Crystal Polymer (LCP)-
0475939000
0475939000
Leadtime
2-3 weeks		Molex, LLCCONN SOCKET LGA 1366POS NICKEL-47594ObsoleteLGA1366 (32 x 41)-Nickel3µin (0.08µm)-Surface MountClosed FrameSolder-Nickel3µin (0.08µm)---
1437540-5
1437540-5
Leadtime
2-3 weeks		TE Connectivity Potter & Brumfield RelaysCONN IC DIP SOCKET 32POS TINLEADTube800ObsoleteDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Tin-Lead80µin (2.03µm)Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)---Polyester-55°C ~ 105°C
40-6501-30
40-6501-30
100+5.96078
Increments of 100
Leadtime
2-3 weeks		Aries ElectronicsCONN IC DIP SOCKET 40POS TINBulk501ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
239-5605-02-0602
239-5605-02-0602
20+38.901
Increments of 20
Leadtime
2-3 weeks		3MCONN ZIG-ZAG 39POS GOLDBulk-ActiveZig-Zag39 (1 x 19, 1 x 20)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 150°C
239-5605-01-0602
239-5605-01-0602
20+38.4755
Increments of 20
Leadtime
2-3 weeks		3MCONN ZIG-ZAG 39POS GOLDBulk-ActiveZig-Zag39 (1 x 19, 1 x 20)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 150°C
232-1270-02-0602
232-1270-02-0602
20+34.4971
Increments of 20
Leadtime
2-3 weeks		3MCONN SOCKET PGA ZIF 32POS GOLDBulkTextool™ActivePGA, ZIF (ZIP)32 (2 x 16)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
232-1270-01-0602
232-1270-01-0602
20+34.4971
Increments of 20
Leadtime
2-3 weeks		3MCONN SOCKET PGA ZIF 32POS GOLDBulkTextool™ActivePGA, ZIF (ZIP)32 (2 x 16)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
251-5949-01-0602
251-5949-01-0602
1+81.1176
10+76.3451
25+73.9592
50+69.1878
100+65.3705
Increments of 1
Leadtime
2-3 weeks		3MCONN ZIG-ZAG ZIF 51POS GOLDBulkTextool™ActiveZig-Zag, ZIF (ZIP)51 (1 x 25, 1 x 26)0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
235-3019-02-0602
235-3019-02-0602
10+64.2667
Increments of 10
Leadtime
2-3 weeks		3MCONN ZIG-ZAG ZIF 35POS GOLDBulkTextool™ActiveZig-Zag, ZIF (ZIP)35 (1 x 17, 1 x 18)0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
235-3019-01-0602
235-3019-01-0602
10+64.2667
Increments of 10
Leadtime
2-3 weeks		3MCONN ZIG-ZAG ZIF 35POS GOLDBulkTextool™ActiveZig-Zag, ZIF (ZIP)35 (1 x 17, 1 x 18)0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
234-3034-02-0602
234-3034-02-0602
10+61.4118
Increments of 10
Leadtime
2-3 weeks		3MCONN ZIG-ZAG ZIF 34POS GOLDBulkTextool™ActiveZig-Zag, ZIF (ZIP)34 (2 x 17)0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
4620
4620
1+3.61765
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 (Rectangular)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
4608
4608
1+2.73529
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 (Rectangular)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolyester, Glass Filled-
4516
4516
1+4.34314
10+2.62941
50+2.30078
100+2.19118
250+1.91729
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 (Oval)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolybutylene Terephthalate (PBT)-
4515
4515
1+4.53922
10+2.78725
50+2.43863
100+2.32255
250+2.03224
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 (Oval)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolybutylene Terephthalate (PBT)-
4514
4514
1+4.53922
10+2.75686
50+2.41196
100+2.29706
250+2.00992
Increments of 1
Leadtime
2-3 weeks		Keystone ElectronicsCONN TRANSIST TO-3 3POS TINBulk-ActiveTransistor, TO-33 (Oval)-Tin-BrassChassis MountClosed FrameSolder-Tin-BrassPolybutylene Terephthalate (PBT)-
ICO-640-ZLGT
ICO-640-ZLGT
1+7.27451
Increments of 1
Leadtime
2-3 weeks		Samtec Inc.CONN IC DIP SOCKET 40POS GOLDBulkICOActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolyester, Glass Filled-55°C ~ 125°C
ICO-640-SST
ICO-640-SST
1+4.31373
Increments of 1
Leadtime
2-3 weeks		Samtec Inc.CONN IC DIP SOCKET 40POS GOLDBulkICOActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolyester, Glass Filled-55°C ~ 125°C
ICO-640-SGT
ICO-640-SGT
1+5.2451
Increments of 1
Leadtime
2-3 weeks		Samtec Inc.CONN IC DIP SOCKET 40POS GOLDBulkICOActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolyester, Glass Filled-55°C ~ 125°C
ICO-632-NGT
ICO-632-NGT
1+6.72549
Increments of 1
Leadtime
2-3 weeks		Samtec Inc.CONN IC DIP SOCKET 32POS GOLDBulkICOActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolyester, Glass Filled-55°C ~ 125°C
ICO-628-NGT
ICO-628-NGT
1+5.88235
Increments of 1
Leadtime
2-3 weeks		Samtec Inc.CONN IC DIP SOCKET 28POS GOLDBulkICOActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolyester, Glass Filled-55°C ~ 125°C
ICO-628-MGT
ICO-628-MGT
1+5.19608
Increments of 1
Leadtime
2-3 weeks		Samtec Inc.CONN IC DIP SOCKET 28POS GOLDBulkICOActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolyester, Glass Filled-55°C ~ 125°C
ICO-628-CGT
ICO-628-CGT
1+6.18627
Increments of 1
Leadtime
2-3 weeks		Samtec Inc.CONN IC DIP SOCKET 28POS GOLDBulkICOActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolyester, Glass Filled-55°C ~ 125°C