ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
SA083040
SA083040
1+0.460784
10+0.429412
50+0.343529
100+0.329216
250+0.300588
Increments of 1
Leadtime
2-3 weeks
On Shore Technology Inc.CONN IC DIP SOCKET 8POS GOLDTubeSAActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold80µin (2.03µm)BrassThermoplastic, Polyester, Glass Filled-40°C ~ 105°C
SA083000
SA083000
1+0.460784
10+0.439216
50+0.32
100+0.307451
250+0.276078
Increments of 1
Leadtime
2-3 weeks
On Shore Technology Inc.CONN IC DIP SOCKET 8POS GOLDTubeSAActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassThermoplastic, Polyester, Glass Filled-40°C ~ 105°C
0475960233
0475960233
Leadtime
2-3 weeks
Molex, LLCCONN SOCKET LGA 1155POS GOLDTray47596ObsoleteLGA1155 (40 x 40)0.036" (0.91mm)Gold30µin (0.76µm)Copper AlloySurface MountOpen FrameSolder0.036" (0.91mm)---Thermoplastic-
0475960232
0475960232
Leadtime
2-3 weeks
Molex, LLCCONN SOCKET LGA 1155POS GOLDTray47596ObsoleteLGA1155 (40 x 40)0.036" (0.91mm)Gold15µin (0.38µm)Copper AlloySurface MountOpen FrameSolder0.036" (0.91mm)---Thermoplastic-
0475960132
0475960132
Leadtime
2-3 weeks
Molex, LLCCONN SOCKET LGA 1156POS GOLDTray47596ObsoleteLGA1156 (40 x 40)0.036" (0.91mm)Gold15µin (0.38µm)Copper AlloySurface MountOpen FrameSolder0.036" (0.91mm)---Thermoplastic-
0475943001
0475943001
Leadtime
2-3 weeks
Molex, LLCCONN SOCKET LGA 1356POS GOLDTray47594ObsoleteLGA1356 (32 x 41)0.040" (1.01mm)Gold15µin (0.38µm)-Surface MountOpen Frame-------
0475940002
0475940002
Leadtime
2-3 weeks
Molex, LLCCONN SOCKET LGA 1366POS GOLDTray47594ObsoleteLGA1366 (32 x 41)0.040" (1.01mm)Gold30µin (0.76µm)Copper AlloySurface MountOpen FrameSolder0.040" (1.01mm)---Liquid Crystal Polymer (LCP)-
280-5205-01
280-5205-01
1+110.618
10+104.11
25+100.856
50+94.3496
100+89.144
Increments of 1
Leadtime
2-3 weeks
3MCONN SOCKET QFN 80POS GOLDTrayTextool™ActiveQFN80 (4 x 20)0.020" (0.50mm)Gold-Beryllium CopperThrough HoleOpen FrameSolder0.020" (0.50mm)Gold-Beryllium CopperPolyethersulfone (PES)-
264-5205-01
264-5205-01
1+99.8039
10+93.9294
25+90.9941
50+85.1235
100+80.4271
Increments of 1
Leadtime
2-3 weeks
3MCONN SOCKET QFN 64POS GOLDBulkTextool™ActiveQFN64 (4 x 16)0.020" (0.50mm)Gold-Beryllium CopperThrough HoleOpen FrameSolder0.020" (0.50mm)Gold-Beryllium CopperPolyethersulfone (PES)-
260-5204-01
260-5204-01
20+91.3882
Increments of 20
Leadtime
2-3 weeks
3MCONN SOCKET QFN 60POS GOLDBulkTextool™ActiveQFN60 (4 x 15)0.020" (0.50mm)Gold-Beryllium CopperThrough HoleOpen FrameSolder0.020" (0.50mm)Gold-Beryllium CopperPolyethersulfone (PES)-
248-5205-01
248-5205-01
1+89
10+83.7647
25+81.1471
50+75.9118
100+71.7235
Increments of 1
Leadtime
2-3 weeks
3MCONN SOCKET QFN 48POS GOLDBulkTextool™ActiveQFN48 (4 x 12)0.020" (0.50mm)Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-Beryllium CopperPolyethersulfone (PES)-
248-5205-00
248-5205-00
1+71.9804
10+67.749
25+65.6318
50+61.3976
100+58.0101
Increments of 1
Leadtime
2-3 weeks
3MCONN SOCKET QFN 48POS GOLDBulkTextool™ActiveQFN48 (4 x 12)0.020" (0.50mm)Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-Beryllium CopperPolyethersulfone (PES)-
240-5205-01
240-5205-01
1+83
10+78.1176
25+75.6765
50+70.7941
100+66.8882
Increments of 1
Leadtime
2-3 weeks
3MCONN SOCKET QFN 40POS GOLDBulkTextool™ActiveQFN40 (4 x 10)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-Beryllium CopperPolyethersulfone (PES)-
240-5205-00
240-5205-00
1+67.1176
10+63.1686
25+61.1945
50+57.2467
100+54.0881
Increments of 1
Leadtime
2-3 weeks
3MCONN SOCKET QFN 40POS GOLDBulkTextool™ActiveQFN40 (4 x 10)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-Beryllium CopperPolyethersulfone (PES)-
232-5205-01
232-5205-01
1+78.2549
10+73.6471
25+71.3455
50+66.7427
100+63.0603
Increments of 1
Leadtime
2-3 weeks
3MCONN SOCKET QFN 32POS GOLDBulkTextool™ActiveQFN32 (4 x 8)-Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-Beryllium CopperPolyethersulfone (PES)-
228-5204-01
228-5204-01
1+75.6176
10+71.1686
25+68.9447
50+64.4967
100+60.9381
Increments of 1
Leadtime
2-3 weeks
3MCONN SOCKET QFN 28POS GOLDBulkTextool™ActiveQFN28 (4 x 7)0.020" (0.50mm)Gold-Beryllium CopperThrough Hole-Solder-Gold-Beryllium CopperPolyethersulfone (PES)-
224-5205-01
224-5205-01
1+72.8627
10+68.5804
25+66.4373
50+62.151
100+58.722
Increments of 1
Leadtime
2-3 weeks
3MCONN SOCKET QFN 24POS GOLDBulkTextool™ActiveQFN24 (4 x 6)0.020" (0.50mm)Gold-Beryllium CopperThrough Hole-Solder-Gold-Beryllium CopperPolyethersulfone (PES)-
216-5205-01
216-5205-01
1+69.6373
10+65.5373
25+63.4894
50+59.3931
100+56.1163
Increments of 1
Leadtime
2-3 weeks
3MCONN SOCKET QFN 16POS GOLDBulkTextool™ActiveQFN16 (4 x 4)0.020" (0.50mm)Gold-Beryllium CopperThrough Hole-Solder-Gold-Beryllium CopperPolyethersulfone (PES)-
288-4205-01
288-4205-01
1+126.049
10+118.635
25+114.928
50+107.513
100+101.581
Increments of 1
Leadtime
2-3 weeks
3MCONN SOCKET QFN 88POS GOLDTrayTextool™ActiveQFN88 (4 x 22)0.016" (0.40mm)Gold-Beryllium CopperThrough HoleOpen FrameSolder0.016" (0.40mm)Gold-Beryllium CopperPolyethersulfone (PES)-
260-4204-01
260-4204-01
1+105.618
10+99.4039
25+96.2976
50+90.0849
100+85.1146
Increments of 1
Leadtime
2-3 weeks
3MCONN SOCKET QFN 60POS GOLDBulkTextool™ActiveQFN60 (4 x 15)0.016" (0.40mm)Gold-Beryllium CopperThrough HoleOpen FrameSolder0.016" (0.40mm)Gold-Beryllium CopperPolyethersulfone (PES)-
256-4205-01
256-4205-01
1+102.735
10+96.6902
25+93.6686
50+87.6255
100+82.791
Increments of 1
Leadtime
2-3 weeks
3MCONN SOCKET QFN 56POS GOLDBulkTextool™ActiveQFN56 (4 x 14)0.016" (0.40mm)Gold-Beryllium CopperThrough HoleOpen FrameSolder0.016" (0.40mm)Gold-Beryllium CopperPolyethersulfone (PES)-
248-4205-01
248-4205-01
1+96.8137
10+91.1216
25+88.2741
50+82.579
100+78.0228
Increments of 1
Leadtime
2-3 weeks
3MCONN SOCKET QFN 48POS GOLDBulkTextool™ActiveQFN48 (4 x 12)0.016" (0.40mm)Gold-Beryllium CopperThrough HoleClosed FrameSolder-Gold-Beryllium CopperPolyethersulfone (PES)-
CUSTOM BGA
CUSTOM BGA
Leadtime
2-3 weeks
3MCONN SOCKET BGA CUSTOM-Textool™ActiveBGACustom0.026" ~ 0.050" (0.65mm ~ 1.27mm)CustomCustom-Through HoleCustom-------
1-390262-3-Cut
1-390262-3
Leadtime
2-3 weeks
TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 32POS TINCut Tape (CT)-ObsoleteDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor Bronze--40°C ~ 105°C
1050281001-Cut
1050281001
1+1.46078
10+1.32157
25+1.24039
50+1.18627
100+1.13235
Increments of 1
Leadtime
2-3 weeks
Molex, LLCCONN CAM SOCKET 32POS GOLDCut Tape (CT)105028ActiveCamera Socket32 (4 x 8)0.035" (0.90mm)Gold3µin (0.08µm)Copper AlloySurface MountOpen FrameSolder0.035" (0.90mm)Nickel50µin (1.27µm)Copper AlloyThermoplastic-