ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
D01-9500942
D01-9500942
Leadtime
2-3 weeks		Harwin Inc.CONN SOCKET SIP 9POS GOLDBulkD01-950ObsoleteSIP9 (1 x 9)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevatedSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D01-9500842
D01-9500842
Leadtime
2-3 weeks		Harwin Inc.CONN SOCKET SIP 8POS GOLDBulkD01-950ObsoleteSIP8 (1 x 8)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevatedSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D01-9500742
D01-9500742
Leadtime
2-3 weeks		Harwin Inc.CONN SOCKET SIP 7POS GOLDBulkD01-950ObsoleteSIP7 (1 x 7)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevatedSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D01-9500642
D01-9500642
Leadtime
2-3 weeks		Harwin Inc.CONN SOCKET SIP 6POS GOLDBulkD01-950ObsoleteSIP6 (1 x 6)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevatedSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D01-9500542
D01-9500542
Leadtime
2-3 weeks		Harwin Inc.CONN SOCKET SIP 5POS GOLDBulkD01-950ObsoleteSIP5 (1 x 5)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevatedSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D01-9500442
D01-9500442
Leadtime
2-3 weeks		Harwin Inc.CONN SOCKET SIP 4POS GOLDBulkD01-950ObsoleteSIP4 (1 x 4)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevatedSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
07-0513-10
07-0513-10
1+1.71569
25+1.24039
100+1.01471
500+0.811765
1000+0.721569
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN SOCKET SIP 7POS GOLDBulk0513ActiveSIP7 (1 x 7)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Tin200µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
20-7800-10
20-7800-10
1+10
Increments of 1
Leadtime
2-3 weeks		Aries ElectronicsCONN SOCKET SIP 20POS TINBulk700ActiveSIP20 (1 x 20)0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzeThrough HoleElevatedSolder0.100" (2.54mm)Tin200µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
AR-18-HZL/01-TT
AR-18-HZL/01-TT
1+1.63725
10+1.48431
25+1.39373
50+1.33294
100+1.27235
Increments of 1
Leadtime
2-3 weeks		Assmann WSW ComponentsCONN IC DIP SOCKET 18POS GOLDTube-ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)Beryllium CopperThermoplastic, Polyester-40°C ~ 105°C
251-5949-52-0602
251-5949-52-0602
10+71.7176
Increments of 10
Leadtime
2-3 weeks		3MCONN ZIG-ZAG ZIF 51POS GOLDBulkTextool™ActiveZig-Zag, ZIF (ZIP)51 (1 x 25, 1 x 26)0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
251-5949-51-0602
251-5949-51-0602
10+72.3451
Increments of 10
Leadtime
2-3 weeks		3MCONN ZIG-ZAG ZIF 51POS GOLDBulkTextool™ActiveZig-Zag, ZIF (ZIP)51 (1 x 25, 1 x 26)0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
251-5949-02-0602
251-5949-02-0602
1+81.1176
10+76.3451
25+73.9592
50+69.1878
100+65.3705
Increments of 1
Leadtime
2-3 weeks		3MCONN ZIG-ZAG ZIF 51POS GOLDBulkTextool™ActiveZig-Zag, ZIF (ZIP)51 (1 x 25, 1 x 26)0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
239-5605-52-0602
239-5605-52-0602
20+34.8574
Increments of 20
Leadtime
2-3 weeks		3MCONN SOCKET 39POS ZIP STRIP--Active---------------
239-5605-51-0602
239-5605-51-0602
20+34.4642
Increments of 20
Leadtime
2-3 weeks		3MCONN SOCKET 39POS ZIP STRIP--Active---------------
236-6225-50-0602
236-6225-50-0602
20+40
Increments of 20
Leadtime
2-3 weeks		3MSOCKET ZIP IN-LINE 36POS--Active---------------
235-3019-52-0602
235-3019-52-0602
10+62.7137
Increments of 10
Leadtime
2-3 weeks		3MCONN ZIG-ZAG ZIF 35POS GOLDBulkTextool™ActiveZig-Zag, ZIF (ZIP)35 (1 x 17, 1 x 18)0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
235-3019-51-0602
235-3019-51-0602
10+62.7137
Increments of 10
Leadtime
2-3 weeks		3MCONN ZIG-ZAG ZIF 35POS GOLDBulkTextool™ActiveZig-Zag, ZIF (ZIP)35 (1 x 17, 1 x 18)0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
234-3034-52-0602
234-3034-52-0602
10+60
Increments of 10
Leadtime
2-3 weeks		3MCONN ZIG-ZAG ZIF 34POS GOLDBulkTextool™ActiveZig-Zag, ZIF (ZIP)34 (2 x 17)0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
234-3034-51-0602
234-3034-51-0602
10+60
Increments of 10
Leadtime
2-3 weeks		3MCONN ZIG-ZAG ZIF 34POS GOLDBulkTextool™ActiveZig-Zag, ZIF (ZIP)34 (2 x 17)0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.050" (1.27mm)Gold30µin (0.76µm)Beryllium CopperPolysulfone (PSU), Glass Filled-55°C ~ 125°C
232-2601-50-0602
232-2601-50-0602
20+38.4755
Increments of 20
Leadtime
2-3 weeks		3MIN-LINE ZIP STRIP POCKETS 32 CON--Active---------------
232-1271-00-1102JH
232-1271-00-1102JH
100+11.45
Increments of 100
Leadtime
2-3 weeks		3MOEM LCC SOCKETS 32 POS SOLID LID-OEMActive---------------
232-1270-52-0602
232-1270-52-0602
20+34.5789
Increments of 20
Leadtime
2-3 weeks		3MSTAGGERED ZIP STRIP POCKETS 32 C-Textool™Active---------------
232-1270-51-0602
232-1270-51-0602
20+34.5789
Increments of 20
Leadtime
2-3 weeks		3MSTAGGERED ZIP STRIP POCKETS 32 C-Textool™Active---------------
ICO-316-M-TT
ICO-316-M-TT
1+1.65686
Increments of 1
Leadtime
2-3 weeks		Samtec Inc.CONN IC DIP SOCKET 16POS TINBulkICOActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolyester, Glass Filled-55°C ~ 105°C
ICO-314-M-TT
ICO-314-M-TT
1+1.51961
Increments of 1
Leadtime
2-3 weeks		Samtec Inc.CONN IC DIP SOCKET 14POS TINBulkICOActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolyester, Glass Filled-55°C ~ 105°C