ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
D2616-42
D2616-42
2700+1.33549
Increments of 2700
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 16POS GOLDTubeD26ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FramePress-Fit0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D2614-42
D2614-42
3132+1.05824
Increments of 3132
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 14POS GOLDTubeD26ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FramePress-Fit0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D2608-42
D2608-42
5616+0.719765
Increments of 5616
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 8POS GOLDTubeD26ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FramePress-Fit0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0948-42
D0948-42
224+4.84685
Increments of 224
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 48POS GOLDBulkD0ActiveDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0924-42
D0924-42
816+1.88127
Increments of 816
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 24POS GOLDBulkD0ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0922-42
D0922-42
912+1.87975
Increments of 912
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 22POS GOLDBulkD0ActiveDIP, 0.3" (7.62mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0840-42
D0840-42
840+3.38265
Increments of 840
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 40POS GOLDBulkD0ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0836-42
D0836-42
308+3.62354
Increments of 308
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 36POS GOLDBulkD0ActiveDIP, 0.6" (15.24mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0832-42
D0832-42
364+3.313
Increments of 364
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 32POS GOLDBulkD0ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0828-42
D0828-42
1260+2.40672
Increments of 1260
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 28POS GOLDBulkD0ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0824-42
D0824-42
1428+1.84946
Increments of 1428
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 24POS GOLDBulkD0ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0824-01
D0824-01
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 24POS GOLDBulkD0ObsoleteDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0822-42
D0822-42
798+1.81136
Increments of 798
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 22POS GOLDBulkD0ActiveDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0822-01
D0822-01
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 22POS GOLDBulkD0ObsoleteDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0820-42
D0820-42
1008+1.72578
Increments of 1008
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 20POS GOLDBulkD0ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0820-01
D0820-01
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 20POS GOLDBulkD0ObsoleteDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0818-42
D0818-42
1104+1.7201
Increments of 1104
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 18POS GOLDBulkD0ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0818-01
D0818-01
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 18POS GOLDBulkD0ObsoleteDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0816-42
D0816-42
1+3.06863
10+2.94118
25+2.69608
50+2.57353
100+2.45098
Increments of 1
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 16POS GOLDBulkD0ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0816-01
D0816-01
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 16POS GOLDBulkD0ObsoleteDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0814-42
D0814-42
1440+1.38088
Increments of 1440
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 14POS GOLDBulkD0ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0814-01
D0814-01
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 14POS GOLDBulkD0ObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0808-42
D0808-42
1+1.5098
10+1.36961
25+1.28549
50+1.22941
100+1.17353
Increments of 1
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 8POS GOLDBulkD0ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0808-01
D0808-01
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 8POS GOLDBulkD0ObsoleteDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C
D0806-42
D0806-42
3408+0.668137
Increments of 3408
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 6POS GOLDBulkD0ActiveDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold10µin (0.25µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C