ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
528-AG11D-ES
528-AG11D-ES
1700+1.83868
Increments of 1700
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 28POS GOLDTube500ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Lead-Copper AlloyPolyester-55°C ~ 105°C
508-AG11D-ES
508-AG11D-ES
9600+1.02072
Increments of 9600
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 8POS GOLDTube500ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Lead-Copper AlloyPolyester-55°C ~ 105°C
345725-5
345725-5
3456+2.05015
Increments of 3456
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 22POS TINLEADTube-ActiveDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Tin-Lead-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead----
2-641610-4
2-641610-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 16POS GOLD-Diplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor Bronze--
2-641604-4
2-641604-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 24POS GOLDTubeDiplomate DLObsoleteDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
2-641599-4
2-641599-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 14POS GOLDTubeDiplomate DLObsoleteDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
2-641262-4
2-641262-4
1300+0.70501
Increments of 1300
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 16POS GOLDTubeDiplomate DLActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30µin (0.76µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold30µin (0.76µm)Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
2-382468-4
2-382468-4
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 40POS GOLDTubeDiplomate DLObsoleteDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold15µin (0.38µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead-Phosphor BronzeThermoplastic-55°C ~ 125°C
2-382189-2
2-382189-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 32POS GOLDTubeDiplomate DLObsoleteDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead-Beryllium CopperThermoplastic-
2069189-2
2069189-2
216+46.4322
Increments of 216
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET LGA 1944POS GOLDTray-ActiveLGA1944 (G34)0.039" (1.00mm)Gold30µin (0.76µm)Copper AlloySurface MountOpen FrameSolder0.039" (1.00mm)---Liquid Crystal Polymer (LCP)-
2069189-1
2069189-1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET LGA 1944POS GOLDTray-ObsoleteLGA1944 (G34)0.039" (1.00mm)Gold30µin (0.76µm)Copper AlloySurface MountOpen FrameSolder0.039" (1.00mm)---Liquid Crystal Polymer (LCP)-
528-AG11D
528-AG11D
1700+4.94411
Increments of 1700
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 28POS GOLDTube500ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Lead-Copper AlloyPolyester-55°C ~ 105°C
524-AG11D-ES
524-AG11D-ES
2000+2.79526
Increments of 2000
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 24POS GOLDTube500ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Lead-Copper AlloyPolyester-55°C ~ 105°C
516-AG7D
516-AG7D
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 16POS GOLDTube500ObsoleteDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold-Copper AlloyThrough HoleClosed FrameSolder0.100" (2.54mm)Gold-Copper AlloyPolyester-55°C ~ 125°C
516-AG11D
516-AG11D
4800+2.44863
Increments of 4800
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 16POS GOLDTube500ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Lead-Copper AlloyPolyester-55°C ~ 105°C
5-1437530-2
5-1437530-2
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC SIP SOCKET 8POS GOLDTube500ObsoleteSIP8 (1 x 8)0.100" (2.54mm)Gold-Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Tin-Lead-BrassPolyester-55°C ~ 125°C
506-AG11D-ES
506-AG11D-ES
1600+1.09473
Increments of 1600
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 6POS GOLDTube500ActiveDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Lead-Copper AlloyPolyester-55°C ~ 105°C
506-AG11D
506-AG11D
3200+1.50284
Increments of 3200
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN IC DIP SOCKET 6POS GOLDTube500ActiveDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold25µin (0.63µm)Copper AlloyThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Lead-Copper AlloyPolyester-55°C ~ 105°C
2069965-1
2069965-1
12000+11.802
Increments of 12000
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsSOCKETASSYLGA1155-*Active---------------
1939737-1
1939737-1
200+12.7515
Increments of 200
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET LGA 1366POS--ActiveLGA1366 (32 x 41)-------------
1554653-1
1554653-1
1+23.5784
10+21.2843
50+19.1176
100+18.4804
250+17.4608
Increments of 1
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET LGA 2011POS GOLDTray-ActiveLGA2011 (47 x 58)-Gold15µin (0.38µm)Copper AlloySurface MountOpen FrameSolder-Gold15µin (0.38µm)Copper AlloyThermoplastic-25°C ~ 100°C
1554116-3
1554116-3
200+12.2773
Increments of 200
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET LGA 1356POS GOLDTray-ActiveLGA1356 (32 x 41)0.040" (1.01mm)Gold30µin (0.76µm)Copper AlloySurface MountOpen FrameSolder0.040" (1.01mm)Gold30µin (0.76µm)Copper AlloyThermoplastic-25°C ~ 100°C
1554116-2
1554116-2
200+13.3326
Increments of 200
Leadtime
2-3 weeks		TE Connectivity AMP ConnectorsCONN SOCKET LGA 1356POS GOLDTray-ActiveLGA1356 (32 x 41)0.040" (1.01mm)Gold15µin (0.38µm)Copper AlloySurface MountOpen FrameSolder0.040" (1.01mm)Gold15µin (0.38µm)Copper AlloyThermoplastic-25°C ~ 100°C
SA103000
SA103000
1+0.509804
10+0.473529
50+0.378824
100+0.363039
250+0.33149
Increments of 1
Leadtime
2-3 weeks		On Shore Technology Inc.CONN IC DIP SOCKET 10POS GOLDTubeSAActiveDIP, 0.3" (7.62mm) Row Spacing10 (2 x 5)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200µin (5.08µm)BrassThermoplastic, Polyester, Glass Filled-40°C ~ 105°C
D95B24-42
D95B24-42
714+2.09001
Increments of 714
Leadtime
2-3 weeks		Harwin Inc.CONN IC DIP SOCKET 24POS GOLDTubeD95ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin196.8µin (5.00µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled-55°C ~ 125°C