ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
146-83-628-41-035101
146-83-628-41-035101
168+2.99959
Increments of 168
66J8-DI-P0CONN IC DIP SOCKET 28POS GOLDTube146ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FramePress-Fit0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
116-87-650-41-008101
116-87-650-41-008101
120+4.41365
Increments of 120
Leadtime
2-3 weeks		QWC-WWB-ZCCONN IC DIP SOCKET 50POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing50 2 x 25 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
115-87-420-41-001101
115-87-420-41-001101
620+0.736196
Increments of 620
Leadtime
2-3 weeks		UU-6Y-RR5CONN IC DIP SOCKET 20POS GOLDTube115ActiveDIP, 0.4 10.16mm Row Spacing20 2 x 10 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
117-83-430-41-105101
117-83-430-41-105101
152+3.46317
Increments of 152
88Q-UB-BQCONN IC DIP SOCKET 30POS GOLDTube117ActiveDIP, 0.4 10.16mm Row Spacing30 2 x 15 0.070 1.78mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.070 1.78mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
28-6552-10
28-6552-10
54+8.91848
Increments of 54
88OYRX-ZJS8-2CCONN IC DIP SOCKET ZIF 28POS TINBulk55ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
APA-324-T-P
APA-324-T-P
1+5.34314
Increments of 1
Leadtime
2-3 weeks		XHF6-4TA-UMADAPTOR PLUG-*Active---------------
1109681-308 100 PCS MINIMUM
1109681-308 100 PCS MINIMUM
100+16.7471
Increments of 100
Leadtime
2-3 weeks		J9-47-ZMCONN IC DIP SOCKET 8POS GOLDBulk-ActiveDIP, 0.3 7.62mm Row Spacing8 2 x 4 0.100 2.54mm Gold10µin 0.25µm BrassThrough HoleSpacerSolder0.100 2.54mm Tin-Lead200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
11-0503-31
11-0503-31
15+7.44118
Increments of 15
Leadtime
2-3 weeks		PD3-J9-9MZCONN SOCKET SIP 11POS GOLDBulk0503ActiveSIP11 1 x 11 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA , Nylon, Glass Filled-
2ZR WMUH A6
2ZR WMUH A6
1+7.40196
10+6.87157
100+5.99069
500+5.46212
1000+5.02163
Increments of 1
99WG7X-U91O-S11CONN SOCKET SIP 30POS GOLDBulk714ActiveSIP30 1 x 30 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole Solder0.100 2.54mm Gold30µin 0.76µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester 55°C ~ 125°C
116-83-648-41-003101
116-83-648-41-003101
120+4.2424
Increments of 120
77O-D6ZW-XKCONN IC DIP SOCKET 48POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
123-13-322-41-801000
123-13-322-41-801000
54+14.2941
108+11.2284
270+6.85192
Increments of 54
77UF-BCJP-QFCONN IC DIP SOCKET 22POS GOLDTube123ActiveDIP, 0.3 7.62mm Row Spacing22 2 x 11 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorWire Wrap0.100 2.54mm Gold10µin 0.25µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
1825374-3
1825374-3
3000+0.706422
Increments of 3000
Leadtime
2-3 weeks		YN-ACJ-1ENCONN IC DIP SOCKET 14POS GOLDTubeDiplomate DLActiveDIP, 0.3 7.62mm Row Spacing14 2 x 7 0.100 2.54mm Gold15µin 0.38µm Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Gold15µin 0.38µm Phosphor BronzeThermoplastic, Glass Filled-55°C ~ 125°C
100-022-000
100-022-000
Leadtime
2-3 weeks		QT-0I7-AJCONN IC DIP SOCKET 22POS GOLDBulk100ObsoleteDIP, 0.4 10.16mm Row Spacing22 2 x 11 0.100 2.54mm Gold8µin 0.20µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm GoldFlashBrassPolyphenylene Sulfide PPS , Glass Filled-65°C ~ 125°C
1437522-8
1437522-8
528+47.1059
Increments of 528
Leadtime
2-3 weeks		NVOA-75LH-RD1STAMPED PIN-*Active---------------
40-6575-11
40-6575-11
7+20.986
Increments of 7
Leadtime
2-3 weeks		PQ8R-ON4-CPVCONN IC DIP SOCKET ZIF 40POS TINBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
40-8320-610C
40-8320-610C
5+15.9118
Increments of 5
Leadtime
2-3 weeks		TTB-7W4G-T9CONN IC DIP SOCKET 40POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
36-6511-10
36-6511-10
24+5.20017
Increments of 24
Leadtime
2-3 weeks		QVOLC-YZ-NWCONN IC DIP SOCKET 36POS TINBulk511ActiveDIP, 0.6 15.24mm Row Spacing36 2 x 18 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
ICO-640-SGT
ICO-640-SGT
1+5.2451
Increments of 1
Leadtime
2-3 weeks		0GP-6WHO-MGCONN IC DIP SOCKET 40POS GOLDBulkICOActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolyester, Glass Filled-55°C ~ 125°C
2-644018-4
2-644018-4
Leadtime
2-3 weeks		GNDNO-WG7W-ZDKCONN IC DIP SOCKET 32POS GOLDTubeDiplomate DLObsoleteDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold15µin 0.38µm Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Gold15µin 0.38µm Phosphor BronzeThermoplastic-55°C ~ 125°C
6282-4F1-M9G
6282-4F1-M9G
110+4.55223
Increments of 110
Leadtime
2-3 weeks		IO7-J75S-4ESCONN IC DIP SOCKET 40POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
12-8355-310C
12-8355-310C
15+7.24706
Increments of 15
Leadtime
2-3 weeks		0RI-DSGR-WWCONN IC DIP SOCKET 12POS GOLDBulk8ActiveDIP, 0.3 7.62mm Row Spacing12 2 x 6 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
52-536-11
52-536-11
99MY-ZR3-I82CONN SOCKET PLCC ZIF 52POS GOLD-536ObsoletePLCC, ZIF ZIP 52 4 x 13 0.050 1.27mm Gold12µin 0.30µm -Through HoleOpen Frame-------
APA-320-G-D
APA-320-G-D
1+8.29412
Increments of 1
Leadtime
2-3 weeks		IF5-MS-7U1ADAPTOR PLUG-*Active---------------
A-CCS20-Z-SM
A-CCS20-Z-SM
77T-Q7-LAGCONN SOCKET PLCC 20POS TINTube-ObsoletePLCC20 4 x 5 0.050 1.27mm Tin150µin 3.81µm Phosphor BronzeSurface MountClosed FrameSolder0.050 1.27mm Tin150µin 3.81µm Phosphor BronzePolybutylene Terephthalate PBT , Glass Filled-55°C ~ 105°C
410-87-220-10-001101
410-87-220-10-001101
900+0.665873
Increments of 900
399399E-JDC-GWQCONN ZIG-ZAG 20POS GOLDTube410ActiveZig-Zag, Left Stackable20 2 x 10 0.100 2.54mm GoldFlashBeryllium CopperThrough Hole-Solder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C