ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
110-83-318-41-105191
110-83-318-41-105191
550+1.72039
Increments of 550
Leadtime
2-3 weeks		ZEN-US5A-AE9CONN IC DIP SOCKET 18POS GOLDTape & Reel TR 110ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperSurface MountOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
80-PRL15072-12
80-PRL15072-12
2+52.9265
Increments of 2
5151-YL-PT6CONN SOCKET PGA ZIF GOLDBulkPRLActivePGA, ZIF ZIP -0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS -65°C ~ 125°C
192-PGM17043-10H
192-PGM17043-10H
2+40.3382
Increments of 2
Leadtime
2-3 weeks		LD-1C-W7CONN SOCKET PGA GOLDBulkPGMActivePGA-0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
28-8495-610C
28-8495-610C
7+14.4902
Increments of 7
Leadtime
2-3 weeks		L79B-G50F-65CONN IC DIP SOCKET 28POS GOLDBulk8ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleClosed Frame, ElevatedSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
116-87-324-41-004101
116-87-324-41-004101
170+3.13103
Increments of 170
Leadtime
2-3 weeks		EZ7WT-9U1T-CR8CONN IC DIP SOCKET 24POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
24-3574-10
24-3574-10
12+10.411
Increments of 12
88TDZ-WO-F9CONN IC DIP SOCKET ZIF 24POS TINBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
110-13-628-41-001000
110-13-628-41-001000
1+4.13725
10+3.42549
50+2.8549
100+2.56941
250+2.36957
Increments of 1
Leadtime
2-3 weeks		B19L-BXN8-YOQCONN IC DIP SOCKET 28POS GOLDTube110ActiveDIP, 0.6 15.24mm Row Spacing28 2 x 14 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
31-0518-11
31-0518-11
27+4.16921
Increments of 27
Leadtime
2-3 weeks		0JPZJ-XYR-HTCONN SOCKET SIP 31POS GOLDBulk518ActiveSIP31 1 x 31 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
21-0503-21
21-0503-21
8+12.7647
Increments of 8
Leadtime
2-3 weeks		WVX-HV-J3OCONN SOCKET SIP 21POS GOLDBulk0503ActiveSIP21 1 x 21 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Wire Wrap0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA , Nylon, Glass Filled-
58-1518-00
58-1518-00
10+9.3049
Increments of 10
Leadtime
2-3 weeks		F80J3-U8M-P4CONN IC DIP SOCKET 58POS GOLDBulk518ActiveDIP, 0.2 5.08mm Row Spacing58 2 x 29 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
123-43-632-41-001000
123-43-632-41-001000
204+4.22001
Increments of 204
2828X-7U-P1UCONN IC DIP SOCKET 32POS GOLDTube123ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameWire Wrap0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
40-6501-31
40-6501-31
9+13.8998
Increments of 9
Leadtime
2-3 weeks		FI-38S-ELYCONN IC DIP SOCKET 40POS GOLDBulk501ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
ICA-314-SST
ICA-314-SST
1+1.70588
Increments of 1
Leadtime
2-3 weeks		PJ6W9-CB5-5A6DIP SOCKETS-*Active---------------
TV5 K4 QAG
TV5 K4 QAG
14+7.67927
Increments of 14
Leadtime
2 3 weeks		J8T-2G9-7ZCONN IC DIP SOCKET 30POS GOLDBulkLo PRO®file, 513ActiveDIP, 0.3 7.62mm Row Spacing30 2 x 15 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled
SF-UDR8-C2
SF-UDR8-C2
10+9.99412
Increments of 10
Leadtime
2-3 weeks		IS7A-5C-MOCONN IC DIP SOCKET 30POS GOLDBulkVertisockets™ 800ActiveDIP, 0.3 7.62mm Row Spacing30 2 x 15 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
614-93-320-31-012000
614-93-320-31-012000
1+3.67647
10+3.0451
50+2.53726
100+2.28353
250+2.10592
Increments of 1
Leadtime
2-3 weeks		FQQGI-88P-F3CONN IC DIP SOCKET 20POS GOLDTube614ActiveDIP, 0.3 7.62mm Row Spacing20 2 x 10 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-Lead200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
A-CCS68-G
A-CCS68-G
1+2.90196
10+2.78824
25+2.55608
50+2.4398
100+2.32353
Increments of 1
Leadtime
2-3 weeks		BY36H-2WI-TTMCONN SOCKET PLCC 68POS GOLDTube-ObsoletePLCC68 4 x 17 0.050 1.27mm Gold-Phosphor BronzeThrough HoleClosed FrameSolder0.050 1.27mm Gold-Phosphor BronzePolybutylene Terephthalate PBT , Glass Filled-55°C ~ 105°C
BHFG-3OJ-MT
BHFG-3OJ-MT
110+4.76524
Increments of 110
Leadtime
2-3 weeks		TQP63-DF-QHCONN IC DIP SOCKET 40POS GOLDTube110ActiveDIP, 0.6 15.24mm Row Spacing40 2 x 20 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
24-3570-16
24-3570-16
11+20.3993
Increments of 11
Leadtime
2-3 weeks		HX-52-4U2CONN IC DIP SOCKET ZIF 24POSBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing24 2 x 12 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyphenylene Sulfide PPS , Glass Filled-
110-43-964-41-001000
110-43-964-41-001000
1+5.82353
10+4.81863
50+4.01569
100+3.61412
250+3.33302
Increments of 1
22PK-0UJ-WECONN IC DIP SOCKET 64POS GOLDTube110ActiveDIP, 0.9 22.86mm Row Spacing64 2 x 32 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
24-0511-11
24-0511-11
6+14.933
Increments of 6
Leadtime
2-3 weeks		FOYPW-BI-CUCONN SOCKET SIP 24POS GOLDBulk511ActiveSIP24 1 x 24 0.100 2.54mm Gold10µin 0.25µm Phosphor BronzeThrough Hole-Solder0.100 2.54mm Gold10µin 0.25µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 125°C
8468-21B1-RK-TR-Cut
8468-21B1-RK-TR
3130313-WKJ6-5AZCONN SOCKET PLCC 68POS TINCut Tape CT 84000PLCC68 4 x 17 0.050 1.27mm Tin160µin 4.06µm Copper AlloySurface MountClosed FrameSolder0.050 1.27mm Tin160µin 4.06µm Copper AlloyPolybutylene Terephthalate PBT , Glass Filled-40°C ~ 105°C
346-43-141-41-013000
346-43-141-41-013000
1+7.54902
10+6.75196
100+5.56088
500+4.39571
1000+3.77343
Increments of 1
Leadtime
2-3 weeks		MMV-B5-V9FCONN SOCKET SIP 41POS GOLDBulk346ActiveSIP41 1 x 41 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Press-Fit0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
48-6573-16
48-6573-16
6+38.7059
Increments of 6
9292K6-O5O-A9CONN IC DIP SOCKET ZIF 48POS GLDBulk57ActiveDIP, ZIF ZIP , 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
110-87-632-41-605101
110-87-632-41-605101
372+1.31802
Increments of 372
Leadtime
2-3 weeks		J4QO-NG-SVICONN IC DIP SOCKET 32POS GOLDTube110ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C